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公开(公告)号：US20190035763A1
公开(公告)日：2019-01-31
申请号：US16085515
申请日：2017-04-25
Applicant: DEXERIALS CORPORATION
Inventor： Reiji TSUKAO , Yasushi AKUTSU
Abstract: An anisotropic conductive film capable of accommodating bumps with a narrow pitch and reducing the number density of conductive particles. In an anisotropic conductive film, conductive particles are disposed in an insulating resin binder as follows. Specifically, the conductive particles are rows of conductive particles arranged in single rows with spacing therebetween; and repeating units of conductive particles formed by juxtaposition of different numbers of conductive particles are disposed repeatedly over the entire surface of the anisotropic conductive film.
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公开(公告)号：US20180269176A1
公开(公告)日：2018-09-20
申请号：US15988065
申请日：2018-05-24
Applicant: DEXERIALS CORPORATION
Inventor： Yasushi AKUTSU
IPC: H01L23/00
CPC classification number: H01L24/32 , H01L24/29 , H01L24/83 , H01L2224/29082 , H01L2224/29499 , H01L2224/32225 , H01L2224/83203 , H01L2224/83851
Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.
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公开(公告)号：US20180022968A1
公开(公告)日：2018-01-25
申请号：US15546150
申请日：2016-03-18
Applicant: DEXERIALS CORPORATION
Inventor： Shigeyuki YOSHIZAWA , Masao SAITO , Yasushi AKUTSU
Abstract: Provided is an anisotropic conductive film that allows conductive particles to be sufficiently captured even by connecting terminals disposed at a fine pitch and can suppress a short circuit, and in particular, that can suppress variation of conduction resistance of a connection portion even when partial contact is caused by a thermal pressing tool during anisotropic conductive connection. In an anisotropic conductive film 1A, an insulating adhesive layer 3 contains conductive particles 2. The conductive particles 2 have an aspect ratio of 1.2 or more and are dispersed without being in contact with each other as viewed in a plan view, and an angle formed between a film surface S of the anisotropic conductive film 1A and a major axis direction of each of the conductive particles 2 is less than 40°. The anisotropic conductive film 1A preferably contains columnar conductive glass particles as the conductive particles 2.
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公开(公告)号：US20160345442A1
公开(公告)日：2016-11-24
申请号：US15114664
申请日：2015-02-03
Applicant: DEXERIALS CORPORATION
Inventor： Reiji TSUKAO , Yasushi AKUTSU
IPC: H05K3/32 , H01L23/00 , C09D171/12
CPC classification number: H05K3/323 , C08L63/00 , C09D171/12 , C09J4/00 , C09J11/00 , C09J163/00 , C09J201/00 , H01L24/27 , H01L24/29 , H01L2224/27515 , H01L2224/29082 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/29444 , H01L2224/32225 , H01L2224/73204 , H01L2924/0665
Abstract: An anisotropic conductive film having a multilayer structure having conductive particles arranged in a single layer has a first connection layer and a second connection layer formed on a surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermally or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a side of the second connection layer, the conductive particles for anisotropic conductive connection are arranged in a single layer, and the first connection layer contains an insulating filler.
Abstract translation: 具有布置在单层中的具有导电颗粒的多层结构的各向异性导电膜具有形成在第一连接层的表面上的第一连接层和第二连接层。 第一连接层是光聚合树脂层，第二连接层是热或光阳离子，阴离子或可自由基聚合的树脂层。 在第二连接层一侧的第一连接层的表面上，用于各向异性导电连接的导电颗粒被布置在单层中，并且第一连接层包含绝缘填料。
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公开(公告)号：US20220135753A1
公开(公告)日：2022-05-05
申请号：US17513432
申请日：2021-10-28
Applicant: DEXERIALS CORPORATION
Inventor： Yasushi AKUTSU , Reiji TSUKAO
Abstract: A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.
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Patent Agency Ranking
公开(公告)号：US20180277505A1
公开(公告)日：2018-09-27
申请号：US15571241
申请日：2016-05-27
Applicant: DEXERIALS CORPORATION
Inventor： Shinichi HAYASHI , Masao SAITO , Yasushi AKUTSU , Reiji TSUKAO
CPC classification number: H01L24/29 , C08K3/36 , C08K2201/001 , C09J7/10 , C09J9/02 , C09J163/00 , C09J2201/28 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2471/00 , H01L2224/29076 , H01L2224/29291 , H01L2224/293
Abstract: An anisotropic conductive film includes an insulating adhesive layer and conductive particles disposed thereon. Arrangement axes of the conductive particles having a particle pitch extend in a widthwise direction of the film, and the axes are sequentially arranged with an axis pitch in a lengthwise direction of the film. The particle pitch, axis pitch of the axes, and an angle θ of the axes relative the widthwise direction of the film are determined according to external shapes of terminals so 3 to 40 conductive particles are present on each terminal when a terminal arrangement region of an electronic component is superimposed on the film so a lengthwise direction of each terminal is aligned with the widthwise direction of the film. By using the film, stable connection reliability is obtained and an excessive increase in the density of the conductive particles is suppressed even in the connection of fine pitches.
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17.发明申请公开(公告)号：US20180218990A1
公开(公告)日：2018-08-02
申请号：US15542343
申请日：2016-01-13
Applicant: DEXERIALS CORPORATION
Inventor： Yasushi AKUTSU , Tomoyuki ISHIMATSU
IPC: H01L23/00
Abstract: A bump-forming film is used for forming, on a semiconductor device such as a bumpless IC chip, bumps which are low in cost and can achieve stable conduction reliability. The bump-forming film is configured such that conductive fillers for bumps are arranged regularly in a planar view in an insulating adhesive resin layer. The regular arrangement has a periodic repeating unit in the longitudinal direction of the film. The straight line which connects one ends of the conductive fillers for bumps in the thickness direction of the film is substantially parallel to the surface of the film.
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公开(公告)号：US20170352967A1
公开(公告)日：2017-12-07
申请号：US15538525
申请日：2015-12-22
Applicant: DEXERIALS CORPORATION
Inventor： Shinichi HAYASHI , Masao SAITO , Reiji TSUKAO , Yasushi AKUTSU
CPC classification number: H01R11/01 , H01B1/20 , H01B5/14 , H01R13/2414 , H05K3/323
Abstract: An anisotropic electrically conductive film that is suitable for use in fine-pitch FOG connections and COG connections and that also can reduce increases in production costs associated with increasing the electrically conductive particle density. The anisotropic electrically conductive film includes an electrically insulating adhesive layer and electrically conductive particles disposed within the electrically insulating adhesive layer. The anisotropic electrically conductive film has electrically conductive particle disposition regions that are disposed in a manner corresponding to the arrangement of terminals of electronic components to be connected. The electrically conductive particle disposition regions are formed periodically in the longitudinal direction of the anisotropic electrically conductive film. The anisotropic electrically conductive film also has buffer regions in which no electrically conductive particles are disposed that are formed between adjacent electrically conductive particle disposition regions for connection.
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公开(公告)号：US20170317047A1
公开(公告)日：2017-11-02
申请号：US15523438
申请日：2015-11-17
Applicant: DEXERIALS CORPORATION
Inventor： Yasushi AKUTSU
IPC: H01L23/00
CPC classification number: H01L24/32 , H01L24/29 , H01L24/83 , H01L2224/29082 , H01L2224/29499 , H01L2224/32225 , H01L2224/83203 , H01L2224/83851
Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.
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公开(公告)号：US20170162529A1
公开(公告)日：2017-06-08
申请号：US15316649
申请日：2015-05-08
Applicant: DEXERIALS CORPORATION
Inventor： Seiichiro SHINOHARA , Yasushi AKUTSU
IPC: H01L23/00
CPC classification number: H01L24/29 , C08K2201/001 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H01B1/22 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/73204 , H01L2224/83101 , H01L2224/8312 , H01L2224/83203 , H01L2224/83851 , H01L2224/83874 , H01L2224/8388 , H01L2224/83885 , H01L2924/00014 , H01L2924/14 , H05K3/323 , H01L2224/13099
Abstract: In order to easily inspect a dispersion state of conductive particles in such an anisotropic conductive film that the conductive particles are dispersed even at high density, linear lines including no conductive particle in a plan view of an anisotropic conductive film including an insulating adhesive layer and conductive particles dispersed in the insulating adhesive layer are allowed to exist at predetermined intervals. Specifically, the conductive particles are disposed in a lattice so as to be arranged in a first arrangement direction and a second arrangement direction, and the disappearance lines are inclined relative to the first arrangement direction or the second arrangement direction.
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