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公开(公告)号：US20190153263A1
公开(公告)日：2019-05-23
申请号：US16096290
申请日：2017-01-27
Applicant: FUJIMI INCORPORATED
Inventor： Hitoshi MORINAGA , Kazusei TAMAI , Maiko ASAI , Yuuichi ITO , Kyosuke TENKO , Toru KAMADA
Abstract: Provided are an abrasive, a polishing composition, and a polishing method capable of polishing the surface of an alloy or metal oxide at a sufficient polishing removal rate and providing a high-quality mirror surface. The abrasive contains alumina having an α-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 μm or more to 0.35 μm or less. The polishing composition contains this abrasive and has a pH of 7 or less. These abrasive and polishing composition are used for polishing polishing objects containing at least one of an alloy and a metal oxide.
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公开(公告)号：US20190126130A1
公开(公告)日：2019-05-02
申请号：US16308404
申请日：2017-06-02
Applicant: FUJIMI INCORPORATED
Inventor： Hitoshi MORINAGA , Hiroyuki ISHIDA , Naoto MIYAMOTO
Abstract: Provided are a sliding instrument having a low frictional resistance to the snow surface, the ice surface, or the water surface and having excellent sliding performance and a method for manufacturing the sliding instrument. A sliding instrument to slide on snow, ice, or water includes a sliding surface (1) to come into contact with the snow surface, the ice surface, or the water surface, and the sliding surface (1) has a surface roughness Ra of 1.0 μm or less. A method for manufacturing the sliding instrument includes polishing a sliding surface (1) using a polishing composition slurry containing abrasives to make the sliding surface (1) have a surface roughness Ra of 1.0 μm or less.
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13.发明申请公开(公告)号：US20170355882A1
公开(公告)日：2017-12-14
申请号：US15538475
申请日：2015-11-26
Applicant: FUJIMI INCORPORATED
Inventor： Shingo OTSUKI , Tomoya IKEDO , Shota HISHIDA , Hitoshi MORINAGA , Maiko ASAI , Yuuichi ITO
CPC classification number: C09G1/02 , B24B37/00 , B24B37/044 , C04B41/91 , C09K3/1409 , C09K3/1463
Abstract: Provided is a polishing composition that is produced at low cost and can impart high-grade mirror finishing to ceramic. The polishing composition includes abrasives made of carbide, and is used for polishing ceramic.
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公开(公告)号：US20160355930A1
公开(公告)日：2016-12-08
申请号：US15103020
申请日：2014-12-04
Applicant: FUJIMI INCORPORATED
Inventor： Kazusei TAMAI , Hitoshi MORINAGA , Hiroshi ASANO , Maiko ASAI , Ryo WAKABAYASHI
IPC: C23C30/00
Abstract: Provided is an article having a metal oxide coating employing a novel configuration exhibiting both color and metallic luster. The article having a metal oxide coating disclosed herein is provided with a base material including a metal material and a metal oxide coating including a metal oxide coated onto the surface of the base material. The metal oxide coating is formed by polishing the surface of the base material, using particles composed of the metal oxide.
Abstract translation: 提供一种具有金属氧化物涂层的制品，其采用呈现颜色和金属光泽的新颖构型。 本文公开的具有金属氧化物涂层的制品设置有包括金属材料和金属氧化物涂层的基材，该金属氧化物涂层包括涂覆在基材表面上的金属氧化物。 通过使用由金属氧化物构成的粒子研磨基材的表面而形成金属氧化物被膜。
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公开(公告)号：US20160186029A1
公开(公告)日：2016-06-30
申请号：US14910839
申请日：2014-07-17
Applicant: FUJIMI INCORPORATED
Inventor： Hiroshi ASANO , Maiko ASAI , Hitoshi MORINAGA , Kazusei TAMAI
CPC classification number: C09K3/1436 , B24B1/00 , B24B37/00 , C09G1/02 , C09K3/1445 , C09K3/1463
Abstract: [Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like.[Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect.
Abstract translation: 本发明的目的是提供一种能够提高合金材料的表面的平滑性以获得高光泽度的表面的抛光组合物，并且可以获得具有显着减少的划痕等的高质量镜面。 [解决方案]提供了一种用于抛光合金材料的抛光组合物，其包括磨粒和不与特定金属物质形成络合物并被吸附在合金表面上以显示防腐效果的添加剂 。
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Patent Agency Ranking
公开(公告)号：US20160002500A1
公开(公告)日：2016-01-07
申请号：US14768998
申请日：2014-02-07
Applicant: FUJIMI INCORPORATED
Inventor： Jun ITO , Kazutoshi HOTTA , Hiroyasu SUGIYAMA , Hitoshi MORINAGA
CPC classification number: C09G1/02 , B24B37/00 , B24B37/044 , C09G1/00 , C09K3/1409 , C09K3/1454 , C09K3/1463 , C30B29/20 , C30B33/00 , H01L21/304 , H01L21/30625 , H01L21/3212
Abstract: Provided is a polishing composition which can polish a sapphire substrate having a non-polar plane or a semi-polar plane at a high polishing rate.The invention is a polishing composition used in an application to polish a sapphire substrate having a non-polar plane or a semi-polar plane, the polishing composition containing colloidal silica particles and water, in which a value obtained by dividing a specific surface area (unit: m2/g) of the colloidal silica particles by a number average particle diameter (unit: nm) of the colloidal silica particles, that is, (specific surface area/number average particle diameter) is 0.5 or more and 3.0 or less.
Abstract translation: 本发明提供一种能够以高抛光速度对具有非极性面或半极性面的蓝宝石基板进行研磨的研磨用组合物。 本发明是一种用于抛光具有非极性平面或半极性面的蓝宝石衬底的抛光组合物，该抛光组合物含有胶体二氧化硅颗粒和水，其中通过将比表面积（ 胶体二氧化硅粒子的数均粒径（单位：nm），即（比表面积/数均粒径）为0.5以上且3.0以下。
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17.发明公开公开(公告)号：US20240182750A1
公开(公告)日：2024-06-06
申请号：US18285091
申请日：2022-03-29
Applicant: FUJIMI INCORPORATED
Inventor： Kyosuke TENKO , Jun ITO , Daisuke YASUI , Hitoshi MORINAGA
CPC classification number: C09G1/02 , C09K3/1409
Abstract: Provided is a polishing composition with excellent machining capacity, and good cleaning property after polishing.
A polishing composition containing abrasive grains, water, and a hydrophobic dispersing medium, wherein the hydrophobic dispersing medium contains at least one selected from the group consisting of normal paraffin hydrocarbons, isoparaffin hydrocarbons, naphthenic hydrocarbons, and terpene hydrocarbons, and has a flash point of 30° C. or more and 100° C. or less, or a vapor pressure at 20° C. of 0.004 kPa or more and 2 kPa or less.-
公开(公告)号：US20190262968A1
公开(公告)日：2019-08-29
申请号：US16412562
申请日：2019-05-15
Applicant: EBARA CORPORATION , FUJIMI INCORPORATED
Inventor： Yu ISHII , Kenya ITO , Hitoshi MORINAGA , Kazusei TAMAI , Shingo OHTSUKI , Hiroshi ASANO
IPC: B24B37/04 , B24B37/30 , B24B37/005 , B24B37/10 , B24B37/24
Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).
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公开(公告)号：US20190070707A1
公开(公告)日：2019-03-07
申请号：US16074668
申请日：2017-02-20
Applicant: FUJIMI INCORPORATED
Inventor： Toru KAMADA , Koji KATAYAMA , Hitoshi MORINAGA , Takashi HORIBE
Abstract: A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.
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公开(公告)号：US20190010357A1
公开(公告)日：2019-01-10
申请号：US15737874
申请日：2016-05-18
Applicant: FUJIMI INCORPORATED
Inventor： Toru KAMADA , Hitoshi MORINAGA
Abstract: To provide a polishing composition in which abrasives are less likely to precipitate and precipitated and agglomerated abrasives easily redisperse. A polishing composition has abrasives, a liquid medium, metal oxide particles, and a water-soluble polymer. The average primary particle diameter of the metal oxide particles is 1/10 or less of the average primary particle diameter of the abrasives and the weight average molecular weight of the water-soluble polymer is 200 or more and 1000 or less.
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