High-purity tungsten hexacarbonyl for solid source delivery

    公开(公告)号:US10526697B2

    公开(公告)日:2020-01-07

    申请号:US15556102

    申请日:2016-02-28

    Applicant: ENTEGRIS, INC.

    Abstract: A solid source material is described for forming a tungsten-containing film. The solid source material is tungsten hexacarbonyl, wherein content of molybdenum is less than 1000 ppm. Such solid source material may be formed by a process including provision of particulate tungsten hexacarbonyl raw material of particles of size less than 5 mm, wherein particles of size greater than 1.4 mm are less than 15% of the particles, and wherein content of molybdenum is less than 1000 ppm, and sintering the particulate tungsten hexacarbonyl raw material at temperature below 100° C. to produce the solid source material as a sintered solid.

    FLUORINE FREE TUNGSTEN ALD/CVD PROCESS
    15.
    发明申请
    FLUORINE FREE TUNGSTEN ALD/CVD PROCESS 有权
    无氟化学气相沉积/ CVD工艺

    公开(公告)号:US20150251920A1

    公开(公告)日:2015-09-10

    申请号:US14431116

    申请日:2013-09-26

    Applicant: ENTEGRIS, INC.

    Abstract: A tungsten precursor useful for forming tungsten-containing material on a substrate, e.g., in the manufacture of microelectronic devices. The tungsten precursor is devoid of fluorine content, and may be utilized in a solid delivery process or other vapor deposition technique, to form films such as elemental tungsten for metallization of integrated circuits, or tungsten nitride films or other tungsten compound films that are useful as base layers for subsequent elemental tungsten metallization.

    Abstract translation: 用于在衬底上形成含钨材料的钨前体,例如在微电子器件的制造中。 钨前体没有氟含量,并且可以用于固体递送过程或其它气相沉积技术,以形成诸如用于集成电路金属化的元素钨,或氮化钨膜或其它钨化合物膜的膜,其可用作 用于随后的元素钨金属化的基础层。

    TUNGSTEN PRECURSORS AND RELATED METHODS
    16.
    发明公开

    公开(公告)号:US20240116774A1

    公开(公告)日:2024-04-11

    申请号:US18376476

    申请日:2023-10-04

    Applicant: ENTEGRIS, INC.

    CPC classification number: C01G41/04

    Abstract: A precursor comprises a tungsten precursor and a carbon-containing material. The precursor comprises less than 0.02% by weight of the carbon-containing material based on a total weight of the precursor. A method for purifying a tungsten precursor may comprise at least one of the following steps: obtaining a source vessel containing a tungsten precursor and a carbon-containing material; separating the tungsten precursor from at least a first portion of the carbon-containing material; recovering a precursor in a collection vessel; or any combination thereof.

    Method and apparatus to help promote contact of gas with vaporized material

    公开(公告)号:US10465286B2

    公开(公告)日:2019-11-05

    申请号:US15295662

    申请日:2016-10-17

    Applicant: Entegris, Inc.

    Abstract: Vaporizable material is supported within a vessel to promote contact of an introduced gas with the vaporizable material, and produce a product gas including vaporized material. A heating element supplies heat to a wall of the vessel to heat vaporizable material disposed therein. The vessel may include an ampoule having a removable top. Multiple containers defining multiple material support surfaces may be stacked disposed within a vessel in thermal communication with the vessel. A tube may be disposed within the vessel and coupled to a gas inlet. Filters, flow meters, and level sensors may be further provided. Product gas resulting from contact of introduced gas with vaporized material may be delivered to atomic layer deposition (ALD) or similar process equipment. At least a portion of source material including a solid may be dissolved in a solvent, followed by removal of solvent to yield source material (e.g., a metal complex) disposed within the vaporizer.

    Solid vaporizer
    20.
    发明授权

    公开(公告)号:US10392700B2

    公开(公告)日:2019-08-27

    申请号:US15525796

    申请日:2015-03-28

    Applicant: ENTEGRIS, INC.

    Abstract: Vaporizers are described, suited for vaporizing a vaporizable solid source materials to form vapor for subsequent use, e.g., a deposition of metal from organometallic source material vapor on a substrate for manufacture of integrated circuitry, LEDs, photovoltaic panels, and the like. Methods are described of fabricating such vaporizers, including methods of reconfiguring up-flow vaporizers for down-flow operation to accommodate higher flow rate solid delivery of source material vapor in applications requiring same.

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