公开(公告)号：US10954329B2

公开(公告)日：2021-03-23

申请号：US16232581

申请日：2018-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shou-Yi Ho ,  Kuo-Chan Chiou

IPC: C08F267/10 ,  C08F212/08 ,  C08F220/70 ,  C08J5/18 ,  C08K3/04

Abstract: A modified copolymer is provided. The modified copolymer includes a random copolymer of a repeat unit of formula (I) and a repeat unit of formula (II) wherein M is derived from monomers with double bonds, R is a direct bond or an aliphatic hydrocarbon chain group having 1 to 12 carbon atoms, a cyclic aliphatic hydrocarbon group having 3 to 16 carbon atoms, an alkylcarbonyloxy group having 2 to 6 carbon atoms, a carbonyl group, an ether group, an ester group, an amide group, an aromatic group having 6 to 16 carbon atoms, or a divalent group having any of the above groups, wherein m and x are positive integers less than 50. The weight average molecular weight of the modified copolymer is between 3000 and 30000.

公开(公告)号：US10894853B2

公开(公告)日：2021-01-19

申请号：US16179296

申请日：2018-11-02

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kuei-Yi Chuang ,  Kuo-Chan Chiou ,  Feng-Po Tseng

IPC: C08F277/00 ,  C08L101/06 ,  C08G73/06 ,  C08G65/40 ,  C08G73/12 ,  C08G65/44 ,  C08L71/00 ,  C08L71/12 ,  C07D307/42 ,  C07D307/52 ,  C07D407/06 ,  C08G18/02 ,  C08G18/83 ,  C08G61/04 ,  C08G61/10 ,  C08G61/12 ,  C08G65/331 ,  C08F267/04 ,  C08F283/08 ,  C08F283/10 ,  C08F299/02

Abstract: The invention provides a furan-modified compound or oligomer. The compound has a structure represented by Formula I: When formula I represents a compound, x is an integer of 1˜5; A including a group formed of ketone, amido, imide, imido, phenyl ether or enol ether group; G is a direct bond, —O—, —N—, —Ar—NH—(CH2)b—, —Ar—O—(CH2)b—, —Ar—O—(CH2)a—NH—(CH2)b—, —(CH2)a—NH—(CH2)b—, —(CH2)a—O—(CH2)b— or —(CH2)a—CH(OH)—(CH2)b—NH—; Ar is substituted or unsubstituted arylene group; a is an integer of 1 to 5; and b is an integer of 0 to 5.

公开(公告)号：US10141083B2

公开(公告)日：2018-11-27

申请号：US14582555

申请日：2014-12-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Wei-Han Hsiao ,  Chun-Yi Chiu ,  Kuo-Chan Chiou ,  Tzong-Ming Lee

IPC: H01B1/02 ,  H01B1/22

Abstract: A transparent conductive film composite is provided. The transparent conductive film composite includes (a) 0.07-0.2 wt % of a metallic material; (b) 0.01-0.5 wt % of a dispersant; and 99.3-99.92 wt % of a solvent, wherein the metallic material (a) includes: (a1) 84-99.99 wt % of metal nanowires; and (a2) 0.01-16 wt % of micron metal flakes. A transparent conductive film manufactured from the transparent conductive film composite is also provided.

公开(公告)号：US09371233B2

公开(公告)日：2016-06-21

申请号：US14484430

申请日：2014-09-12

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chen-Lung Lin ,  Yen-Chun Liu ,  Hui-Wen Chang ,  Kuo-Chan Chiou ,  Hsien-Lin Hu

IPC: C01B31/04 ,  C08G73/14 ,  C09D179/08 ,  C08G73/10

CPC classification number: C01B31/04 ,  C01B32/20 ,  C08G73/1035 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/14 ,  C09D179/08

Abstract: A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25° C. to 2,900° C.

Abstract translation: 提供由下式表示的聚酰胺 - 酰亚胺。 还提供了通过对由上述式表示的聚酰胺 - 酰亚胺进行热处理工艺制备的石墨膜。 在热处理过程中，热处理工艺的温度范围为25℃至2900℃。

公开(公告)号：US11247978B2

公开(公告)日：2022-02-15

申请号：US17090325

申请日：2020-11-05

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kuei-Yi Chuang ,  Kuo-Chan Chiou ,  Feng-Po Tseng

IPC: C07D307/52 ,  C08F277/00 ,  C08K5/3415 ,  C08G73/12 ,  C08G61/10 ,  C08G61/12 ,  C08G73/06

Abstract: A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer and a bismaleimide compound having a structure represented by Formula (II) wherein the furan-group-containing oligomer is an oligomer having a structure represented by Formula (IV), an oligomer having a structure represented by Formula (V), or an oligomer having a first repeating unit and a second repeating unit, wherein the first repeating unit has a structure represented by Formula (VI), the second repeating unit has a structure represented by Formula (VII), wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R25, q, z and E are as defined in specification.

公开(公告)号：US11015018B2

公开(公告)日：2021-05-25

申请号：US16146084

申请日：2018-09-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun Liu ,  Min-Chian Wang ,  Hsiang-Yen Tsao ,  Kuo-Chan Chiou

IPC: C08G59/52 ,  C08G59/50 ,  C08K3/22 ,  C08G59/22 ,  C08G59/24 ,  C08G59/56 ,  C09D163/00 ,  C09K5/14 ,  C08L63/00 ,  C08K3/08 ,  C08K3/013

Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.

公开(公告)号：US10059866B2

公开(公告)日：2018-08-28

申请号：US14974616

申请日：2015-12-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun Liu ,  Hui-Wen Chang ,  Hsiang-Yen Tsao ,  Kuo-Chan Chiou

IPC: C08L63/00 ,  C08G59/24 ,  C08G59/50 ,  C09K5/14 ,  C08G59/22 ,  H01L23/373 ,  C09J163/00 ,  B32B27/38

CPC classification number: C09K5/14 ,  C08G59/22 ,  C08G59/226 ,  C08G59/24 ,  C08G59/245 ,  C08G59/50 ,  C08G59/5033 ,  H01L23/3737

Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4′-methylenedianiline, 4,4′-ethylenedianiline, 4,4′-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.

公开(公告)号：US09780236B2

公开(公告)日：2017-10-03

申请号：US14553181

申请日：2014-11-25

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chun-Yi Chiu ,  Kuo-Chan Chiou ,  Wei-Han Hsiao

IPC: H01B1/02 ,  H01L31/0224 ,  C09D5/24 ,  C09J9/02 ,  H01B1/22 ,  H01B1/24 ,  B22F1/00 ,  C22C32/00 ,  C09J11/04 ,  C08K3/04 ,  C08K3/08

CPC classification number: H01L31/022425 ,  B22F1/0014 ,  B22F2999/00 ,  C08K3/04 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2201/001 ,  C09D5/24 ,  C09J9/02 ,  C09J11/04 ,  C22C32/0089 ,  H01B1/22 ,  H01B1/24 ,  B22F3/10 ,  B22F2201/50

Abstract: Disclosed is a conductive paste composition, including 100 parts by weight of copper powder, 40 to 150 parts by weight of silver powder, 0.1 to 3 parts by weight of carbon powder, 1 to 5 parts by weight of glass powder, and 5 to 15 parts by weight of binder. The conductive paste composition can be applied on a substrate, and then sintered under atmosphere at a high temperature to form an electrode on the substrate.

公开(公告)号：US09708437B2

公开(公告)日：2017-07-18

申请号：US14805094

申请日：2015-07-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kuei-Yi Chuang ,  Feng-Po Tseng ,  Kuo-Chan Chiou ,  Lu-Shih Liao

IPC: C08G18/38 ,  C08K3/22 ,  C08G18/34 ,  C08K3/36 ,  C08J5/04 ,  C08G18/76

CPC classification number: C08G18/3846 ,  C08G18/345 ,  C08G18/7671 ,  C08G18/7678 ,  C08G18/7685 ,  C08J5/04 ,  C08J5/24 ,  C08J2379/00 ,  C08K3/22 ,  C08K3/36 ,  C08K2003/2227 ,  C08L75/04

Abstract: A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided. In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, —O—, —S— or —SO2—, X includes —H, —CH3 or —CH2CH3, R1 includes —H, —CH3 or —CH2CH3, and E includes —H, —CH3 or —CH2CH3.