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    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY
    11.
    发明申请
    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 有权
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号：US20080042668A1

    公开(公告)日：2008-02-21

    申请号：US11877466

    申请日：2007-10-23

    Applicant: Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    Inventor： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    IPC: G01R1/073

    CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

    Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

    Method Of Making Microelectronic Spring Contact Array
    13.
    发明申请
    Method Of Making Microelectronic Spring Contact Array 审中-公开
    制作微电子弹簧接触阵列的方法

    公开(公告)号：US20060191136A1

    公开(公告)日：2006-08-31

    申请号：US11382756

    申请日：2006-05-11

    Applicant: Benjamin Eldridge ,  Gaetan Mathieu ,  Carl Reynolds

    Inventor： Benjamin Eldridge ,  Gaetan Mathieu ,  Carl Reynolds

    IPC: H01R43/00 ,  H05K3/10

    CPC classification number: G01R1/06744 ,  G01R1/06733 ,  G01R3/00 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/49224

    Abstract: A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.

    Abstract translation: 制造微电子弹簧接触阵列的方法包括在牺牲衬底上形成多个弹簧触点，然后从牺牲衬底释放弹簧触头。 每个弹簧触点具有带有基端的细长梁。 制造阵列的方法包括在它们已经从牺牲基板完全释放之后将其基端处的弹簧触点附接到基底基板，使得每个触点从基底延伸到其波束的远端。 远端与预定阵列的尖端位置对准。 在本发明的一个实施例中，通过在牺牲衬底上的牺牲层中图形地形成弹簧触点的轮廓来形成弹簧触点。 牺牲层中的图案化凹槽的壁限定弹簧触点的侧面轮廓，并且导电材料沉积在凹部中以形成弹簧触点的细长梁。

    Method and System for Compensating Thermally Induced Motion of Probe Cards
    14.
    发明申请
    Method and System for Compensating Thermally Induced Motion of Probe Cards 有权
    用于补偿探针卡热敏感运动的方法和系统

    公开(公告)号：US20080094088A1

    公开(公告)日：2008-04-24

    申请号：US11963575

    申请日：2007-12-21

    Applicant: Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    Inventor： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    IPC: G01R31/26

    CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

    Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    Abstract translation: 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Method and apparatus for adjusting a multi-substrate probe structure
    15.
    发明申请
    Method and apparatus for adjusting a multi-substrate probe structure 失效
    用于调整多基板探针结构的方法和装置

    公开(公告)号：US20060290367A1

    公开(公告)日：2006-12-28

    申请号：US11165833

    申请日：2005-06-24

    Applicant: Eric Hobbs ,  Benjamin Eldridge ,  Lunyu Ma ,  Gaetan Mathieu ,  Steven Murphy ,  Makarand Shinde ,  Alexander Slocum

    Inventor： Eric Hobbs ,  Benjamin Eldridge ,  Lunyu Ma ,  Gaetan Mathieu ,  Steven Murphy ,  Makarand Shinde ,  Alexander Slocum

    IPC: G01R31/02

    CPC classification number: G01R31/2886 ,  G01R1/073 ,  G01R31/31905 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49222

    Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

    Abstract translation: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。

    Apparatus And Method For Managing Thermally Induced Motion Of A Probe Card Assembly
    16.
    发明申请
    Apparatus And Method For Managing Thermally Induced Motion Of A Probe Card Assembly 有权
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号：US20060255814A1

    公开(公告)日：2006-11-16

    申请号：US11306515

    申请日：2005-12-30

    Applicant: Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    Inventor： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    IPC: G01R31/02

    CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

    Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在布线基板附接到加强板的其他位置处设置空间，使得布线基板相对于加强板可以膨胀和收缩。

    Method And System For Compensating Thermally Induced Motion Of Probe Cards
    17.
    发明申请
    Method And System For Compensating Thermally Induced Motion Of Probe Cards 失效
    用于补偿探针卡的热诱导运动的方法和系统

    公开(公告)号：US20060238211A1

    公开(公告)日：2006-10-26

    申请号：US11428423

    申请日：2006-07-03

    Applicant: Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    Inventor： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    IPC: G01R31/02

    CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

    Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    Abstract translation: 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Electroform spring built on mandrel transferable to other surface
    18.
    发明申请
    Electroform spring built on mandrel transferable to other surface 失效
    电铸弹簧内置在心轴上可转移到其他表面

    公开(公告)号：US20060085976A1

    公开(公告)日：2006-04-27

    申请号：US10971489

    申请日：2004-10-22

    Applicant: Benjamin Eldridge ,  Gaetan Mathieu

    Inventor： Benjamin Eldridge ,  Gaetan Mathieu

    IPC: B23P21/00

    CPC classification number: C25D1/10 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/20 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07342 ,  G01R3/00 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/341 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/42 ,  H05K2203/0726 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/53378

    Abstract: Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later etched away. In one embodiment, the mandrel includes a form or mold area that is inserted through a plated through hole in a substrate. Plating is then performed to create the spring contact on the mold area of the mandrel as well as to attach the spring contact to the substrate. In a second embodiment, the mandrel includes a form that is initially plated to form the resilient contact structure and then attached to a region of a substrate without being inserted through the substrate. Attachment in the second embodiment can be achieved during the plating process used to form the spring contact, or by using a conductive adhesive or solder either before or after releasing the spring contact from the mandrel.

    Abstract translation: 通过将接触结构电镀在可重复使用的心轴上来制造弹性弹性接触结构，而不是在随后蚀刻掉的牺牲层上形成接触结构。 在一个实施例中，心轴包括通过衬底中的电镀通孔插入的形状或模具区域。 然后进行电镀以在心轴的模具区域上产生弹簧接触以及将弹簧接触件附接到基底。 在第二实施例中，心轴包括最初电镀以形成弹性接触结构然后在不插入衬底的情况下附着到衬底的区域的形式。 在用于形成弹簧接触的电镀工艺期间，或者在从芯棒释放弹簧接触之前或之后使用导电粘合剂或焊料，可以实现第二实施例中的附接。

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