公开(公告)号：US20120043116A1

公开(公告)日：2012-02-23

申请号：US13211596

申请日：2011-08-17

申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H01L23/49833 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/19107

摘要： Disclosed herein are printed circuit board assemblies made of a brittle material such as silicon, glass or ceramic and provided with a connector to electrically connect the same to an external connection member, and a method for molding the printed circuit board assembly wherein the printed circuit board assembly is molded by applying a polymer resin thereto to impart hardness to the printed circuit board assembly, and an electrode terminal to connect the same to the external connection member is exposed to the outside. Disclosed herein is also an interconnection structure of an interposer, the interconnection structure electrically connected to a main printed circuit board (PCB) through a solder joint is interposed between the interposer and the solder joint to prevent or reduce concentration of stress on the solder joint caused by differences in coefficients thermal expansion between the interposer and the main PCB.

摘要翻译： 这里公开了由诸如硅，玻璃或陶瓷的脆性材料制成的印刷电路板组件，并且设置有将其与外部连接构件电连接的连接器，以及用于模制印刷电路板组件的方法，其中印刷电路板 通过向其上施加聚合物树脂来模塑组装以赋予印刷电路板组件的硬度，并且将其连接到外部连接构件的电极端子暴露于外部。 这里公开的是内插器的互连结构，通过焊接点电连接到主印刷电路板（PCB）的互连结构插入在插入件和焊点之间，以防止或减少焊点上的应力集中，引起 通过插入器和主PCB之间的系数热膨胀差异。

公开(公告)号：US20120018186A1

公开(公告)日：2012-01-26

申请号：US13177199

申请日：2011-07-06

申请人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

发明人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

IPC分类号： H05K5/02 ,  H01B13/00 ,  B32B37/00

CPC分类号： H05K3/0058 ,  B32B37/1207 ,  B32B37/185 ,  B32B38/145 ,  B32B2037/1223 ,  B32B2038/0092 ,  B32B2309/105 ,  B32B2457/14 ,  H05K2201/0999 ,  H05K2201/10098

摘要： Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

摘要翻译： 这里公开了附着有薄膜式电子电路的电子产品的壳体结构。 壳体结构可以包括电子产品和粘附到壳体上的第一膜的壳体。 壳体结构还可以包括粘附到第一膜的第二膜，使得第二膜的一个表面接触第一膜，以及粘附到第一膜的电子电路层。 电子电路层可以布置在第一膜和第二膜之间，其中第一膜热粘附到壳体上。 第一膜可以具有低于壳体的耐热温度的熔点。

公开(公告)号：US07755181B2

公开(公告)日：2010-07-13

申请号：US11872810

申请日：2007-10-16

申请人： Hyun Joo Han ,  Tae Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

发明人： Hyun Joo Han ,  Tae Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

IPC分类号： H01L23/538

CPC分类号： H05K3/3436 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.

摘要翻译： 一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球 封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到 第一个BGA IC封装。

公开(公告)号：US07486091B2

公开(公告)日：2009-02-03

申请号：US11316930

申请日：2005-12-27

申请人： Tae-sang Park ,  Jung-soon Kim ,  Young-jun Moon ,  Jun-young Lee

发明人： Tae-sang Park ,  Jung-soon Kim ,  Young-jun Moon ,  Jun-young Lee

IPC分类号： G01R31/02

CPC分类号： H05K1/0268 ,  G01R1/0408 ,  H05K1/181 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

摘要： A test unit usable with a board having, an electronic component includes at least one testing point provided in each electronic component to test electric properties and a connection state of the plurality of electronic components connected to the board. The test unit usable with a PCB having the electronic component includes a testing point formed on the electronic component, thereby an enhancing high integration of the board.

摘要翻译： 一种可用于板的测试单元，电子部件包括设置在每个电子部件中的至少一个测试点，以测试连接到板的多个电子部件的电气特性和连接状态。 可与具有电子部件的PCB一起使用的测试单元包括形成在电子部件上的测试点，从而提高板的高集成度。

公开(公告)号：US08785792B2

公开(公告)日：2014-07-22

申请号：US13177199

申请日：2011-07-06

申请人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

发明人： Ja Myeong Koo ,  Soon Min Hong ,  Tae Sang Park ,  Young Jun Moon ,  Gyun Heo ,  Sun Gu Yi

IPC分类号： H01L23/28

CPC分类号： H05K3/0058 ,  B32B37/1207 ,  B32B37/185 ,  B32B38/145 ,  B32B2037/1223 ,  B32B2038/0092 ,  B32B2309/105 ,  B32B2457/14 ,  H05K2201/0999 ,  H05K2201/10098

摘要： Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

摘要翻译： 这里公开了附着有薄膜式电子电路的电子产品的壳体结构。 壳体结构可以包括电子产品和粘附到壳体上的第一膜的壳体。 壳体结构还可以包括粘附到第一膜的第二膜，使得第二膜的一个表面接触第一膜，以及粘附到第一膜的电子电路层。 电子电路层可以布置在第一膜和第二膜之间，其中第一膜热粘附到壳体上。 第一膜可以具有低于壳体的耐热温度的熔点。

公开(公告)号：US08624124B2

公开(公告)日：2014-01-07

申请号：US13078131

申请日：2011-04-01

申请人： Ja Myeong Koo ,  Soon Wan Chung ,  Soon Min Hong ,  Young Jun Moon

发明人： Ja Myeong Koo ,  Soon Wan Chung ,  Soon Min Hong ,  Young Jun Moon

IPC分类号： H05K1/02 ,  H01B7/08

CPC分类号： H05K1/0283 ,  H01B7/06 ,  H05K1/0218 ,  H05K1/0219 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/09681

摘要： According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film.

摘要翻译： 根据示例性实施例，多层可拉伸电缆包括多层可拉伸膜和可拉伸膜中的多条导电线。 导电线在可拉伸膜的厚度方向上的多层可拉伸膜的至少两个不同层中，至少一根导线是信号线，并且与信号线相邻的层中的至少一个其它导电线为 接地线。 信号线和接地线是锯齿形图案，并且平行于多层可拉伸膜的宽度方向。

公开(公告)号：US08197284B2

公开(公告)日：2012-06-12

申请号：US12659607

申请日：2010-03-15

申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong ,  Hyo Young Shin

发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong ,  Hyo Young Shin

IPC分类号： H01R13/58

CPC分类号： H01R13/6658 ,  H01R43/24 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/10189 ,  H05K2203/0228 ,  Y10T29/417 ,  Y10T29/4913

摘要： Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly.

摘要翻译： 这里公开了一种印刷电路板及其连接方法。 电路板组件的连接方法可以包括通过向印刷电路板组件施加树脂来模制印刷电路板组件，通过部分去除模制的印刷电路板来暴露安装在印刷电路板上的连接器的电极端子的端部 并且将连接构件连接到连接器的电极端子的暴露端。 因此，即使整个印刷电路板组件被模制，连接构件也可以自由地连接到印刷电路板组件的连接器。

公开(公告)号：US20120018084A1

公开(公告)日：2012-01-26

申请号：US13177064

申请日：2011-07-06

申请人： Kyung Woon Jang ,  Seungbae Park ,  Young Jun Moon ,  Soon Min Hong ,  Chang-kyu Chung ,  Dae Jung Kim ,  Sang il Hong

发明人： Kyung Woon Jang ,  Seungbae Park ,  Young Jun Moon ,  Soon Min Hong ,  Chang-kyu Chung ,  Dae Jung Kim ,  Sang il Hong

IPC分类号： H05K7/00

CPC分类号： H05K3/305 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83851 ,  H01L2224/83862 ,  H05K3/323 ,  H05K2203/0278 ,  H05K2203/068 ,  Y02P70/613 ,  H01L2924/00012

摘要： Disclosed herein is a printed circuit board assembly manufacturing device and method of manufacturing a printed circuit board assembly. The printed circuit board assembly manufacturing device may include a fusing unit configured to cure a conductive adhesive used to fix electronic components having different heights to a printed circuit board. The fusing unit may be configured to cure the conductive adhesive while simultaneously applying pressure to the electronic components having different heights.

摘要翻译： 这里公开了印刷电路板组件制造装置和制造印刷电路板组件的方法。 印刷电路板组装制造装置可以包括定影单元，其被配置为固化用于将具有不同高度的电子部件固定到印刷电路板的导电粘合剂。 定影单元可以被配置为固化导电粘合剂，同时向具有不同高度的电子部件施加压力。

公开(公告)号：US20110272181A1

公开(公告)日：2011-11-10

申请号：US13078131

申请日：2011-04-01

申请人： Ja Myeong Koo ,  Soon Wan Chung ,  Soon Min Hong ,  Young Jun Moon

发明人： Ja Myeong Koo ,  Soon Wan Chung ,  Soon Min Hong ,  Young Jun Moon

IPC分类号： H05K1/02

CPC分类号： H05K1/0283 ,  H01B7/06 ,  H05K1/0218 ,  H05K1/0219 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/09681

摘要： According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film.

摘要翻译： 根据示例性实施例，多层可拉伸电缆包括多层可拉伸膜和可拉伸膜中的多条导电线。 导电线在可拉伸膜的厚度方向上的多层可拉伸膜的至少两个不同层中，至少一根导线是信号线，并且与信号线相邻的层中的至少一个其它导电线为 接地线。 信号线和接地线是锯齿形图案，并且平行于多层可拉伸膜的宽度方向。

公开(公告)号：US20110026233A1

公开(公告)日：2011-02-03

申请号：US12801829

申请日：2010-06-28

申请人： Soon Min Hong ,  Ja Myeong Koo ,  Young Jun Moon ,  Sun Gu Yi

发明人： Soon Min Hong ,  Ja Myeong Koo ,  Young Jun Moon ,  Sun Gu Yi

IPC分类号： H05K1/14 ,  H05K7/00 ,  G05G15/06 ,  H01B13/008

CPC分类号： H01B13/008 ,  H01B7/0838 ,  H05K1/0283 ,  H05K3/103 ,  H05K3/281 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2201/10287 ,  H05K2203/1545

摘要： Disclosed herein is an apparatus for manufacturing an elastic cable including conductor tracks arranged in a zigzag shape between elastic films. The apparatus may include a conductor track supplying unit to supply at least one conductor track, an aligning unit to align the at least one conductor track supplied from the conductor track supplying unit, a film supplying unit to supply elastic films such that the at least one conductor track is surrounded by the elastic films, and a thermal lamination roller unit to thermally laminate the at least one conductor track arranged between the elastic films, wherein the aligning unit is reciprocally movable to arrange the at least one conductor track in a zigzag shape between the elastic films when the at least one conductor track is supplied to the thermal lamination roller unit.

摘要翻译： 本文公开了一种用于制造弹性电缆的装置，其包括在弹性膜之间以锯齿形布置的导体轨道。 所述装置可以包括导体轨迹提供单元，用于提供至少一个导体轨道，对准单元以对准从导体轨道供应单元提供的至少一个导体轨道，薄膜供应单元供应弹性薄膜使得至少一个 导体轨道由弹性膜包围，并且热层压辊单元热排列布置在弹性膜之间的至少一个导体轨迹，其中对准单元是可往复移动的，以将至少一个导体轨道布置成Z字形， 当至少一个导体轨道被提供给热层压辊单元时的弹性膜。