公开(公告)号：US20190237638A1

公开(公告)日：2019-08-01

申请号：US16380400

申请日：2019-04-10

Applicant: Cree, Inc.

Inventor： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0091

Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

公开(公告)号：US09000470B2

公开(公告)日：2015-04-07

申请号：US14168561

申请日：2014-01-30

Applicant: Cree, Inc.

Inventor： Florin A. Tudorica ,  Christopher P. Hussell ,  Amber C. Abare ,  Peter Scott Andrews ,  Sung Chul Joo

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/50 ,  H01L23/00 ,  H01L25/16 ,  H01L33/52

CPC classification number: H01L25/0753 ,  H01L24/48 ,  H01L24/83 ,  H01L25/167 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10156 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2933/0041 ,  H01L2933/005

Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.

Abstract translation: 公开了用于发光二极管（LED芯片）的发光器件和相关方法。 在一个实施例中，发光器件包括衬底和布置在衬底上的LED芯片的板上（COB）阵列。 设置在其中的具有波长转换材料的层设置在LED芯片阵列上，用于形成在LED芯片激活时发光的发光表面。 在一些方面，波长转换材料包括在层的一个或多个预定部分内沉降和/或更密集地聚集的磷酸或荧光材料。 在一些方面，本文提供的装置和方法可以包括大约30lm / mm2或更大的管腔密度。

公开(公告)号：US20130322070A1

公开(公告)日：2013-12-05

申请号：US13713410

申请日：2012-12-13

Applicant: CREE, INC.

Inventor： Joseph G. Clark ,  Amber C. Abare ,  David T. Emerson ,  Jeremy S. Nevins ,  Raymond Rosado

IPC: H01L33/58 ,  H01L33/50 ,  F21V7/00 ,  F21V21/00

CPC classification number: H01L33/58 ,  F21K9/233 ,  F21V7/00 ,  F21V21/00 ,  F21Y2105/18 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.

Abstract translation: 公开了具有改进性能的光发射器封装，系统和方法。 在一个方面，光发射器封装可以包括可以包括阳极和阴极的底座。 第一光发射器芯片可以安装在阴极的至少一部分上，并且第二发光芯片可以被引线接合到阳极的至少一部分。 多个光发射器芯片可以设置在第一和第二发光器芯片之间。