公开(公告)号：US09288910B2

公开(公告)日：2016-03-15

申请号：US14555856

申请日：2014-11-28

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke Shimizu ,  Yuichi Nakamura ,  Tsuyoshi Yamaguchi

IPC: H05K1/18 ,  H05K3/30 ,  H01L23/13 ,  H01L23/498 ,  H01L23/538 ,  H05K3/46

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/06152 ,  H01L2224/06153 ,  H01L2224/12105 ,  H01L2224/14152 ,  H01L2224/14153 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/181 ,  H05K1/185 ,  H05K3/30 ,  H05K3/4602 ,  H05K2201/096 ,  H05K2201/10674 ,  Y10T29/4913

Abstract: A substrate with a built-in electronic component includes multiple resin insulating layers including first, second, third and fourth insulating layers, multiple conductor layers including a first wiring layer including a first pad, a second wiring layer including a second pad, and a third wiring layer including third and fourth pads, multiple via conductors including a first via connecting the first and second pads through the second insulating layer, a second via connecting the second and third pads through the third and fourth insulating layers, and a third via connected to the fourth pad through the fourth insulating layer, and an electronic component positioned a cavity through the second and third insulating layers such that the third via is connecting terminal of the component and fourth pad. The second and third vias have filled plating filling opening portions through the third and fourth insulating layers and through the fourth insulating layer.

Abstract translation: 具有内置电子部件的基板包括包括第一，第二，第三和第四绝缘层的多个树脂绝缘层，多个导体层，包括包括第一焊盘的第一布线层，包括第二焊盘的第二布线层和第三焊盘的第三布线层 包括第三和第四焊盘的布线层，多个通孔导体，包括通过第二绝缘层连接第一和第二焊盘的第一通孔，通过第三和第四绝缘层连接第二和第三焊盘的第二通孔，以及连接到 通过第四绝缘层的第四焊盘和通过第二和第三绝缘层定位空腔的电子部件，使得第三通孔是部件和第四焊盘的连接端子。 第二和第三通孔已经通过第三绝缘层和第四绝缘层填充电镀填充开口部分并穿过第四绝缘层。

公开(公告)号：US20160037647A1

公开(公告)日：2016-02-04

申请号：US14817388

申请日：2015-08-04

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke Shimizu ,  Makoto Terui ,  Ryojiro Tominaga ,  Keigo Kamoshita ,  Tsutomu Yamauchi

IPC: H05K1/18 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K1/186 ,  H05K3/4007 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/096

Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.

Abstract translation: 具有内置电子部件的布线基板包括具有空腔的基板，容纳在所述空腔中的电子部件，形成在所述基板上并且在所述空腔中的所述电子部件上方延伸的导电层，以及形成在所述基板上的阻焊层 所述导电层具有第一和第二开口，使得所述第一开口形成包括由所述第一开口暴露的所述导电层的第一焊盘，并且所述第二开口形成包括由所述第二开口暴露的所述导电层的第二焊盘。 第二焊盘包括分别直接形成在电子部件上并且连接到电子部件的导电层的部分，第一焊盘包括相对于电子部件形成在外侧的导电层的部分，并且每个第二焊盘 开口的开口直径小于每个第一开口的开口直径。

公开(公告)号：US09793219B2

公开(公告)日：2017-10-17

申请号：US15040129

申请日：2016-02-10

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke Shimizu

IPC: H01L21/66 ,  H01L21/00 ,  H01L29/40 ,  H01L23/52 ,  H01L23/48 ,  H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/5389 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2224/8203 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15313

Abstract: A wiring board includes a base substrate, a semiconductor element embedded in the substrate and having active and non-active surfaces such that the semiconductor has a terminal on the active surface, a first build-up layer including an insulating layer and first conductor pads such that the first conductor pads have exposed surfaces exposed from a surface of the insulating layer on the opposite side with respect to the substrate, and a second build-up layer including an insulating layer and second conductor pads such that the second conductor pads have exposed surfaces exposed from a surface of the insulating layer on the opposite side with respect to the substrate. The insulating layer in the first build-up includes resin material and reinforcing material, the insulating layer in the second build-up includes resin material and reinforcing material, and the first conductor pads is embedded in the insulating layer in the first build-up.