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公开(公告)号：US09188113B2
公开(公告)日：2015-11-17
申请号：US14099922
申请日：2013-12-07
Applicant: General Electric Company
CPC classification number: F04B19/006 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L2200/16 , B01L2300/0816 , B01L2300/0867 , B01L2400/0418 , B01L2400/0605 , F16K99/0026 , F16K99/0042 , F16K99/0059 , Y10T137/0318 , Y10T436/2575
Abstract: A method of actuating a valve, comprises operatively coupling the valve with an electroosmotic pump; flowing a fluid through the electroosmotic pump; and generating a fluidic pressure of at least 0.75 PSI to actuate the valve, wherein the electroosmotic pump comprises one or more thin, porous, positive electroosmotic membranes and one or more thin porous, negative electroosmotic membranes; a plurality of electrodes comprising cathodes and anodes, and a power source; wherein each of the positive and negative electroosmotic membranes are disposed alternatively and wherein at least one of the cathodes is disposed on one side of one of the membranes and at least one of the anodes is disposed on the other side of the membrane and wherein at least one of the cathodes or anodes is disposed between a positive and a negative electroosmotic membrane.
Abstract translation: 一种致动阀门的方法包括将阀门与电渗泵可操作地连接; 使流体流过电渗泵; 并且产生至少0.75PSI的流体压力来致动所述阀，其中所述电渗泵包括一个或多个薄的，多孔的电渗透膜和一个或多个薄多孔的阴电渗膜; 包括阴极和阳极的多个电极和电源; 其中所述正电渗渗膜和所述阴电渗膜中的每一个交替设置，并且其中至少一个所述阴极设置在所述膜之一的一侧上，并且所述阳极中的至少一个设置在所述膜的另一侧上，并且其中至少 阴极或阳极之一设置在正电沉积膜和负电渗膜之间。
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公开(公告)号：US20180160929A1
公开(公告)日：2018-06-14
申请号：US15377696
申请日：2016-12-13
Applicant: General Electric Company , Brigham Young University
Inventor： Jeffrey M. Ashe , Kaustubh Ravindra Nagarkar , Christopher Michael Puleo , Christopher Fred Keimel , Craig Patrick Galligan , Yizhen Lin , Nancy Cecelia Stoffel , Richard Vanfleet , Robert Davis , Guohai Chen
IPC: A61B5/0478 , A61B5/1473 , A61B5/145 , A61B5/11 , A61B7/02 , A61N1/05
CPC classification number: A61B5/0478 , A61B5/11 , A61B5/14546 , A61B5/1473 , A61B7/023 , A61B2017/0023 , A61B2017/00911 , A61B2562/0209 , A61B2562/0285 , A61B2562/06 , A61B2562/125 , A61N1/0531 , A61N1/0534
Abstract: The present approach relates to the fabrication and use of a probe array having multiple individual probes. In one embodiment, the probes of the probe array may be functionalized such that certain of the probes are suitable for electrical sensing (e.g., recording) or stimulation, non-electrical sensing or stimulation (e.g., chemical sensing and/or release of biomolecules when activated), or a combination of electrical and non-electrical sensing or stimulation.
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公开(公告)号：US20170187181A1
公开(公告)日：2017-06-29
申请号：US14982735
申请日：2015-12-29
Applicant: General Electric Company
Abstract: A surge suppression device includes a micro electromechanical system (MEMS) switch electrically connected to a current path. Additionally, the surge suppression device includes a transient voltage suppression (TVS) device electrically connected in series to the MEMS switch. The surge suppression device is configured to protect electronic components from voltage surges or current surges.
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公开(公告)号：US20170067742A1
公开(公告)日：2017-03-09
申请号：US14931939
申请日：2015-11-04
Applicant: General Electric Company
IPC: G01C19/5684
CPC classification number: G01C19/5684 , G01P15/02 , G01P2015/0805
Abstract: A gyroscope includes at least one anchor and a plurality of gyroscope spring elements coupled to the at least one anchor. The gyroscope also includes a plurality of concentric rings coupled to the plurality of gyroscope spring elements and configured to encircle the plurality of gyroscope spring elements. The gyroscope further includes an excitation/detection/tuning unit electrostatically coupled to the plurality of concentric rings.
Abstract translation: 陀螺仪包括耦合到至少一个锚的至少一个锚和多个陀螺仪弹簧元件。 陀螺仪还包括耦合到多个陀螺仪弹簧元件的多个同心环，并被配置为环绕多个陀螺弹簧元件。 陀螺仪还包括静电耦合到多个同心环的激励/检测/调谐单元。
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公开(公告)号：US20170066645A1
公开(公告)日：2017-03-09
申请号：US14844132
申请日：2015-09-03
Applicant: General Electric Company
Inventor： Joleyn Eileen Brewer , Christopher Fred Keimel , Marco Francesco Aimi , Andrew Minnick , Renner Stephen Ruffalo
CPC classification number: B81B3/0027 , B81B3/0075 , B81B7/0003 , B81B7/008 , B81B2201/01 , B81B2201/014 , B81B2201/0228 , B81B2203/0118 , B81B2203/0127 , B81B2203/0315 , B81B2203/053 , B81B2207/015 , B81B2207/115 , B81C1/00134 , B81C1/0015 , B81C1/00158 , B81C1/00182 , B81C1/00373 , B81C2201/0107 , G01L9/0042 , G01L9/0044
Abstract: A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.
Abstract translation: 一种用于微电子机械系统（MEMS）装置的系统和方法，其包括形成在基板上的基板和独立悬挂的电镀金属MEMS结构。 独立悬挂的电镀金属MEMS结构包括机械耦合到基底的金属机械元件和机械耦合到机械元件并与之机电连接的种子层，种子层包括难熔金属和耐火材料中的至少一种 金属合金，其中机械元件的厚度基本上大于种子层的厚度，使得独立和悬浮的电镀金属MEMS结构的机械和电学性质由机械元件的材料特性限定。
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Patent Agency Ranking
公开(公告)号：US20170155179A1
公开(公告)日：2017-06-01
申请号：US15429227
申请日：2017-02-10
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
IPC: H01P1/15 , H01L21/52 , H01L21/54 , H01H55/00 , H01H59/00 , H01H61/01 , H01H57/00 , H01L21/48 , H01L21/56
CPC classification number: H01P1/15 , H01H55/00 , H01H57/00 , H01H59/0009 , H01H61/01 , H01H2057/006 , H01H2061/006 , H01L21/4853 , H01L21/52 , H01L21/54 , H01L21/56 , H01L2224/16225 , H01L2924/16195 , H01P1/127 , H01P3/084
Abstract: A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
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公开(公告)号：US20170117110A1
公开(公告)日：2017-04-27
申请号：US14919797
申请日：2015-10-22
Applicant: General Electric Company
Inventor： Yanfei Liu , Glenn Scott Claydon , Christopher Fred Keimel , Christian Michael Giovanniello, JR.
CPC classification number: H01H47/02 , H01H9/542 , H01H59/0009 , H01H2071/008
Abstract: A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit, and an auxiliary circuit coupled in parallel with the MEMS switching circuit that comprises solid state switching circuitry. A control circuit in communication with the MEMS switching circuit and the auxiliary circuit performs selective switching of a load current towards the MEMS switching circuitry and the auxiliary circuit, with the control circuit programmed to transmit a control signal to the driver circuit to cause the MEMS switch to actuate to an open or closed position across a switching interval, activate the auxiliary circuit during the switching interval when the MEMS switch is switching between the open and closed positions, and deactivate the auxiliary circuit upon reaching the open or closed position after completion of the switching interval, such that the load current selectively flows through the MEMS switch and the solid state switching circuitry.
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18.发明申请公开(公告)号：US20170062889A1
公开(公告)日：2017-03-02
申请号：US14839464
申请日：2015-08-28
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
CPC classification number: H01P1/127 , B81B7/007 , H01H49/00 , H01H59/0009 , H01P11/00
Abstract: A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.
Abstract translation: 射频（RF）微机电系统（MEMS）封装包括第一安装衬底，形成在第一安装衬底的顶表面上的信号线，该信号线包括选择性地电耦合信号线的第一部分到 信号线的第二部分，以及耦合到第一安装基板的接地组件。 接地组件包括第二安装基板，形成在第二安装基板的底表面上的接地平面以及延伸穿过第二安装基板的厚度以接触接地平面的至少一个电互连，其中接地平面间隔开 除了信号线。
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公开(公告)号：US20160164161A1
公开(公告)日：2016-06-09
申请号：US14558990
申请日：2014-12-03
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Yongjae Lee , Marco Francesco Aimi , Glenn Scott Claydon , Christopher Fred Keimel
CPC classification number: H01P1/127 , H01H59/0009 , H01H2001/0084
Abstract: An ohmic RF MEMS relay includes a substrate with a capacitive coupling, Csub; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or simultaneously operated. The actuating elements have their own capacitive coupling, Cgap; a midpoint on the channel is in electrical communication with the actuating elements; and an anchor mechanically coupled to the substrate and supporting at least one of the actuating elements. Also, an ohmic RF MEMS relay that includes an input port; a plurality of first MEMS switches that make up a first switching group in electrical communication with the input port, thereby defining a plurality of channels each leading from each of the MEMS switches; and at least one outlet port along each of the channels distal from the first switching group and in electrical communication with the input port.
Abstract translation: 欧姆RF MEMS继电器包括具有电容耦合的衬底，Csub; 串联电耦合的两个致动元件，以便限定通道，其中所述致动元件构造成独立地致动或同时操作。 致动元件具有自己的电容耦合，Cgap; 通道上的中点与致动元件电连通; 以及锚固件，其机械地联接到所述基板并且支撑所述致动元件中的至少一个。 另外，包括输入端口的欧姆RF MEMS继电器; 多个第一MEMS开关，其构成与所述输入端口电连通的第一开关组，从而限定每个从所述MEMS开关导出的多个通道; 以及沿着远离第一开关组的每个通道的至少一个出口端口，并与输入端口电连通。
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20.发明申请METHOD OF FABRICATING A 3D INTEGRATED ELECTRONIC DEVICE STRUCTURE INCLUDING INCREASED THERMAL DISSIPATION CAPABILITIES 有权制作3D集成电子设备结构的方法，包括增加热量消耗能力公开(公告)号：US20140170811A1
公开(公告)日：2014-06-19
申请号：US14186362
申请日：2014-02-21
Applicant: General Electric Company
Inventor： Kaustubh Ravindra Nagarkar , Christopher Fred Keimel
CPC classification number: B81C1/00261 , B81B3/0081 , B81B7/0077 , B81B7/0093 , H01L21/56 , H01L23/10 , H01L23/3677 , H01L24/96 , H01L2224/16225 , H01L2924/01322 , H01L2924/12042 , H01L2924/12043 , H01L2924/1461 , H01L2924/00
Abstract: A method of fabricating a microelectronic device structure including increased thermal dissipation capabilities. The structure including a three-dimensional (3D) integrated chip assembly that is flip chip bonded to a substrate. The chip assembly including a device substrate including an active device disposed thereon. A cap layer is physically bonded to the device substrate to at least partially define a hermetic seal about the active device. The microelectronic device structure provides a plurality of heat dissipation paths therethrough to dissipate heat generated therein.
Abstract translation: 一种制造包括增加散热能力的微电子器件结构的方法。 该结构包括倒装芯片结合到基板的三维（3D）集成芯片组件。 芯片组件包括设置在其上的有源器件的器件衬底。 盖层物理地结合到器件衬底上，以至少部分地限定围绕有源器件的气密密封。 微电子器件结构提供穿过其中的多个散热路径来散发其中产生的热。
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