公开(公告)号：US20050198104A1

公开(公告)日：2005-09-08

申请号：US11044557

申请日：2005-01-27

申请人： Oh Kwon ,  Jae Hahm ,  Sang Kim ,  Jong Lee ,  Hyung Park ,  Kyung Park ,  Shin Kim ,  Kwang Koh

发明人： Oh Kwon ,  Jae Hahm ,  Sang Kim ,  Jong Lee ,  Hyung Park ,  Kyung Park ,  Shin Kim ,  Kwang Koh

IPC分类号： G06F15/163 ,  G06F15/16

CPC分类号： G06F9/5072

摘要： Disclosed is a file-based grid MPI job allocation system for a middleware-based grid computing system in which computers having a plurality of resources including an MPI program are distributed and connected to each other through a network, wherein the grid MPI job allocation system differentiates functions of a middleware and the MPI program, thereby achieving MPI initialization without intervention of a separate arbitration process. The job submission service module generates a file containing an address, a port number, etc. of each node, which are necessary for the MPI initialization, and sends the file to the job execution service module of the corresponding node. Each job execution service module executes the MPI job, and the MPI program waits for the generation of the file and then performs initialization by using the information in the file. The present invention clearly differentiates the jobs to be done by the MPI program and by the job submission service module in the middleware, thereby enabling the MPI program to be executed in the grid computing system regardless of the design of the middleware.

摘要翻译： 公开了一种用于基于中间件的网格计算系统的基于文件的网格MPI作业分配系统，其中包括MPI程序的多个资源的计算机通过网络分布并彼此连接，其中网格MPI作业分配系统区分 中间件和MPI程序的功能，从而实现MPI初始化，而不需要单独的仲裁过程。 作业提交服务模块生成包含MPI初始化所需的每个节点的地址，端口号等的文件，并将该文件发送到相应节点的作业执行服务模块。 每个作业执行服务模块执行MPI作业，并且MPI程序等待文件的生成，然后使用文件中的信息执行初始化。 本发明明确区分由MPI程序和作业提交服务模块在中间件中完成的作业，从而使得能够在网格计算系统中执行MPI程序，而不管中间件的设计如何。

公开(公告)号：US06876074B2

公开(公告)日：2005-04-05

申请号：US10201805

申请日：2002-07-23

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L23/14 ,  H01L23/02 ,  H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A Chip Scale Package (CSP) type unit package including a semiconductor chip and a double wiring substrate, the double wiring substrate including an adhesive and a flexible tape having an upper surface with a first wiring pattern, a lower surface with a second wiring pattern and a plurality of vias electrically connecting portions of the first and second wiring patterns. Additionally, the unit package may be stacked on a conventional base package or on another unit package, where stacked packages are electrically interconnected.

摘要翻译： 一种包括半导体芯片和双重布线基板的芯片级封装（CSP）型单元封装，所述双重布线基板包括粘合剂和具有第一布线图案的上表面的柔性带，具有第二布线图案的下表面和 电连接第一和第二布线图案的多个通孔。 另外，单元封装可以堆叠在传统的基底封装上或者堆叠的封装电互连的另一个单元封装上。

公开(公告)号：US06812578B2

公开(公告)日：2004-11-02

申请号：US10068628

申请日：2002-02-06

申请人： Shin Kim ,  Tae-Gyeong Chung ,  Nam-Seog Kim ,  Woo-Dong Lee ,  Jin-Hyuk Lee

发明人： Shin Kim ,  Tae-Gyeong Chung ,  Nam-Seog Kim ,  Woo-Dong Lee ,  Jin-Hyuk Lee

IPC分类号： H01L2348

CPC分类号： H01L24/05 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to various embodiments of the present invention, a bonding pad structure of a semiconductor device reduces damage caused by thermo-mechanical stress in beam lead bonding. A method of fabricating an improved bonding pad structure is also provided. A polysilicon film plate is preferably formed between a bonding pad metal layer and a dielectric layer. The polysilicon film plate absorbs external thermo-mechanical stress and improves the durability of the bonding pad in a bond pull test (BPT). The bonding between the bonding pad metal layer and the dielectric layer is also improved. Other features and advantages are also provided.

摘要翻译： 根据本发明的各种实施例，半导体器件的焊盘结构减少了光束引线接合中由热机械应力引起的损伤。 还提供了一种制造改进的焊盘结构的方法。 优选在接合焊盘金属层和电介质层之间形成多晶硅膜片。 多晶硅薄膜板吸收外部热机械应力，并提高粘合拉伸试验（BPT）中的焊盘的耐久性。 接合焊盘金属层与电介质层之间的接合也得到改善。 还提供了其他特点和优点。

公开(公告)号：US06432746B1

公开(公告)日：2002-08-13

申请号：US09840725

申请日：2001-04-23

申请人： Shin Kim ,  Hee-Guk Choi ,  Se Ill Kim ,  Se Yong Oh

发明人： Shin Kim ,  Hee-Guk Choi ,  Se Ill Kim ,  Se Yong Oh

IPC分类号： H01L2144

摘要： A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

公开(公告)号：US08790158B2

公开(公告)日：2014-07-29

申请号：US13033876

申请日：2011-02-24

申请人： One-Moon Chang ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

发明人： One-Moon Chang ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

IPC分类号： B24B49/03 ,  B24B49/12 ,  B24B37/04

CPC分类号： B24B41/06

摘要： A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.

摘要翻译： 化学机械抛光装置包括具有构造成支撑晶片的第一区域的压板和设置在第一区域外的第二区域。 化学机械抛光装置还包括设置在压板上的抛光垫，附接有抛光垫的焊盘头，配置成将浆料供应到晶片上的浆料供应源和设置在压板的第二区域上的注入口 。 注入口被配置为将预定气体注入到晶片的底表面的边缘并朝向晶片的外部。

公开(公告)号：US20130001616A1

公开(公告)日：2013-01-03

申请号：US13361612

申请日：2012-01-30

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L33/36 ,  H01L33/58 ,  H01L33/50

CPC分类号： H01L33/44 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a light emitting device including a light emitting structure comprising a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer, a first electrode disposed on the first conductive type semiconductor layer, a second electrode disposed on the second conductivity type semiconductor layer, and a low temperature oxide film disposed on the light emitting structure, with an irregular thickness.

摘要翻译： 公开了一种发光器件，其包括发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层，设置在第一导电类型半导体层上的第一电极，设置在第二导电类型半导体层上的第二电极 型半导体层和设置在发光结构上的低温氧化膜，具有不规则的厚度。

公开(公告)号：US07880289B2

公开(公告)日：2011-02-01

申请号：US11752770

申请日：2007-05-23

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L23/48 ,  H01L21/30 ,  H01L21/58

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/105 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/16105 ,  H01L2224/16157 ,  H01L2224/274 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83 ,  H01L2225/1005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H05K1/183 ,  H05K1/184 ,  H05K2201/09845 ,  H05K2201/10477 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00014

摘要： Provided are a semiconductor package having connection terminals whose side surfaces are exposed and a semiconductor module including such a semiconductor package. Also provided are methods of fabricating the semiconductor package and semiconductor module. According to an embodiment of the present invention, a semiconductor package includes a semiconductor chip including a semiconductor wafer having first and second opposite surfaces and a plurality of conductive pads arranged in a row on the first surface along the edges of the semiconductor wafer such that a side surface of each conductive pad is exposed. An insulating layer is formed on the first surface of the semiconductor wafer and includes openings for exposing parts of the conductive pads. A plurality of connection terminals are respectively arranged on the conductive pads exposed through the openings and a reinforcing member is arranged on the insulating layer to cover a portion of each connection terminal.

摘要翻译： 提供了具有侧表面露出的连接端子和包括这种半导体封装的半导体模块的半导体封装。 还提供了制造半导体封装和半导体模块的方法。 根据本发明的实施例，半导体封装包括半导体芯片，其包括具有第一和第二相对表面的半导体晶片和沿着半导体晶片的边缘在第一表面上排成一行的多个导电焊盘，使得 每个导电焊盘的侧面露出。 绝缘层形成在半导体晶片的第一表面上，并且包括用于暴露导电焊盘部分的开口。 多个连接端子分别布置在通过开口暴露的导电焊盘上，并且在绝缘层上布置加强构件以覆盖每个连接端子的一部分。

公开(公告)号：US20100043301A1

公开(公告)日：2010-02-25

申请号：US12461806

申请日：2009-08-26

申请人： Sang-Ok Yoon ,  Kwan-Soo Kim ,  Shin Kim ,  Yun-Han Kim

发明人： Sang-Ok Yoon ,  Kwan-Soo Kim ,  Shin Kim ,  Yun-Han Kim

IPC分类号： C09K3/14

CPC分类号： C10M173/02 ,  C10M2201/041 ,  C10M2201/103 ,  C10M2201/12 ,  C10M2209/04 ,  C10M2209/12 ,  C10N2240/401

摘要： A water-based cutting fluid includes a water-soluble polymer dissolved in water and ceramic powder dispersed in the water. The cutting fluid further includes water glass. Further, the water-soluble polymer is one selected from a group consisting of polyvinyl alcohol (PVA), cellulose, methyl cellulose, carboxymethyl cellulose (CMC), starch, or a combination thereof.

摘要翻译： 水性切削液包括溶于水的水溶性聚合物和分散在水中的陶瓷粉末。 切削液还包括水玻璃。 此外，水溶性聚合物是选自聚乙烯醇（PVA），纤维素，甲基纤维素，羧甲基纤维素（CMC），淀粉或其组合中的一种。

公开(公告)号：US20090050885A1

公开(公告)日：2009-02-26

申请号：US12222350

申请日：2008-08-07

申请人： Yun-rae Cho ,  Young-min Lee ,  Min-keun Kwak ,  Shin Kim

发明人： Yun-rae Cho ,  Young-min Lee ,  Min-keun Kwak ,  Shin Kim

IPC分类号： H01L23/58 ,  H01L21/66

CPC分类号： H01L22/32 ,  H01L21/78 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor wafer includes a plurality of unitary semiconductor chips formed on a semiconductor substrate. Scribe lane region separate the unitary semiconductor chips from each other. Test element group (TEG) pads are configured to apply testing signals for testing respective test elements. A TEG pad is arranged such that an acute angle formed at an intersection of a line extending from portion of a perimeter of the TEG pad and at least a portion of the outer edge of a corresponding scribe lane region is greater than 0° and less than or equal to 60°.

摘要翻译： 半导体晶片包括形成在半导体衬底上的多个单位半导体芯片。 划线通道区域将单位半导体芯片彼此分开。 测试元件组（TEG）焊盘被配置为应用测试信号来测试相应的测试元件。 TEG垫被布置成使得形成在从TEG垫的周边的一部分延伸的线和相应划线路区域的外边缘的至少一部分的交点处形成的锐角大于0°并小于 或等于60°。

公开(公告)号：US20070029674A1

公开(公告)日：2007-02-08

申请号：US11375760

申请日：2006-03-14

申请人： Dong-Kil Shin ,  Se-Young Yang ,  Shin Kim ,  Wang-Ju Lee

发明人： Dong-Kil Shin ,  Se-Young Yang ,  Shin Kim ,  Wang-Ju Lee

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3157 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a board-on-chip package and stack package using the same to reduce the likelihood that bonding wires in an encapsulant may be damaged due to mechanical stresses applied during a package stacking process. A semiconductor package may have a spacer provided along the opposing sides of an encapsulant. The spacer may be spaced away from bonding wires embedded in the encapsulant. The height of the spacer may be greater than the height of the encapsulated bonding wire from the bottom surface of the semiconductor package. The spacer may be formed of a bar or a protrusion. In a stack package using the semiconductor package, the spacer may be provided between a semiconductor chip of a lower semiconductor package and an encapsulant of an upper semiconductor package.

摘要翻译： 提供了一种使用其的片上封装和堆叠封装，以减少由于在封装堆叠过程中施加的机械应力而使密封剂中的接合线可能被损坏的可能性。 半导体封装可以具有沿密封剂的相对侧设置的间隔件。 间隔件可以与嵌入密封剂中的接合线间隔开。 间隔件的高度可以大于封装的接合线从半导体封装的底表面的高度。 间隔件可以由杆或突起形成。 在使用半导体封装的堆叠封装中，间隔件可以设置在下半导体封装的半导体芯片和上半导体封装的封装件之间。