公开(公告)号：US20230052048A1

公开(公告)日：2023-02-16

申请号：US17946547

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Ashavani KUMAR ,  Ashwin CHOCKALINGAM ,  Sivapackia GANAPATHIAPPAN ,  Rajeev BAJAJ ,  Boyi FU ,  Daniel REDFIELD ,  Nag B. PATIBANDLA ,  Mario Dagio CORNEJO ,  Amritanshu SINHA ,  Yan ZHAO ,  Ranga Rao ARNEPALLI ,  Fred C. REDEKER

IPC: B24B37/24 ,  B33Y80/00 ,  B33Y10/00 ,  B24D11/04 ,  B24B37/26 ,  B24D18/00 ,  B29C64/112

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US20220362904A1

公开(公告)日：2022-11-17

申请号：US17321694

申请日：2021-05-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Uma SRIDHAR ,  Yingdong LUO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Sebastian David ROZO ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Sudhakar MADHUSOODHANAN

IPC: B24B37/24

Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.

公开(公告)号：US20220250203A1

公开(公告)日：2022-08-11

申请号：US17172152

申请日：2021-02-10

Applicant: Applied Materials, Inc.

Inventor： Puneet Narendra JAWALI ,  Veera Raghava Reddy KAKIREDDY ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/24 ,  B23K26/342 ,  B33Y80/00

Abstract: Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.

公开(公告)号：US20210274926A1

公开(公告)日：2021-09-09

申请号：US16811935

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ

IPC: A46D3/00 ,  A46B1/00 ,  A46B11/00 ,  A46B13/00 ,  B33Y80/00 ,  B33Y10/00 ,  B29C64/112 ,  B29C64/124 ,  B24B37/34

Abstract: Embodiments described herein generally relate to a brush, a method of forming a brush, and a structure embodied in a machine readable medium used in a design process are provided. The brush includes a body and a channel configured to deliver a cleaning liquid through holes in the body. The method forms the brush using 3D printing. The structure provides details for making the brush. The disclosure herein allows a method of forming a brush that does not require the removal of active porogen.

公开(公告)号：US20190240802A1

公开(公告)日：2019-08-08

申请号：US16259597

申请日：2019-01-28

Applicant: Applied Materials, Inc.

Inventor： Venkat HARIHARAN ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/24 ,  B24B37/26 ,  B24B37/22 ,  B29C64/112 ,  C09G1/02 ,  H01L21/321 ,  H01L21/768

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  C09G1/02 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76877

Abstract: Embodiments described herein relate to methods of detecting a polishing endpoint using one or more sensors embedded in the polishing material of a polishing pad, the polishing pads, and methods of forming the polishing pads. In one embodiment, a method of polishing a substrate includes urging a to be polished surface of a substrate against a polishing surface of a polishing pad, the polishing pad having one or more sensors embedded in the polishing pad material thereof, wherein the polishing pad is mounted on a polishing platen of a polishing system, detecting a force exerted against a polishing surface of the polishing pad using the one or more sensors, converting the detected force into signal information, wirelessly communicating the signal information received from the one or more sensors to one or more interrogators disposed in the polishing platen, and changing one or more polishing conditions based on the signal information.

公开(公告)号：US20170133252A1

公开(公告)日：2017-05-11

申请号：US14935134

申请日：2015-11-06

Applicant: Applied Materials, Inc.

Inventor： Jason G. FUNG ,  Rajeev BAJAJ ,  Daniel REDFIELD ,  Aniruddh KHANNA ,  Mario CORNEJO ,  Gregory E. MENK ,  John WATKINS

IPC: H01L21/67 ,  H01L21/66 ,  B24B37/26 ,  B29C67/00 ,  B24B49/14 ,  B24B49/16 ,  B24B49/10 ,  H01L21/306 ,  B24B49/00

CPC classification number: H01L21/67253 ,  B24B37/26 ,  B24B49/003 ,  B24B49/10 ,  B24B49/14 ,  B24B49/16 ,  B29C64/106 ,  B29K2995/0003 ,  B29K2995/0005 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67294 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

公开(公告)号：US20160107295A1

公开(公告)日：2016-04-21

申请号：US14885950

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Aniruddh KHANNA ,  Jason G. FUNG ,  Mario CORNEJO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Veera Raghava Reddy KAKIREDDY ,  Ashavani KUMAR ,  Venkatachalam HARIHARAN ,  Gregory E. MENK ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Robert E. DAVENPORT ,  Amritanshu SINHA

IPC: B24D18/00 ,  B24D3/28

CPC classification number: B24D18/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US20150099432A1

公开(公告)日：2015-04-09

申请号：US14484173

申请日：2014-09-11

Applicant: Applied Materials, Inc.

Inventor： Uday MAHAJAN ,  Rajeev BAJAJ ,  Fred Conrad REDEKER ,  Abdul Wahab MOHAMMED

IPC: B24B41/04 ,  B24B37/34 ,  H01F7/02 ,  B24B37/20

CPC classification number: B24B41/04 ,  B24B37/14 ,  B24B37/20 ,  B24B37/22 ,  B24B37/34 ,  H01F7/0273

Abstract: Embodiments described herein generally relate to devices and methods for magnetic-responsive chemical mechanical polishing. In one embodiment, a device including a support with one or more magnetic field generators formed therein is provided. The magnetic field generators can produce at least one magnetic field. A magnetic-responsive composite is positioned in magnetic connection with the magnetic field generators. When the magnetic-responsive composite receives the magnetic field from the magnetic field generators, the magnetic-responsive composite changes shape.

Abstract translation: 本文描述的实施例一般涉及用于磁响应化学机械抛光的装置和方法。 在一个实施例中，提供了一种包括其中形成有一个或多个磁场产生器的支撑件的装置。 磁场发生器可产生至少一个磁场。 磁响应复合体定位成与磁场发生器磁连接。 当磁响应复合体从磁场发生器接收磁场时，磁响应复合体变形。

公开(公告)号：US20220395958A1

公开(公告)日：2022-12-15

申请号：US17346399

申请日：2021-06-14

Applicant: Applied Materials, Inc.

Inventor： Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE ,  Ashwin CHOCKALINGAM ,  Jason Garcheung FUNG ,  Veera Raghava Reddy KAKIREDDY ,  Nandan BARADANAHALLI KENCHAPPA ,  Puneet Narendra JAWALI ,  Rajeev BAJAJ

IPC: B24B37/26

Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.

公开(公告)号：US20210347005A1

公开(公告)日：2021-11-11

申请号：US17382194

申请日：2021-07-21

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Sivapackia GANAPATHIAPPAN ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Ashwin CHOCKALINGAM ,  Dominic J. BENVEGNU ,  Mario Dagio CORNEJO ,  Mayu YAMAMURA ,  Nag B. PATIBANDLA ,  Ankit VORA

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material and methods of forming thereof. In one embodiment, a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition, and the dispensed window precursor composition disposed within the first layer.