公开(公告)号：US20100327725A1

公开(公告)日：2010-12-30

申请号：US12492379

申请日：2009-06-26

Applicant: Yen-Yu Huang ,  Yu-Yu Lin ,  Yu-Chun Lin ,  Huai-Jen Lu ,  Wan-Chih Lin

Inventor： Yen-Yu Huang ,  Yu-Yu Lin ,  Yu-Chun Lin ,  Huai-Jen Lu ,  Wan-Chih Lin

IPC: H01J61/52

CPC classification number: F21V29/767 ,  F21K9/232 ,  F21V7/0025 ,  F21Y2107/30 ,  F21Y2115/10

Abstract: A light-emitting diode (LED) lamp and a polygonal heat-dissipation structure thereof are provided. The LED lamp includes a polygonal heat-dissipation unit and a lighting module. The polygonal heat-dissipation unit has a polygonal hollow column and fins. The fins and the lighting module are thermally disposed on an inner surface and an outer surface of the polygonal hollow column, respectively. Thus, heat generated by the lighting module is dissipated by the fins rapidly. As the fins are thermally disposed on the inner surface of the polygon hollow column instead of being exposed, the volume of the LED lamp can be minimized, and the look of the LED lamp also can be prettified.

Abstract translation: 提供了一种发光二极管（LED）灯及其多边形散热结构。 LED灯包括多边形散热单元和照明模块。 多边形散热单元具有多边形空心柱和翅片。 翅片和照明模块分别热分布在多边形中空柱的内表面和外表面上。 因此，照明模块产生的热量被散热片快速消散。 由于翅片被热设置在多边形中空柱的内表面上而不是暴露，所以可以使LED灯的体积最小化，并且LED灯的外观也可以被优化。

公开(公告)号：US06879749B2

公开(公告)日：2005-04-12

申请号：US10294971

申请日：2002-11-14

Applicant: Seng-leong Wong ,  Leo Yu-Yu Lin ,  YanQing Lu

Inventor： Seng-leong Wong ,  Leo Yu-Yu Lin ,  YanQing Lu

IPC: G02B6/34 ,  G02B6/293 ,  G02B6/32

CPC classification number: G02B6/2931 ,  G02B6/2713 ,  G02B6/2793 ,  G02B6/2938

Abstract: An optical device for demultiplexing an optical signal comprises a grating that receives an optical signal comprising a plurality of wavelength channels, and generates a plurality of spatially separated light beams. Each light beam is associated with a particular wavelength channel. The optical device further comprises an optical element that at least partially compensates a temperature based frequency shift associated with the spatially separated light beams. The optical device further comprises a plurality of lenses and a plurality of fibers. The plurality of lenses are arranged such that a spacing between at least a pair of lenses is determined to at least partially compensate a non-linearity introduced by the grating. Each fiber is associated with a corresponding lens and receives a corresponding light beam. At least one fiber is placed a distance that is less than a focal length associated with its corresponding lens.

Abstract translation: 用于解复用光信号的光学装置包括接收包括多个波长信道的光信号的光栅，并且产生多个空间分离的光束。 每个光束与特定波长通道相关联。 光学装置还包括至少部分地补偿与空间分离的光束相关联的基于温度的频移的光学元件。 光学装置还包括多个透镜和多个光纤。 多个透镜被布置成使得至少一对透镜之间的间隔被确定为至少部分地补偿由光栅引入的非线性。 每个光纤与对应的透镜相关联，并接收相应的光束。 至少一根光纤的距离小于与其对应的透镜相关联的焦距。

公开(公告)号：US09449909B2

公开(公告)日：2016-09-20

申请号：US13620225

申请日：2012-09-14

Applicant: Chin-Sung Lin ,  Li-Hua Lin ,  Yu-Yu Lin

Inventor： Chin-Sung Lin ,  Li-Hua Lin ,  Yu-Yu Lin

IPC: H05K3/34 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0253 ,  H05K3/3436 ,  Y10T156/1089 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail.

Abstract translation: 根据实施例，一种方法包括在其上提供具有导电材料的基板，从导电材料形成接地平面，第一迹线轨道和第一垂直迹线，以及在接地平面上形成绝缘体材料，第一 轨迹轨迹和第一条垂直轨迹。 接地平面位于第一轨迹和衬底的区域之间，在该区域上将是模具。 第一轨迹沿接地平面的第一外边缘延伸，并且第一垂直迹线耦合到第一迹线轨道并且从第一轨迹线垂直延伸。

公开(公告)号：US09053949B2

公开(公告)日：2015-06-09

申请号：US13548311

申请日：2012-07-13

Applicant: Yu-Yu Lin

Inventor： Yu-Yu Lin

IPC: H01L23/10 ,  H01L25/065 ,  H01L23/367 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L25/0655 ,  H01L23/367 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2224/92225 ,  H01L2225/1005 ,  H01L2924/014

Abstract: The invention provides a semiconductor device and associated method, which includes a substrate, a first die, multiple sub-package systems surrounding the first die, and a heat spreader. The first die and the sub-package systems are installed on a same surface of the substrate, wherein projections of the first die and each sub-package system on the surface partially overlap, and have a portion not overlapping. Each of the sub-package systems includes an interposer and multiple second dice installed on the interposer by way of flip-chip. The heat spreader includes a protrusion portion and a dissipation plate; the dissipation plate covers the first die and the sub-package systems, and the protrusion portion is set between the dissipation plate and the first die.

Abstract translation: 本发明提供一种半导体器件及其相关方法，其包括衬底，第一裸片，围绕第一裸片的多个子封装系统和散热器。 第一模具和子包装系统安装在基板的相同表面上，其中第一模具和表面上的每个子封装系统的突出部分重叠，并且具有不重叠的部分。 每个子封装系统包括通过倒装芯片安装在插入器上的插入器和多个第二裸片。 散热器包括突出部分和散热板; 散热板覆盖第一模具和子封装体系，突起部分设置在散热板和第一模具之间。

公开(公告)号：US20140036570A1

公开(公告)日：2014-02-06

申请号：US13567750

申请日：2012-08-06

Applicant: Feng-Min Lee ,  Yu-Yu Lin ,  Ming-Hsiu Lee

Inventor： Feng-Min Lee ,  Yu-Yu Lin ,  Ming-Hsiu Lee

IPC: G11C7/00 ,  G11C11/00

CPC classification number: G11C13/0069 ,  G11C13/0004 ,  G11C13/0007 ,  G11C13/0011 ,  G11C13/0033 ,  G11C13/004 ,  G11C2013/0047 ,  G11C2013/0052 ,  G11C2013/0073 ,  G11C2213/77

Abstract: An operating method for a memory device and a memory array and an operating method for the same are provided. The operating method for the memory device comprises following steps. A memory device is made being in a set state. A method for making the memory device being in the set state comprises applying a first bias voltage to the memory device. The memory device in the set state is read. A method for reading the memory device in the set state comprises applying a second bias voltage to the memory device. A recovering bias voltage is applied to the memory device. The step for applying the recovering bias voltage is performed after the step for applying the first bias voltage or the step for applying the second bias voltage.

Abstract translation: 提供了一种用于存储器件和存储器阵列的操作方法及其操作方法。 存储器件的操作方法包括以下步骤。 使存储器件处于置位状态。 用于使存储器件处于设置状态的方法包括将第一偏置电压施加到存储器件。 读取设置状态的存储器件。 一种在设定状态下读取存储器件的方法，包括将第二偏置电压施加到存储器件。 将恢复的偏置电压施加到存储器件。 在施加第一偏置电压的步骤或施加第二偏置电压的步骤之后执行用于施加恢复偏压的步骤。

公开(公告)号：US20130032937A1

公开(公告)日：2013-02-07

申请号：US13548311

申请日：2012-07-13

Applicant: Yu-Yu Lin

Inventor： Yu-Yu Lin

IPC: H01L23/34 ,  H01L21/50

CPC classification number: H01L25/0655 ,  H01L23/367 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2224/92225 ,  H01L2225/1005 ,  H01L2924/014

Abstract: The invention provides a semiconductor device and associated method, which includes a substrate, a first die, multiple sub-package systems surrounding the first die, and a heat spreader. The first die and the sub-package systems are installed on a same surface of the substrate, wherein projections of the first die and each sub-package system on the surface partially overlap, and have a portion not overlapping. Each of the sub-package systems includes an interposer and multiple second dice installed on the interposer by way of flip-chip. The heat spreader includes a protrusion portion and a dissipation plate; the dissipation plate covers the first die and the sub-package systems, and the protrusion portion is set between the dissipation plate and the first die.

Abstract translation: 本发明提供一种半导体器件及其相关方法，其包括衬底，第一裸片，围绕第一裸片的多个子封装系统和散热器。 第一模具和子包装系统安装在基板的相同表面上，其中第一模具和表面上的每个子封装系统的突出部分重叠，并且具有不重叠的部分。 每个子封装系统包括通过倒装芯片安装在插入器上的插入器和多个第二裸片。 散热器包括突出部分和散热板; 散热板覆盖第一模具和子封装体系，突起部分设置在散热板和第一模具之间。

公开(公告)号：US07941278B2

公开(公告)日：2011-05-10

申请号：US11617038

申请日：2006-12-28

Applicant: Yu-Ching Chang ,  Yu-Yu Lin ,  Shiu-Chieh Lan ,  Cheng-Tao Wu ,  Chung-Cheng Liu

Inventor： Yu-Ching Chang ,  Yu-Yu Lin ,  Shiu-Chieh Lan ,  Cheng-Tao Wu ,  Chung-Cheng Liu

IPC: G06F7/00

CPC classification number: C12N15/111 ,  C12N2310/14 ,  C12N2320/11 ,  C12N2330/10 ,  G06F19/16 ,  G06F19/18 ,  G06F19/22

Abstract: Disclosed are methods of identifying microRNA motifs or microRNA precursors for a target gene or a set of target genes. Also disclosed are related computer-readable media.

Abstract translation: 公开了鉴定靶基因或一组靶基因的微小RNA基序或微小RNA前体的方法。 还公开了相关的计算机可读介质。

公开(公告)号：US06847786B2

公开(公告)日：2005-01-25

申请号：US09730320

申请日：2000-12-04

Applicant: Charles Wong ,  Leo Yu-Yu Lin ,  Jian-Yu Liu

Inventor： Charles Wong ,  Leo Yu-Yu Lin ,  Jian-Yu Liu

IPC: G02B6/34 ,  G02B27/10 ,  G02B27/28 ,  G02F1/31 ,  H04J14/02 ,  H04J14/06 ,  H04Q11/00

CPC classification number: G02B6/272 ,  G02B6/278 ,  G02B6/29302 ,  G02B6/29394 ,  G02B6/29397 ,  G02B27/1006 ,  G02B27/12 ,  G02B27/288 ,  G02F1/31 ,  H04J14/02 ,  H04J14/06 ,  H04Q11/0003 ,  H04Q11/0005 ,  H04Q2011/0026 ,  H04Q2011/0032 ,  H04Q2011/0035

Abstract: A wavelength division multiplexing/demultiplexing device is presented utilizing a polarization-based filter to separate odd and even wavelengths, or upper and lower channels of an input optical signal. The wavelength filter first converts the input signal to a predetermined polarization. A series of birefringent waveplates provide a polarization-dependent optical transmission function such that the polarized beam is decomposed into a first beam component carrying the first spectral band at a first polarization and a second beam component carrying the second spectral band at a second, orthogonal polarization. A beam displacer spatially separates the beam components into a pair of orthogonally-polarized beams. A quarter-wave plate converts these orthogonally-polarized beams into a pair of circularly-polarized beams, which are reflected by a mirror back along parallel optical paths through the quarter-wave plate, beam displacer, and waveplates. In the return pass, the quarter-wave plate converts the reflected circularly-polarized beams into two orthogonally-polarized beams having polarizations that are rotated by 90 degrees from those in the forward pass. The waveplates further purify the spectral characteristics of the reflected beams and maintain the polarization of one of the reflected beams, while rotating the polarization of the other reflected beam by 90 degrees so that both reflected beams have substantially the same polarization. A routing element directs one of the reflected beams exiting the waveplates to a first output port and the other reflected beam to a second output port.

Abstract translation: 使用基于偏振的滤波器来提供波分复用/解复用装置来分离输入光信号的奇数和偶数波长或上，下通道。 波长滤波器首先将输入信号转换成预定的极化。 一系列双折射波片提供了偏振相关的光传输功能，使得偏振光束被分解为在第一偏振处承载第一光谱带的第一光束分量，并且在第二正交偏振下将携带第二光谱带的第二光束分量分解 。 光束置换器在空间上将光束分量空间分离成一对正交偏振光束。 四分之一波片将这些正交偏振光束转换成一对圆偏振光束，该对圆偏振光束通过四分之一波片，光束置换器和波片的平行光路反射回反射镜。 在返回通道中，四分之一波片将反射的圆偏振光束转换成具有与正向通过旋转90度的极化的两个正交偏振光束。 波片进一步净化反射光束的光谱特性并保持一个反射光束的偏振，同时使另一个反射光束的偏振旋转90度，使得两个反射光束具有基本相同的偏振。 路由元件将离开波片的反射光束中的一个引导到第一输出端口，将另一反射光束引导到第二输出端口。

公开(公告)号：US08824188B2

公开(公告)日：2014-09-02

申请号：US13567750

申请日：2012-08-06

Applicant: Feng-Min Lee ,  Yu-Yu Lin ,  Ming-Hsiu Lee

Inventor： Feng-Min Lee ,  Yu-Yu Lin ,  Ming-Hsiu Lee

IPC: G11C11/00 ,  G11C13/00

CPC classification number: G11C13/0069 ,  G11C13/0004 ,  G11C13/0007 ,  G11C13/0011 ,  G11C13/0033 ,  G11C13/004 ,  G11C2013/0047 ,  G11C2013/0052 ,  G11C2013/0073 ,  G11C2213/77

Abstract: An operating method for a memory device and a memory array and an operating method for the same are provided. The operating method for the memory device comprises following steps. A memory device is made being in a set state. A method for making the memory device being in the set state comprises applying a first bias voltage to the memory device. The memory device in the set state is read. A method for reading the memory device in the set state comprises applying a second bias voltage to the memory device. A recovering bias voltage is applied to the memory device. The step for applying the recovering bias voltage is performed after the step for applying the first bias voltage or the step for applying the second bias voltage.

Abstract translation: 提供了一种用于存储器件和存储器阵列的操作方法及其操作方法。 存储器件的操作方法包括以下步骤。 使存储器件处于置位状态。 用于使存储器件处于设置状态的方法包括将第一偏置电压施加到存储器件。 读取设置状态的存储器件。 一种在设定状态下读取存储器件的方法，包括将第二偏置电压施加到存储器件。 将恢复的偏置电压施加到存储器件。 在施加第一偏置电压的步骤或施加第二偏置电压的步骤之后执行用于施加恢复偏压的步骤。

公开(公告)号：US20130015234A1

公开(公告)日：2013-01-17

申请号：US13620225

申请日：2012-09-14

Applicant: Chin-Sung Lin ,  Li-Hua Lin ,  Yu-Yu Lin

Inventor： Chin-Sung Lin ,  Li-Hua Lin ,  Yu-Yu Lin

IPC: H05K3/00 ,  H05K13/04

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0253 ,  H05K3/3436 ,  Y10T156/1089 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail.

Abstract translation: 根据实施例，一种方法包括在其上提供具有导电材料的基板，从导电材料形成接地平面，第一迹线轨道和第一垂直迹线，以及在接地平面上形成绝缘体材料，第一 轨迹轨迹和第一条垂直轨迹。 接地平面位于第一轨迹和衬底的区域之间，在该区域上将是模具。 第一轨迹沿接地平面的第一外边缘延伸，并且第一垂直迹线耦合到第一迹线轨道并且从第一轨迹线垂直延伸。