公开(公告)号：US10315200B2

公开(公告)日：2019-06-11

申请号：US15638167

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Amanuel M Abebaw ,  Mark Saltas ,  Anna M. Prakash ,  Liwei Wang

IPC: B25H3/06 ,  B03C1/034 ,  B03C1/00 ,  B65B5/02 ,  B65B11/50

Abstract: An apparatus for storing magnetic materials may include a tray. The apparatus for storing magnetic materials may include a sheet. The apparatus for storing magnetic materials may include a first set of height modulators. The apparatus for storing magnetic materials may include a diamagnetic material. The tray may include one or more pockets. The one or more pockets may be configured to receive a magnetic device. The sheet may be configured to couple with the tray. The sheet may be located adjacent to a bottom of the one or more pockets. The sheet may include the diamagnetic material. The sheet may include the first set of height modulators. The first set of height modulators may protrude from a surface of the sheet. The first set of height modulators may be configured to extend into the one or more pockets at a first distance.

公开(公告)号：US20180364438A1

公开(公告)日：2018-12-20

申请号：US15623919

申请日：2017-06-15

Applicant: Intel Corporation

Inventor： Yang Sun ,  Amanuel M. Abebaw ,  Anna M. Prakash ,  Isidore Ray Salas

IPC: G02B7/00 ,  B29D11/00 ,  B29C45/72 ,  B29C45/26 ,  G02B3/00

Abstract: Aspects of the embodiments are directed to an optical component with at least one substantially flat surface. The flat surface can be used as a surface onto which a pick and place tool can contact the optical component for assembly. The optical component can be formed from a mold that includes an insertable pin. For example, the mold can include a three-piece mold: a core and a cavity can be brought together to define a negative space conforming to a shape of the optical component. The core and the cavity, when brought together, also define an opening. The opening can have a shape that conforms to a desired cross-sectional shape of the flat surface of the optical component. An insertable pin, with a substantially flat end surface, can be inserted through the opening during the mold process to form the substantially flat surface.

公开(公告)号：US10049971B2

公开(公告)日：2018-08-14

申请号：US15478064

申请日：2017-04-03

Applicant: Intel Corporation

Inventor： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

IPC: H01L21/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L21/768 ,  H01L25/00 ,  H01L23/00

Abstract: An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

公开(公告)号：US20180226358A1

公开(公告)日：2018-08-09

申请号：US15945023

申请日：2018-04-04

Applicant: Intel Corporation

Inventor： Rajendra C. Dias ,  Anna M. Prakash ,  Joshua D. Heppner ,  Eric J. Li ,  Nachiket R. Raravikar

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/81

Abstract: Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include a substrate including electrical connection circuitry therein, grounding circuitry on, or at least partially in the substrate, the grounding circuitry at least partially exposed from a surface of the substrate, a die electrically connected to the connection circuitry and the grounding circuitry, the die on the substrate, and a conductive foil or conductive film surrounding the die, the conductive foil or conductive film electrically connected to the grounding circuitry.

公开(公告)号：US20170266948A1

公开(公告)日：2017-09-21

申请号：US15072285

申请日：2016-03-16

Applicant: Intel Corporation

Inventor： Joshua D. Heppner ,  Shawna M. Liff ,  Eric J. Li ,  Anna M. Prakash

IPC: B41F15/18 ,  B41F15/44

CPC classification number: B41F15/18 ,  B41F15/12 ,  B41F15/44 ,  B41L13/02 ,  B41L13/12 ,  B41L13/14 ,  H05K3/1233

Abstract: Described is an apparatus which comprises: a squeegee head which is operable to drop a material; and a vacuum manifold attachable to the squeegee head, wherein the vacuum manifold is operable to create a vacuum in a space prior to the squeegee head is to drop the material.

公开(公告)号：US09704811B1

公开(公告)日：2017-07-11

申请号：US14978294

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Rajendra C. Dias ,  Joshua D Heppner ,  Mitul B Modi ,  Anna M. Prakash

IPC: H01L23/552 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/60 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49524 ,  H01L23/552 ,  H01L24/27 ,  H01L24/33 ,  H01L2224/97 ,  H01L2924/3025

Abstract: An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.

公开(公告)号：US20230049007A1

公开(公告)日：2023-02-16

申请号：US17402313

申请日：2021-08-13

Applicant: Intel Corporation

Inventor： Khaled Ahmed ,  Anna M. Prakash ,  Ronald C. Woodbeck ,  Santosh Pabba

IPC: H01L33/00 ,  H01L21/683 ,  H01L33/62 ,  H01L33/60 ,  H01L33/20

Abstract: Micro light-emitting diodes (LED) are distanced from a mirror layer that reflects light emitted by the LEDs to increase the light extraction efficiency of the LEDs. In some embodiments, micro LEDs are electrically coupled to the mirror layer by vias positioned at an end of the LED positioned proximate to the mirror layer. In other embodiments, a conductive layer is positioned adjacent to an electrode of multiple micro LEDs and a pillar contacts the conductive layer at a location where the conductive layer is not positioned adjacent to a micro LED electrode. Vias and pillars allow the mirror height to be increased relative to structures where micro LEDs extend into a mirror layer. Increasing the mirror height can reduce the amount of destructive interference at a release layer caused by reflections of LED-emitted light by the mirror layer when the release layer is ablated via laser irradiation.

公开(公告)号：US11156815B2

公开(公告)日：2021-10-26

申请号：US16336607

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Chia-Pin Chiu ,  Anna M. Prakash ,  Amanuel M Abebaw ,  Olga Gorbounova ,  Ching-Ping Janet Shen ,  Shan Zhong ,  Mark Saltas

IPC: G02B19/00 ,  G01J1/04

Abstract: Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesive layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.

公开(公告)号：US20190391386A1

公开(公告)日：2019-12-26

申请号：US16464257

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Anna M. Prakash ,  Suriyakala Ramalingam ,  Liwei Wang ,  Robert Starkston ,  Arnab Choudhury ,  Sandeep S. Iyer ,  Amanuel M. Abebaw ,  Nick Labanok

IPC: G02B26/08 ,  B81C3/00

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

公开(公告)号：US20170179040A1

公开(公告)日：2017-06-22

申请号：US14978294

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Rajendra C. Dias ,  Joshua D. Heppner ,  Mitul B. Modi ,  Anna M. Prakash

IPC: H01L23/552 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L23/60 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49524 ,  H01L23/552 ,  H01L24/27 ,  H01L24/33 ,  H01L2224/97 ,  H01L2924/3025

Abstract: An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.