中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

28 records (took 0.026 seconds)

    OPTICAL FILM AND DISPLAY ASSEMBLY APPLYING THE SAME
    11.
    发明申请
    OPTICAL FILM AND DISPLAY ASSEMBLY APPLYING THE SAME 审中-公开
    光学膜和显示组件适用于此

    公开(公告)号：US20160178812A1

    公开(公告)日：2016-06-23

    申请号：US14576221

    申请日：2014-12-19

    Applicant: Industrial Technology Research Institute ,  UNIVERSITY OF CENTRAL FLORIDA RESEARCH FOUNDATION INC

    Inventor： Ya-Ting Gao ,  Zhen-Yue Luo ,  Shin-Tson Wu ,  Kuo-Chang Lee ,  Cheng-Chung Lee

    IPC: G02B5/00 ,  H01L27/32 ,  G02B5/08

    CPC classification number: G02B5/003 ,  H01L51/5271 ,  H01L51/5284

    Abstract: An optical film and a display assembly applying the optical film are provided. The optical film may comprise a plurality of truncated tapered units embedded in a material layer for transmitting a light emitted from the display unit by reflecting the light through a reflection surface between the truncated tapered units and the material layer, wherein a ratio of the area of a first end surface where the light emerges from each truncated tapered unit and the area of a second end surface where the light is incident into each truncated tapered may be between 0.2 and 0.6. Furthermore, a light absorbing layer may be formed on a light output side of the optical film for absorbing ambient light.

    Abstract translation: 提供了应用光学膜的光学膜和显示组件。 光学膜可以包括嵌入在材料层中的多个截锥形单元，用于通过反射光穿过截锥形单元和材料层之间的反射表面来透射从显示单元发射的光，其中， 从每个截锥形单元出射光的第一端表面和光入射到每个截锥形的第二端面的面积可以在0.2和0.6之间。 此外，光吸收层可以形成在用于吸收环境光的光学膜的光输出侧。

    FLEXIBLE ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF
    14.
    发明申请
    FLEXIBLE ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF 审中-公开
    柔性电子器件及其制造方法

    公开(公告)号：US20170020002A1

    公开(公告)日：2017-01-19

    申请号：US15137007

    申请日：2016-04-25

    Applicant: Industrial Technology Research Institute

    Inventor： Sheng-Po Wang ,  Heng-Yin Chen ,  Cheng-Chung Lee ,  Jia-Chong Ho ,  Yung-Hui Yeh ,  Tai-Jui Wang

    IPC: H05K1/18 ,  H05K3/00 ,  H01L23/498 ,  H05K3/46 ,  H05K1/11 ,  H05K3/40 ,  H05K3/32

    CPC classification number: H05K1/189 ,  H01L23/49827 ,  H01L23/5385 ,  H05K1/144 ,  H05K3/007 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/10128

    Abstract: A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.

    Abstract translation: 提供了包括第一柔性基板，电子部件和控制装置的柔性电子装置。 电子部件包括导电层。 控制装置包括至少一个集成电路和电路层组。 电路层组包括多个电路层和至少一个第一电介质层，并且第一电介质层的至少一部分插入在两个相邻的电路层之间。 集成电路通过电路层组和导电层电连接到电子部件。 导电层的至少一部分和一个电路层的至少一部分被一体地形成，并且导电层和电路层均设置在第一柔性基板上。 还提供了一种柔性电子装置的制造方法。

    Foldable package structure
    15.
    发明授权
    Foldable package structure 有权
    可折叠包装结构

    公开(公告)号：US09412967B2

    公开(公告)日：2016-08-09

    申请号：US14527774

    申请日：2014-10-30

    Applicant: Industrial Technology Research Institute

    Inventor： Kuang-Jung Chen ,  Cheng-Chung Lee

    IPC: H01L51/52 ,  H01L51/00 ,  H01L51/44

    CPC classification number: H01L51/5237 ,  H01L51/0097 ,  H01L51/448 ,  H01L51/524 ,  H01L2251/5338 ,  Y02E10/549

    Abstract: A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package structure comprises a predetermined folded region and the ultra-thin glass plate is disposed at one side of the predetermined folded region and stays away from the predetermined folded region.

    Abstract translation: 提供了包括第一基板，第二基板，多个粘合剂层和至少一个环境敏感电子部件的可折叠封装结构。 第一和第二层压基板中的至少一个包括超薄玻璃板。 可折叠包装结构包括预定的折叠区域，超薄玻璃板设置在预定折叠区域的一侧并且保持远离预定折叠区域。

    Photoelectric device package
    19.
    发明授权
    Photoelectric device package 有权

    公开(公告)号：US10276761B2

    公开(公告)日：2019-04-30

    申请号：US15951195

    申请日：2018-04-12

    Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

    Inventor： Yi-Hsiang Huang ,  Cheng-Chung Lee ,  Jia-Chong Ho ,  Wei-Han Chen ,  Shin-Hong Kuo

    IPC: H01L27/15 ,  H01L33/08 ,  H01L33/40 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64 ,  H01L25/075

    Abstract: A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and a first encapsulation layer is provided. The first circuit layer is disposed on the substrate. The carrier structure is disposed on the substrate and covers the first circuit layer. The carrier structure includes a first dielectric layer, a second dielectric layer, and an elastic layer disposed between the first dielectric layer and the second dielectric layer. The Young's modulus of the elastic layer is less than the Young's modulus of the first dielectric layer and the second dielectric layer. The second circuit layer is disposed on the carrier structure. The photoelectric device is disposed on the carrier structure and is electrically connected to the first and second circuit layers. The first encapsulation layer is disposed on the carrier structure and encapsulates the photoelectric device.

Patent Agency Ranking