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公开(公告)号：US20160114458A1
公开(公告)日：2016-04-28
申请号：US14920801
申请日：2015-10-22
Applicant: APPLIED MATERIALS, INC.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava REDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
CPC classification number: B24B37/26 , B24B37/22 , B24B37/24 , B24D3/28 , B24D11/00 , B24D11/001 , B24D11/04 , B33Y10/00 , B33Y80/00
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
Abstract translation: 本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能性聚合物，功能低聚物，反应性稀释剂和固化剂。 例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。
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公开(公告)号：US20160107287A1
公开(公告)日：2016-04-21
申请号：US14887240
申请日：2015-10-19
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20210347005A1
公开(公告)日：2021-11-11
申请号：US17382194
申请日：2021-07-21
Applicant: Applied Materials, Inc.
Inventor： Boyi FU , Sivapackia GANAPATHIAPPAN , Daniel REDFIELD , Rajeev BAJAJ , Ashwin CHOCKALINGAM , Dominic J. BENVEGNU , Mario Dagio CORNEJO , Mayu YAMAMURA , Nag B. PATIBANDLA , Ankit VORA
Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material and methods of forming thereof. In one embodiment, a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition, and the dispensed window precursor composition disposed within the first layer.
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公开(公告)号：US20210187693A1
公开(公告)日：2021-06-24
申请号：US17036623
申请日：2020-09-29
Applicant: Applied Materials, Inc.
Inventor： Aniruddh Jagdish KHANNA , Jason G. FUNG , Puneet Narendra JAWALI , Rajeev BAJAJ , Adam Wade MANZONIE , Nandan BARADANAHALLI KENCHAPPA , Veera Raghava Reddy KAKIREDDY , Joonho AN , Jaeseok KIM , Mayu YAMAMURA
Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.
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15.发明申请公开(公告)号：US20200055161A1
公开(公告)日：2020-02-20
申请号：US16661400
申请日：2019-10-23
Applicant: Applied Materials, Inc.
Inventor： Ashwin CHOCKALINGHAM , Mahendra C. ORILALL , Mayu YAMAMURA , Boyi FU , Rajeev BAJAJ , Daniel REDFIELD
IPC: B24B37/20 , B24B37/26 , B24B37/24 , H01L21/306
Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
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Patent Agency Ranking
公开(公告)号：US20190047112A1
公开(公告)日：2019-02-14
申请号：US16050442
申请日：2018-07-31
Applicant: Applied Materials, Inc.
Inventor： Boyi FU , Sivapackia GANAPATHIAPPAN , Daniel REDFIELD , Rajeev BAJAJ , Ashwin CHOCKALINGAM , Dominic J. BENVEGNU , Mario Dagio CORNEJO , Mayu YAMAMURA , Nag B. PATIBANDLA , Ankit VORA
IPC: B24B37/20
Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.
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公开(公告)号：US20170259499A1
公开(公告)日：2017-09-14
申请号：US15452053
申请日：2017-03-07
Applicant: Applied Materials, Inc.
Inventor： Hou T. NG , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Mario CORNEJO
CPC classification number: B33Y10/00 , B24B37/22 , B29K2105/0058 , B33Y30/00 , B33Y80/00 , G03F7/0035 , G03F7/2014
Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
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18.发明申请公开(公告)号：US20170120416A1
公开(公告)日：2017-05-04
申请号：US15298766
申请日：2016-10-20
Applicant: Applied Materials, Inc.
Inventor： Ashwin CHOCKALINGAM , Mahendra C. ORILALL , Mayu YAMAMURA , Boyi FU , Rajeev BAJAJ , Daniel REDFIELD
IPC: B24B37/20 , H01L21/306
CPC classification number: B24B37/20 , H01L21/30625
Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
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公开(公告)号：US20230330805A1
公开(公告)日：2023-10-19
申请号：US18138555
申请日：2023-04-24
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Fred C. REDEKER , Mahendra C. ORILALL , Boyi FU , Mayu YAMAMURA , Ashwin CHOCKALINGAM
CPC classification number: B24B37/22 , B24D3/22 , B24D3/18 , B33Y10/00 , B24B37/24 , B24B37/26 , B33Y80/00
Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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20.发明申请公开(公告)号：US20220402091A1
公开(公告)日：2022-12-22
申请号：US17834675
申请日：2022-06-07
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Daniel REDFIELD , Rajeev BAJAJ , Mahendra C. ORILALL , Hou T. NG , Jason G. FUNG , Mayu YAMAMURA
IPC: B24B37/24
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material, and structural properties, and new methods of manufacturing the same. In one or more embodiments, polishing pads with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Some embodiments may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, advanced polishing pads may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, where each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments can also provide polishing pads with polymeric layers that may be interpenetrating polymer networks.
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