公开(公告)号：US20230045851A1

公开(公告)日：2023-02-16

申请号：US17903158

申请日：2022-09-06

Applicant: FUJIFILM CORPORATION

Inventor： Naohiro TANGO ,  Michihiro SHIRAKAWA ,  Kyohei SAKITA ,  Akiyoshi GOTO ,  Kazunari YAGI ,  Mitsuhiro FUJITA

IPC: G03F7/039

Abstract: A method for producing a resist composition includes setting parameter, acquiring a pattern size for a regression analysis, analyzing performing a regression analysis, calculating a pattern size of a target resist composition based on the regression analysis, comparing the pattern size of the target resist composition and the target pattern size, determining a formulating amount of the resist composition in a case where a difference between the pattern size of the target resist composition and the target pattern size is within an allowable range, and producing a resist composition based on the determined formulating amount, in which, in a case where the difference is out of the allowable range, the method further includes changing at least the content of components in the target resist composition, and the formulating amount of the resist composition is determined based on the changed physical quantity to produce the resist composition.

公开(公告)号：US20180081277A1

公开(公告)日：2018-03-22

申请号：US15823593

申请日：2017-11-28

Applicant: FUJIFILM Corporation

Inventor： Naoki INOUE ,  Naohiro TANGO ,  Kei YAMAMOTO ,  Michihiro SHIRAKAWA ,  Akiyoshi GOTO

IPC: G03F7/32 ,  G03F7/11

CPC classification number: G03F7/32 ,  G03F7/091 ,  G03F7/11 ,  G03F7/325

Abstract: Provided are a pattern forming method including a step of applying a composition for forming an upper layer film, containing a resin having a C log P(Poly) of 3.0 or more and at least one compound selected from the group consisting of (A1) to (A4) described in the specification onto a resist film to form an upper layer film, a step of exposing the resist film, and a step of developing the exposed resist film with a developer including an organic solvent; a resist pattern formed by the pattern forming method; a method for manufacturing an electronic device, including the pattern forming method; and the composition for forming an upper layer film.

公开(公告)号：US20170184970A1

公开(公告)日：2017-06-29

申请号：US15461586

申请日：2017-03-17

Applicant: FUJIFILM Corporation

Inventor： Akiyoshi GOTO ,  Naoki INOUE ,  Kei YAMAMOTO ,  Naohiro TANGO ,  Michihiro SHIRAKAWA

IPC: G03F7/11 ,  C09D133/14 ,  C08F220/18 ,  C08F220/28 ,  G03F7/40 ,  G03F7/09 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  C09D133/08 ,  G03F7/004

Abstract: Provided are a pattern forming method capable of providing good DOF, EL, and watermark defect performance, a resist pattern formed by the pattern forming method, a composition for forming an upper layer film, used in the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method. The pattern forming method includes a step a of coating an active-light-sensitive or radiation-sensitive resin composition onto a substrate to forming a resist film, a step b of coating a composition for forming an upper layer film onto the resist film to form an upper layer film on the resist film, a step c of exposing the resist film having the upper layer film formed thereon, and a step d of developing the exposed resist film using a developer including an organic solvent to form a pattern, in which a receding contact angle of water on a surface of the upper layer film is 80° or more.

公开(公告)号：US20170176862A1

公开(公告)日：2017-06-22

申请号：US15446695

申请日：2017-03-01

Applicant: FUJIFILM Corporation

Inventor： Naoki INOUE ,  Naohiro TANGO ,  Kei YAMAMOTO ,  Michihiro SHIRAKAWA ,  Akiyoshi GOTO

IPC: G03F7/11 ,  G03F7/16 ,  G03F7/09 ,  G03F7/039 ,  G03F7/38 ,  G03F7/32 ,  G03F7/40 ,  G03F7/038 ,  C09D133/08 ,  G03F7/20

CPC classification number: G03F7/11 ,  C08F2/48 ,  C08F220/18 ,  C09D133/08 ,  C09D133/10 ,  G03F7/038 ,  G03F7/039 ,  G03F7/0397 ,  G03F7/091 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/325 ,  G03F7/327 ,  G03F7/38 ,  G03F7/40 ,  C08F2220/283 ,  C08F2220/1875 ,  C08F2220/185

Abstract: A pattern forming method includes coating an actinic ray-sensitive or radiation-sensitive resin composition onto a substrate to form an actinic ray-sensitive or radiation-sensitive film, coating a composition for forming a protective film onto the actinic ray-sensitive or radiation-sensitive film to form a protective film, exposing the actinic ray-sensitive or radiation-sensitive film covered with the protective film, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer containing an organic solvent, in which the protective film contains a compound (A) including at least one group or bond selected from the group consisting of an ether bond, a thioether bond, a hydroxyl group, a thiol group, a carbonyl bond, and an ester bond, and a resin (X).

公开(公告)号：US20140212814A1

公开(公告)日：2014-07-31

申请号：US14229190

申请日：2014-03-28

Applicant: FUJIFILM Corporation

Inventor： Junichi ITO ,  Akinori SHIBUYA ,  Tomoki MATSUDA ,  Yoko TOKUGAWA ,  Toshiaki FUKUHARA ,  Naohiro TANGO ,  Kaoru IWATO ,  Masahiro YOSHIDOME ,  Shinichi SUGIYAMA ,  Shohei KATAOKA

IPC: G03F7/027

CPC classification number: G03F7/027 ,  C07C309/06 ,  C07C309/12 ,  C07C309/17 ,  C07C311/48 ,  C07C381/12 ,  C07C2601/08 ,  C07C2601/14 ,  C07C2603/74 ,  C07D279/30 ,  C07D307/33 ,  C07D327/08 ,  C07D333/76 ,  C07D335/16 ,  C07D339/08 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/2041

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition, including any of compounds of general formula (1) below that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid and a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer.

Abstract translation: 本发明提供了一种光化学射线或辐射敏感性树脂组合物，其包括以下通式（1）的任何化合物：当暴露于光化射线或辐射时，其被分解，从而产生酸和树脂，当被 酸分解，从而增加其在碱性显影剂中的溶解度。

公开(公告)号：US20240280915A1

公开(公告)日：2024-08-22

申请号：US18609116

申请日：2024-03-19

Applicant: FujiFilm Corporation

Inventor： Kei YAMAMOTO ,  Naohiro TANGO ,  Michihiro SHIRAKAWA

IPC: G03F7/00 ,  G03F7/038 ,  G03F7/039 ,  G03F7/30

CPC classification number: G03F7/7065 ,  G03F7/038 ,  G03F7/039 ,  G03F7/30 ,  G03F7/706831 ,  G03F7/706837

Abstract: Provided are a method for testing a photosensitive composition and a method for producing a photosensitive composition that can easily test whether or not the photosensitive composition exhibits a predetermined LWR. The method for testing a photosensitive composition has a step 1 of using a reference photosensitive composition including an acid decomposable resin having a group that is decomposed by an action of an acid to generate a polar group and a photoacid generator, to form a resist film on a substrate 1, removing the resist film on the substrate 1 using a treatment liquid, and measuring a number of defects on the substrate 1 in which the resist film on the substrate 1 has been removed, to obtain reference data; a step 2 of using a photosensitive composition for measurement including components of the same types as types of components included in the reference photosensitive composition, to form a resist film on a substrate 2, removing the resist film on the substrate 2 using a treatment liquid, and measuring a number of defects on the substrate 2 in which the resist film on the substrate 2 has been removed, to obtain measurement data; and a step 3 of performing comparison between the reference data and the measurement data to determine whether or not an allowable range is satisfied, wherein the treatment liquid includes predetermined components.

公开(公告)号：US20200183279A1

公开(公告)日：2020-06-11

申请号：US16789634

申请日：2020-02-13

Applicant: FUJIFILM Corporation

Inventor： Kazuhiro MARUMO ,  Naohiro TANGO ,  Ryo NISHIO ,  Akira TAKADA

IPC: G03F7/039 ,  G03F7/004 ,  C08L33/14 ,  C07D277/66 ,  C07D277/68 ,  C07D263/57

Abstract: A photosensitive resin composition includes a resin having a constitutional unit having an acid-decomposable group, a photoacid generator, a solvent, and a compound represented by Formula D. In Formula D, XD represents an O atom or an S atom, R1D represents a hydrogen atom, a hydrocarbon group, an acyl group, an acyloxy group, or an alkoxycarbonyl group, R2D represents a substituent, nD represents an integer from 0 to 4, and two or more of R2D's may be bonded to each other to form a ring.

公开(公告)号：US20170349686A1

公开(公告)日：2017-12-07

申请号：US15683884

申请日：2017-08-23

Applicant: FUJIFILM Corporation

Inventor： Naoki INOUE ,  Naohiro TANGO ,  Michihiro SHIRAKAWA ,  Kei YAMAMOTO ,  Akiyoshi GOTO

IPC: C08F212/14 ,  G03F7/004 ,  C08F222/38 ,  C08F12/22 ,  G03F7/039 ,  C08F12/20

CPC classification number: C08F212/14 ,  C08F12/20 ,  C08F12/22 ,  C08F222/38 ,  G03F7/0045 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/325

Abstract: A pattern forming method includes the following steps (a) to (d): (a) applying an actinic ray-sensitive or radiation-sensitive resin composition including a resin capable of increasing a polarity by the action of an acid onto a substrate to form a resist film, (b) forming an upper layer film on the resist film, (c) exposing the resist film having the upper layer film formed thereon, and (d) developing the exposed resist film using an organic developer to form a pattern, in which the resin capable of increasing the polarity by the action of an acid includes an acid-decomposable repeating unit having an acid-leaving group a having 4 to 7 carbon atoms, and the maximum value of the number of carbon atoms and the protection rate of the acid-leaving group a satisfy specific conditions.

公开(公告)号：US20140248562A1

公开(公告)日：2014-09-04

申请号：US14271606

申请日：2014-05-07

Applicant: FUJIFILM CORPORATION

Inventor： Akinori SHIBUYA ,  Yoko TOKUGAWA ,  Tomoki MATSUDA ,  Junichi ITO ,  Shohei KATAOKA ,  Toshiaki FUKUHARA ,  Naohiro TANGO ,  Kaoru IWATO ,  Masahiro YOSHIDOME ,  Shinichi SUGIYAMA

IPC: G03F7/038

CPC classification number: G03F7/038 ,  C07C303/32 ,  C07C309/04 ,  C07C309/12 ,  C07D295/16 ,  C07D327/06 ,  C07D339/08 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/2041 ,  G03F7/325

Abstract: According to one embodiment, there is provided an actinic ray- or radiation-sensitive resin composition including (A) a compound represented by a general formula (1) below that generates an acid when exposed to actinic rays or radiation, and (B) a resin.

Abstract translation: 根据一个实施方案，提供了一种光化射线或辐射敏感性树脂组合物，其包含（A）下述通式（1）表示的化合物，当暴露于光化射线或辐射时产生酸，和（B） 树脂。

公开(公告)号：US20240248397A1

公开(公告)日：2024-07-25

申请号：US18610965

申请日：2024-03-20

Applicant: FUJIFILM Corporation

Inventor： Naohiro TANGO ,  Michihiro SHIRAKAWA ,  Kei YAMAMOTO

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32

CPC classification number: G03F7/0045 ,  G03F7/038 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/325

Abstract: An object of the present invention to provide an actinic ray-sensitive or radiation-sensitive resin composition that has high preservation stability and is characterized in that when etching treatment is performed using a resist pattern formed from the resist composition as a mask, defects are less likely to occur in a pattern formed. Another object of the present invention is to provide a method for producing a resist pattern.
An actinic ray-sensitive or radiation-sensitive resin composition according to the present invention contains a resin that becomes more polar under the action of acid, a photoacid generator, a compound Y that is at least one selected from the group consisting of a compound represented by formula (1) and a compound represented by formula (2), and a metal atom. The mass ratio of the content of the compound Y to the content of the metal atom is 1.0×10 to 1.0×109.