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公开(公告)号：US09865577B2
公开(公告)日：2018-01-09
申请号：US15438587
申请日：2017-02-21
Applicant: Apple Inc.
Inventor： Andreas Bibl , Kelly McGroddy
IPC: H01L33/50 , H01L25/16 , H01L25/075 , H01L27/32 , H01L51/52 , H01L33/52 , H01L33/58 , H01L33/54 , H01L33/56
CPC classification number: H01L25/167 , G02F1/133603 , G02F1/133617 , G02F2001/133614 , G09F9/00 , G09G3/32 , H01L24/95 , H01L25/0753 , H01L27/322 , H01L27/3246 , H01L33/38 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/504 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L51/5281 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.
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公开(公告)号：US09601659B2
公开(公告)日：2017-03-21
申请号：US15199803
申请日：2016-06-30
Applicant: Apple Inc.
Inventor： David P. Bour , Kelly McGroddy , Daniel Arthur Haeger , James Michael Perkins , Arpan Chakraborty , Jean-Jacques P. Drolet , Dmitry S. Sizov
IPC: H01L29/06 , H01L31/00 , H01L33/06 , H01L33/00 , H01L33/30 , H01L33/20 , H01L33/24 , H01L33/44 , H01L33/56
CPC classification number: H01L33/06 , H01L33/0025 , H01L33/20 , H01L33/24 , H01L33/30 , H01L33/44 , H01L33/56
Abstract: LED structures are disclosed to reduce non-radiative sidewall recombination along sidewalls of vertical LEDs including p-n diode sidewalls that span a top current spreading layer, bottom current spreading layer, and active layer between the top current spreading layer and bottom current spreading layer.
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公开(公告)号：US20160197232A1
公开(公告)日：2016-07-07
申请号：US14853614
申请日：2015-09-14
Applicant: Apple Inc.
Inventor： David P. Bour , Kelly McGroddy , Daniel Arthur Haeger , James Michael Perkins , Arpan Chakraborty , Jean-Jacques P. Drolet
CPC classification number: H01L33/06 , H01L33/20 , H01L33/24 , H01L33/30 , H01L33/38 , H01L33/44 , H01L33/56
Abstract: LED structures are disclosed to reduce non-radiative sidewall recombination along sidewalls of vertical LEDs including p-n diode sidewalls that span a top current spreading layer, bottom current spreading layer, and active layer between the top current spreading layer and bottom current spreading layer.
Abstract translation: 公开了LED结构，以减少沿着垂直LED的侧壁的非辐射侧壁复合，包括跨越顶部电流扩散层的p-n二极管侧壁，底部电流扩展层以及顶部电流扩散层和底部电流扩散层之间的有源层。
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公开(公告)号：US12175945B2
公开(公告)日：2024-12-24
申请号：US18497185
申请日：2023-10-30
Applicant: Apple Inc.
Inventor： Kapil V. Sakariya , Andreas Bibl , Kelly McGroddy
IPC: G09G3/20 , G09G3/32 , G09G3/3216 , G09G3/3233 , G09G3/3266 , G09G3/34 , H01L25/075 , H01L25/16
Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
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公开(公告)号：US20190115495A1
公开(公告)日：2019-04-18
申请号：US16219897
申请日：2018-12-13
Applicant: Apple Inc.
Inventor： David P. Bour , Kelly McGroddy , Daniel Arthur Haeger , James Michael Perkins , Arpan Chakraborty , Jean-Jacques P. Drolet , Dmitry S. Sizov
CPC classification number: H01L33/06 , H01L33/0008 , H01L33/0025 , H01L33/0062 , H01L33/145 , H01L33/20 , H01L33/24 , H01L33/305 , H01L33/44 , H01L33/56
Abstract: LED structures are disclosed to reduce non-radiative sidewall recombination along sidewalls of vertical LEDs including p-n diode sidewalls that span a top current spreading layer, bottom current spreading layer, and active layer between the top current spreading layer and bottom current spreading layer.
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Patent Agency Ranking
公开(公告)号：US20180097145A1
公开(公告)日：2018-04-05
申请号：US15828081
申请日：2017-11-30
Applicant: Apple Inc.
Inventor： David P. Bour , Kelly McGroddy , Daniel Arthur Haeger , James Michael Perkins , Arpan Chakraborty , Jean-Jacques P. Drolet , Dmitry S. Sizov
CPC classification number: H01L33/06 , H01L33/0008 , H01L33/0025 , H01L33/0062 , H01L33/145 , H01L33/20 , H01L33/24 , H01L33/305 , H01L33/44 , H01L33/56
Abstract: LED structures are disclosed to reduce non-radiative sidewall recombination along sidewalls of vertical LEDs including p-n diode sidewalls that span a top current spreading layer, bottom current spreading layer, and active layer between the top current spreading layer and bottom current spreading layer.
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公开(公告)号：US09865772B2
公开(公告)日：2018-01-09
申请号：US15444218
申请日：2017-02-27
Applicant: Apple Inc.
Inventor： David P. Bour , Kelly McGroddy , Daniel Arthur Haeger , James Michael Perkins , Arpan Chakraborty , Jean-Jacques P. Drolet , Dmitry S. Sizov
CPC classification number: H01L33/06 , H01L33/0008 , H01L33/0025 , H01L33/0062 , H01L33/145 , H01L33/20 , H01L33/24 , H01L33/305 , H01L33/44 , H01L33/56
Abstract: LED structures are disclosed to reduce non-radiative sidewall recombination along sidewalls of vertical LEDs including p-n diode sidewalls that span a top current spreading layer, bottom current spreading layer, and active layer between the top current spreading layer and bottom current spreading layer.
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公开(公告)号：US20170170360A1
公开(公告)日：2017-06-15
申请号：US15444218
申请日：2017-02-27
Applicant: Apple Inc.
Inventor： David P. Bour , Kelly McGroddy , Daniel Arthur Haeger , James Michael Perkins , Arpan Chakraborty , Jean-Jacques P. Drolet , Dmitry S. Sizov
CPC classification number: H01L33/06 , H01L33/0008 , H01L33/0025 , H01L33/0062 , H01L33/145 , H01L33/20 , H01L33/24 , H01L33/305 , H01L33/44 , H01L33/56
Abstract: LED structures are disclosed to reduce non-radiative sidewall recombination along sidewalls of vertical LEDs including p-n diode sidewalls that span a top current spreading layer, bottom current spreading layer, and active layer between the top current spreading layer and bottom current spreading layer.
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公开(公告)号：US20210020122A1
公开(公告)日：2021-01-21
申请号：US17063371
申请日：2020-10-05
Applicant: Apple Inc.
Inventor： Kapil V. Sakariya , Andreas Bibl , Kelly McGroddy
IPC: G09G3/34 , G09G3/3233 , H01L25/075 , H01L25/16 , G09G3/3266 , G09G3/3216 , G09G3/20 , G09G3/32
Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
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公开(公告)号：US10796648B2
公开(公告)日：2020-10-06
申请号：US16512286
申请日：2019-07-15
Applicant: Apple Inc.
Inventor： Kapil V. Sakariya , Andreas Bibl , Kelly McGroddy
IPC: G09G3/34 , G09G3/3233 , H01L25/075 , H01L25/16 , G09G3/3266 , G09G3/3216 , G09G3/20 , G09G3/32
Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
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