公开(公告)号：US20130201596A1

公开(公告)日：2013-08-08

申请号：US13364463

申请日：2012-02-02

申请人： Chia-Ho Chen ,  Ming Huei Lien ,  Shu-Fen Wu ,  Chih-Tsung Lee ,  You-Hua Chou

发明人： Chia-Ho Chen ,  Ming Huei Lien ,  Shu-Fen Wu ,  Chih-Tsung Lee ,  You-Hua Chou

IPC分类号： H01L21/683

CPC分类号： H01L21/6833 ,  H01L21/6831 ,  H02N13/00

摘要： An electrostatic chuck for clamping a warped workpiece has a clamping surface comprising a dielectric layer. The dielectric layer has a field and one or more zones formed of differing dielectric materials. One or more electrodes are coupled to a power supply, and a controller controls a clamping voltage supplied to the one or more electrodes via the power supply. An electrostatic attraction force associated with each of the field and one or more zones of the dielectric layer of the electrostatic chuck is induced, wherein the electrostatic attraction force varies based on the dielectric material of each of the field and one or more zones. The electrostatic attraction force is greater in the one or more zones than in the field, therein attracting warped regions of the workpiece to the clamping surface and clamping the warped workpiece to the clamping surface across a surface of the warped workpiece.

摘要翻译： 用于夹紧翘曲工件的静电卡盘具有包括电介质层的夹紧表面。 电介质层具有由不同介电材料形成的场和一个或多个区域。 一个或多个电极耦合到电源，并且控制器经由电源控制提供给一个或多个电极的钳位电压。 诱发与静电卡盘的电介质层的场和一个或多个区域中的每一个相关联的静电吸引力，其中静电吸引力基于场和一个或多个区域中的每一个的介电材料而变化。 在一个或多个区域中的静电吸引力比现场更大，其中将工件的翘曲区域吸引到夹紧表面，并将经弯曲的工件夹紧到穿过弯曲的工件的表面的夹紧表面。

公开(公告)号：US20130186338A1

公开(公告)日：2013-07-25

申请号：US13355770

申请日：2012-01-23

申请人： Ming-Chin Tsai ,  Bo-Hung Lin ,  You-Hua Chou ,  Chung-En Kao

发明人： Ming-Chin Tsai ,  Bo-Hung Lin ,  You-Hua Chou ,  Chung-En Kao

IPC分类号： C23C16/46 ,  F27D11/12

CPC分类号： H01L21/324 ,  C23C14/50 ,  C23C14/541 ,  C23C14/5806 ,  H01L21/67115 ,  H01L21/76838

摘要： The present disclosure is directed to a physical vapor deposition system configured to heat a semiconductor substrate or wafer. In some embodiments the disclosed physical vapor deposition system comprises at least one heat source having one or more lamp modules for heating of the substrate. The lamp modules may be separated from the substrate by a shielding device. In some embodiments, the shielding device comprises a one-piece device or a two piece device. The disclosed physical vapor deposition system can heat the semiconductor substrate, reflowing a metal film deposited thereon without the necessity for separate chambers, thereby decreasing process time, requiring less thermal budget, and decreasing substrate damage.

摘要翻译： 本公开涉及被配置为加热半导体衬底或晶片的物理气相沉积系统。 在一些实施例中，所公开的物理气相沉积系统包括至少一个热源，其具有用于加热基底的一个或多个灯模块。 灯模块可以通过屏蔽装置与衬底分离。 在一些实施例中，屏蔽装置包括一件式装置或两件式装置。 所公开的物理气相沉积系统可以加热半导体衬底，回流沉积在其上的金属膜，而不需要单独的室，从而减少处理时间，需要较少的热量预算和减少衬底损伤。

公开(公告)号：US20130135784A1

公开(公告)日：2013-05-30

申请号：US13307089

申请日：2011-11-30

申请人： Chung-En Kao ,  You-Hua Chou ,  Chih-Tsung Lee ,  Ming-Shiou Kuo

发明人： Chung-En Kao ,  You-Hua Chou ,  Chih-Tsung Lee ,  Ming-Shiou Kuo

IPC分类号： B25J11/00 ,  H01L21/687 ,  B25J15/00 ,  B25J17/00 ,  B25J18/00

CPC分类号： H01L21/6831 ,  H01L21/67742

摘要： A workpiece transfer system has a plurality of joints having a bearing and a primary and secondary transformer coil, wherein power provided to the primary transformer coil and secondary transformer coil of each joint produces mutual inductance between the primary and secondary transformer coil of the respective joint. A first pair of arms are rotatably coupled to a blade by a first pair of the joints, wherein the primary transformer coil of each of the first pair of joints is operably coupled to the first pair of arms, and the secondary transformer coil of each of the first pair of joints is operably coupled to the blade and an electrode beneath a dielectric workpiece retaining surface of the blade. The electrode is contactlessly energized through the transformer coils of the joint and the blade can chuck and de-chuck a workpiece by reversing current directions and by voltage adjustment.

摘要翻译： 工件传送系统具有多个具有轴承和初级和次级变压器线圈的接头，其中提供给每个接头的初级变压器线圈和次级变压器线圈的功率在相应接头的主变压器线圈和次级变压器线圈之间产生互感。 第一对臂通过第一对接头可旋转地联接到叶片，其中第一对接头中的每一个的主变压器线圈可操作地耦合到第一对臂，并且每个臂的次级变压器线圈 第一对接头可操作地联接到叶片和位于叶片的介电工件保持表面下方的电极。 电极通过接头的变压器线圈非接触地通电，并且刀片可以通过反向电流方向和电压调节来夹紧和去夹紧工件。

公开(公告)号：US20070190742A1

公开(公告)日：2007-08-16

申请号：US11354952

申请日：2006-02-16

申请人： You-Hua Chou ,  Hung Chang ,  Chin Lan ,  Yi-Ming Chen

发明人： You-Hua Chou ,  Hung Chang ,  Chin Lan ,  Yi-Ming Chen

IPC分类号： H01L21/76

CPC分类号： H01L21/76232

摘要： A semiconductor device and method of manufacturing include an STI trench having a low-k dielectric material as a liner oxide layer and a bulk oxide trench fill layer.

摘要翻译： 半导体器件和制造方法包括具有低k电介质材料作为衬垫氧化物层的STI沟槽和主体氧化物沟槽填充层。

公开(公告)号：US09026241B2

公开(公告)日：2015-05-05

申请号：US13404676

申请日：2012-02-24

申请人： Wen-Cheng Yang ,  Chung-En Kao ,  You-Hua Chou ,  Ming-Chih Tsai ,  Chen-Chia Chiang ,  Bo-Hung Lin ,  Chin-Hsiang Lin

发明人： Wen-Cheng Yang ,  Chung-En Kao ,  You-Hua Chou ,  Ming-Chih Tsai ,  Chen-Chia Chiang ,  Bo-Hung Lin ,  Chin-Hsiang Lin

IPC分类号： G06F19/00 ,  G05B9/03

CPC分类号： G05B9/03 ,  G05B23/0237 ,  G05B2219/37533 ,  G05B2219/45031

摘要： The present disclosure relates to semiconductor tool monitoring system having multiple sensors configured to concurrently and independently monitor processing conditions of a semiconductor manufacturing tool. In some embodiments, the disclosed tool monitoring system comprises a first sensor system configured to monitor one or more processing conditions of a semiconductor manufacturing tool and to generate a first monitoring response based thereupon. A redundant, second sensor system is configured to concurrently monitor the one or more processing conditions of the manufacturing tool and to generate a second monitoring response based thereupon. A comparison element is configured to compare the first and second monitoring responses, and if the responses deviate from one another (e.g., have a deviation greater than a threshold value) to generate a warning signal. By comparing the first and second monitoring responses, errors in the sensor systems can be detected in real time, thereby preventing yield loss.

摘要翻译： 本公开涉及具有多个传感器的半导体工具监视系统，其被配置为同时且独立地监视半导体制造工具的处理条件。 在一些实施例中，所公开的工具监控系统包括被配置为监视半导体制造工具的一个或多个处理条件并基于此产生第一监视响应的第一传感器系统。 冗余的第二传感器系统被配置为同时监视制造工具的一个或多个处理条件并且基于此产生第二监视响应。 比较元件被配置为比较第一和第二监测响应，以及如果响应彼此偏离（例如，具有大于阈值的偏差）以产生警告信号。 通过比较第一和第二监测响应，可以实时检测传感器系统中的误差，从而防止产量损失。

公开(公告)号：US08941232B2

公开(公告)日：2015-01-27

申请号：US13034263

申请日：2011-02-24

申请人： You-Hua Chou ,  Yi-Jen Lai ,  Chun-Jen Chen ,  Perre Kao

发明人： You-Hua Chou ,  Yi-Jen Lai ,  Chun-Jen Chen ,  Perre Kao

IPC分类号： H01L23/34 ,  H01L23/367 ,  H01L23/42

CPC分类号： H01L23/473 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/48 ,  H01L23/488 ,  H01L24/11 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/11849 ,  H01L2224/16145 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00

摘要： The mechanisms for forming metal bumps to connect to a cooling device (or a heat sink) described herein enable substrates with devices to dissipate heat generated more efficiently. In addition, the metal bumps allow customization of bump designs to meet the needs of different chips. Further, the usage of metal bumps between the semiconductor chip and cooling device enables advanced cooling by passing a cooling fluid between the bumps.

摘要翻译： 用于形成连接到本文所述的冷却装置（或散热器）的金属凸块的机构使得具有装置的基板能够更有效地散发产生的热量。 此外，金属凸块允许定制凹凸设计以满足不同芯片的需要。 此外，半导体芯片和冷却装置之间的金属凸块的使用能够通过在凸块之间传递冷却流体而进行先进的冷却。

公开(公告)号：US08541262B2

公开(公告)日：2013-09-24

申请号：US12874816

申请日：2010-09-02

申请人： Yi-Jen Lai ,  You-Hua Chou ,  Hon-Lin Huang ,  Huai-Tei Yang

发明人： Yi-Jen Lai ,  You-Hua Chou ,  Hon-Lin Huang ,  Huai-Tei Yang

IPC分类号： H01L23/50

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/03823 ,  H01L2224/03825 ,  H01L2224/0401 ,  H01L2224/05006 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05655 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/01046 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor device utilizing die edge contacts is provided. An integrated circuit die has a post-passivation layer with a trench filled with a conductive material extending from a contact to a die edge, thereby forming a die edge contact. Optionally, a through substrate via may be positioned along the die edge such that the conductive material in the trench is electrically coupled to the through-substrate via, thereby forming a larger die edge contact. The integrated circuit die may be placed in a multi-die package wherein the multi-die package includes walls having a major surface perpendicular to a major surface of the integrated circuit die. The die edge contacts are electrically coupled to contacts on the walls of the multi-die package. The multi-die package may include edge contacts for connecting to another substrate, such as a printed circuit board, a packaging substrate, a high-density interconnect, or the like.

公开(公告)号：US20130226327A1

公开(公告)日：2013-08-29

申请号：US13404676

申请日：2012-02-24

申请人： Wen-Cheng Yang ,  Chung-En Kao ,  You-Hua Chou ,  Ming-Chih Tsai ,  Chen-Chia Chiang ,  Bo-Hung Lin ,  Chin-Hsiang Lin

发明人： Wen-Cheng Yang ,  Chung-En Kao ,  You-Hua Chou ,  Ming-Chih Tsai ,  Chen-Chia Chiang ,  Bo-Hung Lin ,  Chin-Hsiang Lin

IPC分类号： G06F19/00 ,  G06F15/00

CPC分类号： G05B9/03 ,  G05B23/0237 ,  G05B2219/37533 ,  G05B2219/45031

摘要： The present disclosure relates to semiconductor tool monitoring system having multiple sensors configured to concurrently and independently monitor processing conditions of a semiconductor manufacturing tool. In some embodiments, the disclosed tool monitoring system comprises a first sensor system configured to monitor one or more processing conditions of a semiconductor manufacturing tool and to generate a first monitoring response based thereupon. A redundant, second sensor system is configured to concurrently monitor the one or more processing conditions of the manufacturing tool and to generate a second monitoring response based thereupon. A comparison element is configured to compare the first and second monitoring responses, and if the responses deviate from one another (e.g., have a deviation greater than a threshold value) to generate a warning signal. By comparing the first and second monitoring responses, errors in the sensor systems can be detected in real time, thereby preventing yield loss.

摘要翻译： 本公开涉及具有多个传感器的半导体工具监视系统，其被配置为同时且独立地监视半导体制造工具的处理条件。 在一些实施例中，所公开的工具监控系统包括被配置为监视半导体制造工具的一个或多个处理条件并基于此产生第一监视响应的第一传感器系统。 冗余的第二传感器系统被配置为同时监视制造工具的一个或多个处理条件并且基于此产生第二监视响应。 比较元件被配置为比较第一和第二监测响应，以及如果响应彼此偏离（例如，具有大于阈值的偏差）以产生警告信号。 通过比较第一和第二监测响应，可以实时检测传感器系统中的误差，从而防止产量损失。

公开(公告)号：US20130069233A1

公开(公告)日：2013-03-21

申请号：US13234299

申请日：2011-09-16

申请人： You-Hua Chou ,  Min Hao Hong ,  Jian-Shin Tsai ,  Miao-Cheng Liao ,  Hsiang Hsiang Ko

发明人： You-Hua Chou ,  Min Hao Hong ,  Jian-Shin Tsai ,  Miao-Cheng Liao ,  Hsiang Hsiang Ko

IPC分类号： H01L23/52 ,  H01L21/768

CPC分类号： H01L23/53238 ,  H01L21/768 ,  H01L21/76841 ,  H01L21/76852 ,  H01L21/76885 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present disclosure relates to a method of forming a back-end-of-the-line metallization layer. The method is performed by forming a plurality of freestanding metal layer structures (i.e., metal layer structures not surrounded by a dielectric material) on a semiconductor substrate within an area defined by a patterned photoresist layer. A diffusion barrier layer is deposited onto the metal layer structure in a manner such that the diffusion barrier layer conforms to the top and sides of the metal layer structure. A dielectric material is formed on the surface of the substrate to fill areas between metal layer structures. The substrate is planarized to remove excess metal and dielectric material and to expose the top of the metal layer structure.

公开(公告)号：US09287154B2

公开(公告)日：2016-03-15

申请号：US13486025

申请日：2012-06-01

申请人： Ming Huei Lien ,  Chia-Ho Chen ,  Shu-Fen Wu ,  Chih-Tsung Lee ,  You-Hua Chou

发明人： Ming Huei Lien ,  Chia-Ho Chen ,  Shu-Fen Wu ,  Chih-Tsung Lee ,  You-Hua Chou

IPC分类号： H01L21/677 ,  H01L21/68 ,  H01L21/67 ,  H01L21/3105

CPC分类号： H01L21/6776 ,  H01L21/3105 ,  H01L21/67115

摘要： Embodiments of an ultraviolet (UV) curing system for treating a semiconductor substrate such as a wafer are disclosed. The curing system generally includes a processing chamber, a wafer support for holding a wafer in the chamber, a UV radiation source disposed above the chamber, and a UV transparent window interspersed between the radiation source and wafer support. In one embodiment, the wafer support is provided by a belt conveyor operable to transport wafers through the chamber during UV curing. In another embodiment, the UV radiation source is a movable lamp unit that travels across the top of the chamber for irradiating the wafer. In another embodiment, the UV transparent window includes a UV radiation modifier that reduces the intensity of UV radiation on portions of the wafer positioned below the modifier. Various embodiments enhance wafer curing uniformity by normalizing UV intensity levels on the wafer.

摘要翻译： 公开了用于处理诸如晶片的半导体衬底的紫外（UV）固化系统的实施例。 固化系统通常包括处理室，用于在室中保持晶片的晶片支撑件，设置在室上方的UV辐射源，以及散布在辐射源和晶片支撑件之间的UV透明窗口。 在一个实施例中，晶片支撑件由带式输送机提供，其可操作以在UV固化期间将晶片传送通过室。 在另一个实施例中，UV辐射源是可移动的灯单元，其移动穿过室的顶部以照射晶片。 在另一个实施方案中，UV透明窗口包括UV辐射调节剂，其降低位于调节剂下方的晶片部分上的UV辐射强度。 各种实施例通过使晶片上的UV强度水平归一化来增强晶片固化均匀性。