公开(公告)号：US20130279169A1

公开(公告)日：2013-10-24

申请号：US13800260

申请日：2013-03-13

Applicant: CREE, Inc.

Inventor： Jesse Colin Reiherzer ,  Christopher P. Hussell

IPC: F21V19/00 ,  F21V23/06

CPC classification number: F21V19/001 ,  F21V23/06 ,  H01L24/32 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/15787 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Light emitter components and methods having improved electrical contacts and related methods are disclosed. In one embodiment, a light emitter component can include a submount, at least one light emitter chip on the submount, and at least one electrical contact disposed along portions of at least three external surfaces of the submount. The at least one electrical contact can be electrically connected to the at least one light emitter chip.

Abstract translation: 公开了具有改进的电触点和相关方法的发光体组件和方法。 在一个实施例中，光发射器部件可以包括底座，在底座上的至少一个光发射器芯片，以及沿着所述底座的至少三个外表面的部分设置的至少一个电触头。 所述至少一个电触头可以电连接到所述至少一个发光芯片。

公开(公告)号：US10897000B2

公开(公告)日：2021-01-19

申请号：US16380400

申请日：2019-04-10

Applicant: Cree, Inc.

Inventor： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

公开(公告)号：US10410997B2

公开(公告)日：2019-09-10

申请号：US15593042

申请日：2017-05-11

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/60 ,  H01L33/46

Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

公开(公告)号：US10290777B2

公开(公告)日：2019-05-14

申请号：US15657027

申请日：2017-07-21

Applicant: Cree, Inc.

Inventor： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

IPC: H01L33/00 ,  H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L33/58 ,  H01L33/54 ,  H01L33/56

Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

公开(公告)号：US20190027658A1

公开(公告)日：2019-01-24

申请号：US15654323

申请日：2017-07-19

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Craig William Hardin

IPC: H01L33/54 ,  H01L25/075 ,  H01L23/62

Abstract: Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.

公开(公告)号：US20180331078A1

公开(公告)日：2018-11-15

申请号：US15593042

申请日：2017-05-11

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/46

CPC classification number: H01L25/075 ,  H01L33/46 ,  H01L33/502 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058

Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

公开(公告)号：US09780268B2

公开(公告)日：2017-10-03

申请号：US13755993

申请日：2013-01-31

Applicant: CREE, Inc.

Inventor： Christopher P. Hussell ,  Erin Welch ,  Jesse Colin Reiherzer ,  Peter Scott Andrews

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In some aspects, light emitter components can include a submount with a first side having a first surface area, first and second electrical contacts disposed on the first side of the submount, and at least one light emitter chip on the first side. In some aspects, the electrical contact area can be less than half of the first surface area of the first side of the submount. Components disclosed herein can include low profile parts or domes where a ratio between a dome height and a dome width is less than 0.5. A method of providing components can include providing a panel of material and LED chips, dispensing a liquid encapsulant material over the panel, and singulating the panel into individual submount based components after the encapsulant material has hardened.

公开(公告)号：US20170069606A1

公开(公告)日：2017-03-09

申请号：US15264547

申请日：2016-09-13

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Kyle Damborsky ,  Jesse Colin Reiherzer

IPC: H01L25/075 ,  H01L33/56 ,  H01L33/54 ,  H01L33/50

Abstract: Light emitting diode (LED) devices, components and systems are provided. LED devices include a submount with a plurality of LEDs disposed thereon. The LEDs mounted on a submount can be spaced apart at predetermined dimensions to control the gaps between each of the plurality of LEDs. By controlling the gaps between LEDs the optical output from the LED device can be optimized, including improving emission and/or color uniformity, minimizing or eliminating deadspots in the light emission, and/or minimizing or eliminating an optical cross. A phosphor layer can be disposed on the plurality of LEDs and between the LEDs in the gaps therebetween.

Abstract translation: 提供发光二极管（LED）设备，组件和系统。 LED装置包括其上布置有多个LED的基座。 安装在基座上的LED可以以预定尺寸间隔开以控制多个LED中的每一个之间的间隙。 通过控制LED之间的间隙，可以优化来自LED器件的光学输出，包括改善发射和/或颜色均匀性，最小化或消除光发射中的死点，和/或最小化或消除光学十字。 磷光体层可以在它们之间的间隙中设置在多个LED上以及LED之间。

公开(公告)号：US20160254421A1

公开(公告)日：2016-09-01

申请号：US14633832

申请日：2015-02-27

Applicant: Cree, Inc.

Inventor： Jesse Colin Reiherzer

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/504 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Light emitting devices include a red solid state emitter and a blue-shifted-yellow solid state emitter that comprises a blue light emitting diode (“LED”) and an associated luminophoric medium that includes first, second and third luminescent materials that emit light having a dominant wavelength in the respective green, yellow and red color ranges. Each blue-shifted-yellow solid state emitter emits light having a color point on the 1931 CIE Chromaticity Diagram in a region defined by ccx, ccy coordinates of (0.226, 0.295), (0.295, 0.298), (0.323, 0.360), (0.344, 0.358), (0.422, 0.496), (0.391, 0.517), (0.371, 0.477), (0.506, 0.303), (0.226, 0.295). These devices emit light having a color point that is within a 4-step MacAdam ellipse of the black-body locus.

Abstract translation: 发光器件包括红色固态发射器和蓝色偏移黄色固态发射器，其包括蓝色发光二极管（“LED”）和相关联的发光介质，其包括第一，第二和第三发光材料，其发射具有 主要波长在相应的绿色，黄色和红色范围内。 每个蓝移黄色固体发射体在由ccx，ccy坐标（0.226,0.295），（0.295，0.298），（0.323,0.360），（ 0.344,0.35），（0.422,0.496），（0.391,0.517），（0.371,0.477），（0.506,0.303），（0.226,0.295）。 这些装置发射具有在黑体轨迹的4步MacAdam椭圆内的色点的光。

公开(公告)号：US09406594B2

公开(公告)日：2016-08-02

申请号：US14550443

申请日：2014-11-21

Applicant: Cree, Inc.

Inventor： Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Arthur Fong-Yuen Pun

IPC: H01L33/00 ,  H01L23/495 ,  H01L25/075 ,  H01L23/13

CPC classification number: H01L23/49575 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49541 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/32 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2924/00014

Abstract: Leadframe based light emitter components and methods are provided. In some aspects, a leadframe based light emitter component includes a leadframe element, an electrical device connected to a portion of the leadframe element, and a molded cup encasing portions of the leadframe element and the electrical device connected thereto. A method of providing a leadframe based light emitter component includes providing a leadframe element, connecting an electrical device to a portion of the leadframe element, and molding a body over portions of the leadframe element and the electrical device.

Abstract translation: 提供基于引线框架的光发射器部件和方法。 在一些方面，基于引线框架的光发射器部件包括引线框架元件，连接到引线框架元件的一部分的电气设备，以及封装引线框架元件的部分和与其连接的电气设备的模制杯。 提供基于引线框架的光发射器部件的方法包括提供引线框架元件，将电气设备连接到引线框架元件的一部分，以及在引线框架元件和电气设备的部分上模制主体。