Flash Memory Devices that Utilize Age-Based Verify Voltages to Increase Data Reliability and Methods of Operating Same
    11.
    发明申请
    Flash Memory Devices that Utilize Age-Based Verify Voltages to Increase Data Reliability and Methods of Operating Same 有权
    使用基于年龄的验证电压以提高数据可靠性的闪存设备和操作方法相同

    公开(公告)号:US20100002523A1

    公开(公告)日:2010-01-07

    申请号:US12558717

    申请日:2009-09-14

    IPC分类号: G11C16/06 G11C16/04

    CPC分类号: G11C16/344 G11C16/3454

    摘要: Disclosed is a method of verifying a programmed condition of a flash memory device, being comprised of: determining a level of an additional verifying voltage in response to the number of programming/erasing cycles of memory cells; conducting a verifying operation to programmed memory cells with an initial verifying voltage lower than the additional verifying voltage; and selectively conducting an additional verifying operation with the additional verifying voltage to the program-verified memory cells in response to the number of programming/erasing cycles.

    摘要翻译: 公开了一种验证闪速存储器件的编程状态的方法,其包括:响应于存储器单元的编程/擦除循环的数量确定额外的验证电压的电平; 对初始验证电压低于附加验证电压的程序存储单元执行验证操作; 以及响应于所述编程/擦除周期的数量,选择性地对所述经过程序验证的存储器单元执行附加验证电压的附加验证操作。

    METHODS OF FABRICATING MULTI-LAYER NONVOLATILE MEMORY DEVICES
    12.
    发明申请
    METHODS OF FABRICATING MULTI-LAYER NONVOLATILE MEMORY DEVICES 有权
    制造多层非易失性存储器件的方法

    公开(公告)号:US20090253257A1

    公开(公告)日:2009-10-08

    申请号:US12478538

    申请日:2009-06-04

    摘要: A nonvolatile memory device includes a semiconductor substrate having a first well region of a first conductivity type, and at least one semiconductor layer formed on the semiconductor substrate. A first cell array is formed on the semiconductor substrate, and a second cell array formed on the semiconductor layer. The semiconductor layer includes a second well region of the first conductivity type having a doping concentration greater than a doping concentration of the first well region of the first conductivity type. As the doping concentration of the second well region is increased, a resistance difference may be reduced between the first and second well regions.

    摘要翻译: 非易失性存储器件包括具有第一导电类型的第一阱区和形成在半导体衬底上的至少一个半导体层的半导体衬底。 第一单元阵列形成在半导体衬底上,第二单元阵列形成在半导体层上。 半导体层包括第一导电类型的第二阱区,其具有大于第一导电类型的第一阱区的掺杂浓度的掺杂浓度。 随着第二阱区域的掺杂浓度增加,可以在第一和第二阱区域之间减小电阻差。

    Semiconductor device and method of forming the same
    13.
    发明申请
    Semiconductor device and method of forming the same 有权
    半导体器件及其形成方法

    公开(公告)号:US20090218558A1

    公开(公告)日:2009-09-03

    申请号:US12379814

    申请日:2009-03-02

    IPC分类号: H01L47/00

    CPC分类号: H01L27/24 Y10S977/774

    摘要: A semiconductor device and a method of forming the same are provided. The method includes preparing a semiconductor substrate. Insulating layers may be sequentially formed on the semiconductor substrate. Active elements may be formed between the insulating layers. A common node may be formed in the insulating layers to be electrically connected to the active elements. The common node and the active elements may be 2-dimensionally and repeatedly arranged on the semiconductor substrate.

    摘要翻译: 提供半导体器件及其形成方法。 该方法包括制备半导体衬底。 可以在半导体衬底上依次形成绝缘层。 可以在绝缘层之间形成有源元件。 可以在绝缘层中形成公共节点以电连接到有源元件。 公共节点和有源元件可以二维重复地布置在半导体衬底上。

    Methods of Restoring Data in Flash Memory Devices and Related Flash Memory Device Memory Systems
    14.
    发明申请
    Methods of Restoring Data in Flash Memory Devices and Related Flash Memory Device Memory Systems 审中-公开
    恢复闪存设备和相关闪存设备内存系统中数据的方法

    公开(公告)号:US20090207666A1

    公开(公告)日:2009-08-20

    申请号:US12428062

    申请日:2009-04-22

    IPC分类号: G11C16/06

    CPC分类号: G11C16/349 G11C16/3495

    摘要: Methods for setting a read voltage in a memory system which comprises a flash memory device and a memory controller for controlling the flash memory device, comprise sequentially varying a distribution read voltage to read page data from the flash memory device; constituting a distribution table having a data bit number and a distribution read voltage, the data bit number indicating an erase state among the page data respectively read from the flash memory device and the distribution read voltage corresponding to the read page data; detecting distribution read voltages corresponding to data bit numbers each indicating maximum points of possible cell states of a memory cell, based on the distribution table; and defining new read voltages based on the detected distribution read voltages.

    摘要翻译: 包括闪速存储器装置和用于控制闪速存储器件的存储器控​​制器的存储器系统中设置读取电压的方法包括顺序地改变分配读取电压以从闪速存储器装置读取页面数据; 构成具有数据位数和分布读电压的分布表,分别表示从闪存器件分别读取的页数据中的擦除状态的数据位数和与读页数据相对应的分布读电压; 基于分布表,检测对应于每个表示存储器单元的可能单元状态的最大点的数据位数的分布读取电压; 以及基于检测到的分布读取电压来定义新的读取电压。

    Memory device in which memory cells having complementary data are arranged
    17.
    发明授权
    Memory device in which memory cells having complementary data are arranged 失效
    具有互补数据的存储单元被布置的存储器件

    公开(公告)号:US06961271B2

    公开(公告)日:2005-11-01

    申请号:US10620022

    申请日:2003-07-14

    CPC分类号: G11C11/405 G11C11/404

    摘要: A memory cell array block has unit memory cells comprised of pairs of memory cells, each of have a memory cell and a complementary memory cell. A second unit memory cell is interleaved with the first unit memory cell, a fourth unit memory cell is interleaved with a third unit memory cell. First and second sense amplifiers are disposed over and under the array block, respectively. The first switch connects bitlines coupled to the first unit memory cell with the first sense amplifier and connects bitlines coupled to the second unit memory cell with the second sense amplifier. The second switch connects bitlines coupled to the third unit memory cell with the first sense amplifier and connects bitlines coupled to the fourth unit memory cell with the second sense amplifier. A selected unit memory cell is selectively connected with a sense amplifier, decreasing the number of sense amplifiers.

    摘要翻译: 存储单元阵列块具有由存储单元对构成的单元存储单元,每个存储单元具有存储单元和补充存储单元。 第二单元存储单元与第一单元存储单元进行交织,第四单元存储单元与第三单元存储单元交错。 第一和第二读出放大器分别设置在阵列块的上方和下方。 第一开关将与第一单元存储单元耦合的位线与第一读出放大器连接,并将与第二单元存储单元耦合的位线与第二读出放大器相连接。 第二开关将与第三单元存储单元耦合的位线与第一读出放大器连接,并将与第四单元存储单元耦合的位线连接到第二读出放大器。 选择的单元存储单元选择性地与读出放大器连接,减少读出放大器的数量。

    Triple metal line 1T/1C ferroelectric memory device and method for fabrication thereof
    18.
    发明授权
    Triple metal line 1T/1C ferroelectric memory device and method for fabrication thereof 失效
    三重金属线1T / 1C铁电存储器件及其制造方法

    公开(公告)号:US06929997B2

    公开(公告)日:2005-08-16

    申请号:US10113622

    申请日:2002-04-02

    摘要: Disclosed is a triple metal line 1T/1C ferroelectric memory device and a method to make the same. A ferroelectric capacitor is connected to the transistor through a buried contact plug. An oxidation barrier layer lies between the contact plug and the lower electrode of the capacitor. A diffusion barrier layer covers the ferroelectric capacitor to prevent diffusion of material into or out of capacitor. As a result of forming the oxidation barrier layer, the contact plug is not exposed to the ambient oxygen atmosphere thereby providing a reliable ohmic contact between the contact plug and the lower electrode. Also, the memory device provides a triple interconnection structure made of metal, which improves device operation characteristics.

    摘要翻译: 公开了三金属线1T / 1C铁电存储器件及其制造方法。 铁电电容器通过埋入式接触插头连接到晶体管。 氧化阻挡层位于电容器的接触插塞和下电极之间。 扩散阻挡层覆盖铁电电容器以防止材料扩散进入或流出电容器。 作为形成氧化阻挡层的结果,接触塞不暴露于环境氧气氛中,从而在接触塞和下电极之间提供可靠的欧姆接触。 此外,存储器件提供由金属制成的三重互连结构,这提高了器件操作特性。

    Methods of fabricating ferroelectric memory devices having expanded plate lines
    19.
    发明申请
    Methods of fabricating ferroelectric memory devices having expanded plate lines 有权
    制造具有扩展板线的铁电存储器件的方法

    公开(公告)号:US20050117382A1

    公开(公告)日:2005-06-02

    申请号:US11029232

    申请日:2005-01-04

    摘要: A ferroelectric memory device includes a microelectronic substrate and a plurality of ferroelectric capacitors on the substrate, arranged as a plurality of rows and columns in respective row and column directions. A plurality of parallel plate lines overlie the ferroelectric capacitors and extend along the row direction, wherein a plate line contacts ferroelectric capacitors in at least two adjacent rows. The plurality of plate lines may include a plurality of local plate lines, and the ferroelectric memory device may further include an insulating layer disposed on the local plate lines and a plurality of main plate lines disposed on the insulating layer and contacting the local plate lines through openings in the insulating layer. In some embodiments, ferroelectric capacitors in adjacent rows share a common upper electrode, and respective ones of the local plate lines are disposed on respective ones of the common upper electrodes. Ferroelectric capacitors in adjacent rows may share a common ferroelectric dielectric region. Related fabrication methods are discussed.

    摘要翻译: 铁电存储器件包括微电子衬底和在衬底上的多个铁电电容器,其被布置为在行和列方向上的多个行和列。 多个平行板线覆盖在铁电电容器上并沿着行方向延伸,其中板线在至少两个相邻行中接触铁电电容器。 多个板线可以包括多个局部板线,并且铁电存储器件还可以包括设置在局部板线上的绝缘层和设置在绝缘层上的多个主板线,并且使本地板线通过 绝缘层中的开口。 在一些实施例中,相邻行中的铁电电容器共享公共上电极,并且各自的局部板线设置在相应的公共上电极上。 相邻行中的铁电电容器可以共享公共铁电电介质区域。 讨论相关的制造方法。

    Methods of fabricating integrated circuit ferroelectric memory devices including plate lines directly on ferroelectric capacitors
    20.
    发明申请
    Methods of fabricating integrated circuit ferroelectric memory devices including plate lines directly on ferroelectric capacitors 有权
    制造集成电路铁电存储器件的方法,包括直接在铁电电容器上的板线

    公开(公告)号:US20050077561A1

    公开(公告)日:2005-04-14

    申请号:US10967936

    申请日:2004-10-19

    摘要: Integrated circuit ferroelectric memory devices are provided that include an integrated circuit transistor. The memory device further includes a ferroelectric capacitor on the integrated circuit transistor. The ferroelectric capacitor includes a first electrode adjacent the transistor, a second electrode remote from the transistor and a ferroelectric film therebetween. The memory device further includes a plate line directly on the ferroelectric capacitor. Methods are also provided that include forming a ferroelectric capacitor on the integrated circuit transistor and forming a plate line directly on the ferroelectric capacitor.

    摘要翻译: 提供了包括集成电路晶体管的集成电路铁电存储器件。 存储器件还包括集成电路晶体管上的铁电电容器。 铁电电容器包括与晶体管相邻的第一电极,远离晶体管的第二电极和其间的铁电体膜。 存储装置还包括直接在铁电电容器上的板线。 还提供了包括在集成电路晶体管上形成铁电电容器并且在铁电电容器上直接形成板线的方法。