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16 条记录 (耗时 0.049 秒)

    Organic electronic package and method of applying palladium-tin seed layer thereto
    15.
    发明授权
    Organic electronic package and method of applying palladium-tin seed layer thereto 失效
    有机电子封装及其中施加钯 - 锡种子层的方法

    公开(公告)号：US6025057A

    公开(公告)日：2000-02-15

    申请号：US992700

    申请日：1997-12-17

    申请人： Anastasios Peter Angelopoulos ,  Gerald Walter Jones ,  Richard William Malek ,  Heike Marcello ,  Jeffrey McKeveny

    发明人： Anastasios Peter Angelopoulos ,  Gerald Walter Jones ,  Richard William Malek ,  Heike Marcello ,  Jeffrey McKeveny

    IPC分类号： H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  B32B9/00

    CPC分类号： H05K3/4661 ,  H05K3/0023 ,  H05K3/184 ,  Y10S428/901 ,  Y10T428/24917

    摘要： A method of fabricating an electronic package having an organic substrate. The substrate is formed of fiberglass and epoxy. In order to additively circuitize the electronic package substrate, an organic polyelectrolyte is deposited onto the organic substrate. A colloidal palladium-tin seed layer is deposited atop the organic polyelectrolyte. This is followed by depositing a photoimageable polymer atop the seed layer, and photolithographically patterning the photoimageable polymer to uncover portions of the seed. layer. The uncovered portions of the seed layer are catalytic to the electroless deposition of copper. In this way a conductive layer of copper is deposited atop the uncovered seed layer. The organic polyelectrolyte is deposited from an aqueous solution at the pH appropriate for the desired seed catalyst coating, depending on the ionizable character of the particular polyelectrolyte employed.

    摘要翻译： 一种制造具有有机基板的电子封装的方法。 基材由玻璃纤维和环氧树脂制成。 为了对电子封装基板进行相加电路化，将有机聚电解质沉积在有机基底上。 在有机聚电解质的顶部沉积胶态钯 - 锡种子层。 随后在种子层顶上沉积可光成像的聚合物，并光刻地图案化可光成象聚合物以露出种子的部分。 层。 种子层的未覆盖部分催化铜的无电沉积。 以这种方式，铜的导电层沉积在未覆盖的种子层顶上。 根据所使用的特定聚电解质的电离特性，有机聚电解质以适合于所需种子催化剂涂层的pH从水溶液中沉积。

    Organic electronic package and method of applying palladium-tin seed layer thereto
    16.
    发明授权
    Organic electronic package and method of applying palladium-tin seed layer thereto 失效
    有机电子封装及其中施加钯 - 锡种子层的方法

    公开(公告)号：US5866237A

    公开(公告)日：1999-02-02

    申请号：US702346

    申请日：1996-08-23

    申请人： Anastasios Peter Angelopoulos ,  Gerald Walter Jones ,  Richard William Malek ,  Heike Marcello ,  Jeffrey McKeveny

    发明人： Anastasios Peter Angelopoulos ,  Gerald Walter Jones ,  Richard William Malek ,  Heike Marcello ,  Jeffrey McKeveny

    IPC分类号： C08L63/04 ,  H01L23/14 ,  H05K3/18 ,  B32B3/00

    CPC分类号： H05K3/184 ,  Y10T428/24917

    摘要： A method of fabricating an electronic package having an organic substrate. The substrate is formed of fiberglass and epoxy. In order to additively circuitize the electronic package substrate, an organic polyelectrolyte is deposited onto the organic substrate. A colloidal palladium-tin seed layer is deposited atop the organic polyelectrolyte. This is followed by depositing a photoimagable polymer atop the seed layer, and photolithographically patterning the photoimagable polymer to uncover portions of the seed layer. The uncovered portions of the seed layer are catalytic to the electroless deposition of copper. In this way a conductive layer of copper is deposited atop the uncovered seed layer. The organic polyelectrolyte is deposited from an aqueous solution at the pH appropriate for the desired seed catalyst coating, depending on the ionizable character of the particular polyelectrolyte employed.

    摘要翻译： 一种制造具有有机基板的电子封装的方法。 基材由玻璃纤维和环氧树脂制成。 为了对电子封装基板进行相加电路化，将有机聚电解质沉积在有机基底上。 在有机聚电解质的顶部沉积胶态钯 - 锡种子层。 随后在种子层顶上沉积可光成像的聚合物，并光刻地图案化光可光聚合物以露出种子层的部分。 种子层的未覆盖部分催化铜的无电沉积。 以这种方式，铜的导电层沉积在未覆盖的种子层顶上。 根据所使用的特定聚电解质的电离特性，有机聚电解质以适合于所需种子催化剂涂层的pH从水溶液中沉积。