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31 条记录 (耗时 0.019 秒)

    Test unit to test a board having an area array package mounted thereon
    11.
    发明授权
    Test unit to test a board having an area array package mounted thereon 失效
    测试单元测试其上安装有面阵列封装的板

    公开(公告)号：US07449907B2

    公开(公告)日：2008-11-11

    申请号：US11316826

    申请日：2005-12-27

    申请人： Se-young Jang ,  Masaharu Tsukue ,  Young-jun Moon

    发明人： Se-young Jang ,  Masaharu Tsukue ,  Young-jun Moon

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0483

    摘要： A test unit to test a board having an area array package mounted therein includes the board, the area array package having an electronic component, a plurality of package pins including a plurality of contact pins connected with the electronic component and a plurality of no-contact pins not connected with the electronic component, and a plurality of contact members respectively provided on the plurality of contact pins and the plurality of no-contact pins to connect the plurality of package pins with the board, a plurality of board contact parts provided on the board and connected with the plurality of contact members to be connected with the plurality of package pins, at least one first connection part provided in the area array package to electrically connect the plurality of no-contact pins with each other in pairs, at least one second connection part provided on the board to electrically connect the plurality of board contact parts with each other in pairs to form a circuit line arranged alternately with the first connection part through the plurality of contact members, and at least one test point provided at opposite ends of the circuit line to measure a resistance between the first and second connection parts. Thus, the test unit can test a connection state of the plurality of contact members without difficulty.

    摘要翻译： 用于测试其中安装有区域阵列封装的板的测试单元包括板，具有电子部件的区域阵列封装，包括与电子部件连接的多个触针的多个封装引脚和多个不接触 分别设置在多个接触销和多个非接触引脚上以将多个封装引脚与该板连接的多个接触构件，设置在电子部件上的多个接触部件， 与所述多个接触构件连接以与所述多个封装销连接;至少一个第一连接部，设置在所述区域阵列封装中，以将所述多个非接触引脚成对地电连接至少一个 第二连接部，设置在所述板上，用于将所述多个板接触部彼此成对地电连接以形成电路线a 通过多个接触构件与第一连接部分交替地摆动，以及设置在电路线的相对端的至少一个测试点，以测量第一和第二连接部分之间的电阻。 因此，测试单元可以毫无困难地测试多个接触构件的连接状态。

    MULTILAYER PRINTED CIRCUIT BOARD
    12.
    发明申请
    MULTILAYER PRINTED CIRCUIT BOARD 有权
    多层印刷电路板

    公开(公告)号：US20080198567A1

    公开(公告)日：2008-08-21

    申请号：US11970051

    申请日：2008-01-07

    申请人： Hark Byeong PARK ,  Byong Su Seol ,  Hyung Geun Kim ,  Hyun Ho Park ,  Jong Sung Lee ,  Hyung Seok Lee ,  Young Jun Moon

    发明人： Hark Byeong PARK ,  Byong Su Seol ,  Hyung Geun Kim ,  Hyun Ho Park ,  Jong Sung Lee ,  Hyung Seok Lee ,  Young Jun Moon

    IPC分类号： H05K1/02 ,  H05K7/00

    CPC分类号： H05K1/0234 ,  H05K1/162 ,  H05K1/167 ,  H05K2201/09309 ,  H05K2201/09336

    摘要： Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.

    摘要翻译： 公开了一种多层印刷电路板。 多层印刷电路板包括用于向设置在电源表面上的每个部件提供电力的电源表面，具有参考电压的接地表面，通过电源表面和/或接地表面的带状线，以便 在部件之间传输信号，安装在电源表面和地表面的截面区域附近的天线以及设置在电源表面和地表之间的电磁波减少部件，以有效地减少由电源表面和地面之间产生的电磁波 带状线。

    Test unit to test a board having an area array package mounted thereon
    15.
    发明申请
    Test unit to test a board having an area array package mounted thereon 失效
    测试单元测试其上安装有面阵列封装的板

    公开(公告)号：US20060139043A1

    公开(公告)日：2006-06-29

    申请号：US11316826

    申请日：2005-12-27

    申请人： Se-young Jang ,  Masaharu Tsukue ,  Young-jun Moon

    发明人： Se-young Jang ,  Masaharu Tsukue ,  Young-jun Moon

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0483

    摘要： A test unit to test a board having an area array package mounted therein includes the board, the area array package having an electronic component, a plurality of package pins including a plurality of contact pins connected with the electronic component and a plurality of no-contact pins not connected with the electronic component, and a plurality of contact members respectively provided on the plurality of contact pins and the plurality of no-contact pins to connect the plurality of package pins with the board, a plurality of board contact parts provided on the board and connected with the plurality of contact members to be connected with the plurality of package pins, at least one first connection part provided in the area array package to electrically connect the plurality of no-contact pins with each other in pairs, at least one second connection part provided on the board to electrically connect the plurality of board contact parts with each other in pairs to form a circuit line arranged alternately with the first connection part through the plurality of contact members, and at least one test point provided at opposite ends of the circuit line to measure a resistance between the first and second connection parts. Thus, the test unit can test a connection state of the plurality of contact members without difficulty.

    摘要翻译： 用于测试其中安装有区域阵列封装的板的测试单元包括板，具有电子部件的区域阵列封装，包括与电子部件连接的多个触针的多个封装引脚和多个不接触 分别设置在多个接触销和多个非接触引脚上以将多个封装引脚与该板连接的多个接触构件，设置在电子部件上的多个接触部件， 与所述多个接触构件连接以与所述多个封装销连接;至少一个第一连接部，设置在所述区域阵列封装中，以将所述多个非接触引脚成对地电连接至少一个 第二连接部，设置在所述板上，用于将所述多个板接触部彼此成对地电连接以形成电路线a 通过多个接触构件与第一连接部分交替地摆动，以及设置在电路线的相对端的至少一个测试点，以测量第一和第二连接部分之间的电阻。 因此，测试单元可以毫无困难地测试多个接触构件的连接状态。

    Molding method of printed circuit board assembly
    16.
    发明授权
    Molding method of printed circuit board assembly 有权
    印刷电路板组装成型方法

    公开(公告)号：US09197026B2

    公开(公告)日：2015-11-24

    申请号：US13211652

    申请日：2011-08-17

    申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

    发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

    IPC分类号： H01R43/00 ,  H05K13/00 ,  H01R43/24

    CPC分类号： H01R43/24 ,  Y10T29/49147

    摘要： Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element.

    摘要翻译： 公开了一种印刷电路板组件PBA，其上安装有用于与外部连接元件电连接的连接器。 这种组件可以用PBA的模制方法形成，其包括将聚合物树脂施加到PBA以模制PBA以便提供刚度。 根据本公开的上述PBA成型方法是包括PCB和连接在PCB上以将其与外部连接元件电连接的连接器的PBA的成型方法。 该方法包括将连接器与连接器盖组合，将树脂施加到与连接器盖结合的PBA上，以执行PBA的成型，以及将连接器盖与模制的PBA分离，以露出用于外部连接元件的电极端子。