公开(公告)号：US20170286731A1

公开(公告)日：2017-10-05

申请号：US15586820

申请日：2017-05-04

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Feras EID ,  Vijay K. NAIR ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Valluri R. RAO

IPC: G06K7/10 ,  H03H9/17 ,  H03H9/205 ,  H03H9/30

CPC classification number: G06K7/10297 ,  G06K7/10316 ,  G06K19/0672 ,  G06K19/0675 ,  H03H9/30

Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.

公开(公告)号：US20200227366A1

公开(公告)日：2020-07-16

申请号：US16827296

申请日：2020-03-23

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Javier A. FALCON ,  Yoshihiro TOMITA ,  Vijay K. NAIR

IPC: H01L23/66 ,  H01L23/00 ,  H01L25/18

Abstract: Embodiments of the invention include a microelectronic device that includes a first die formed with a silicon based substrate and a second die coupled to the first die. The second die is formed with compound semiconductor materials in a different substrate (e.g., compound semiconductor substrate, group III-V substrate). An antenna unit is coupled to the second die. The antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20200219861A1

公开(公告)日：2020-07-09

申请号：US16647451

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Vijay K. NAIR ,  Feras EID ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Stephan LEUSCHNER

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/24 ,  H03H9/17 ,  H03H9/05

Abstract: RF front end systems or modules with an acoustic wave resonator (AWR) on an interposer substrate are described. In an example, an integrated system includes an active die, the active die comprising a semiconductor substrate having a plurality of active circuits therein. An interposer is also included, the interposer comprising an acoustic wave resonator (AWR). A seal frame couples the active die to the interposer, the seal frame surrounding the acoustic wave resonator and hermetically sealing the acoustic wave resonator between the active die and the interposer.

公开(公告)号：US20180332151A1

公开(公告)日：2018-11-15

申请号：US15777093

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR

IPC: H04M1/02 ,  H01Q1/38 ,  H01Q21/22 ,  H01Q1/24

CPC classification number: H04M1/0277 ,  G06F1/1613 ,  G06F1/1698 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/405 ,  H01Q3/26 ,  H01Q9/0414 ,  H01Q21/0093 ,  H01Q21/22 ,  H01Q21/28 ,  H01Q23/00 ,  H01Q25/00

Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20180323159A1

公开(公告)日：2018-11-08

申请号：US15773152

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L25/18 ,  H01Q1/38

CPC classification number: H01L23/66 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/552 ,  H01L24/16 ,  H01L24/20 ,  H01L25/105 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15192 ,  H01L2924/18162 ,  H01L2924/19011 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes an overmolded component having a first die with a silicon based substrate. A second die is coupled to the first die with the second die being formed with compound semiconductor materials in a different substrate. A substrate is coupled to the first die. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20180310399A1

公开(公告)日：2018-10-25

申请号：US15771833

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Feras EID

IPC: H05K1/02 ,  H01P3/12 ,  H01P5/107 ,  H05K3/46

CPC classification number: H05K1/0243 ,  H01P3/121 ,  H01P5/107 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/09618

Abstract: Embodiments of the invention include a waveguide structure that includes a lower member, at least one sidewall member coupled to the lower member, and an upper member. The lower member, the at least one sidewall member, and the upper member include at least one conductive layer to form a cavity in a substrate for allowing communications between devices that are coupled or attached to the substrate.

公开(公告)号：US20170288724A1

公开(公告)日：2017-10-05

申请号：US15088996

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Feras EID ,  Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Johanna M. SWAN ,  Valluri R. RAO

IPC: H04B1/48 ,  H03H9/05 ,  H03H9/54 ,  H01H57/00

CPC classification number: H04B1/48 ,  H01H57/00 ,  H01H2057/006 ,  H03H7/38 ,  H03H2015/005

Abstract: Embodiments of the invention include a tunable radio frequency (RF) communication module that includes a transmitting component having at least one tunable component and a receiving component having at least one tunable component. The tunable RF communication module includes at least one piezoelectric switching device coupled to at least one of the transmitting and receiving components. The at least one piezoelectric switching device is formed within an organic substrate having organic material and is designed to tune at least one tunable component of the tunable RF communication module.

公开(公告)号：US20200287520A1

公开(公告)日：2020-09-10

申请号：US16648639

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Feras EID ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Johanna M. SWAN

IPC: H03H9/54 ,  H03H9/13 ,  H03H9/56 ,  H03H9/05

Abstract: Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter includes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.

公开(公告)号：US20200259478A1

公开(公告)日：2020-08-13

申请号：US16648115

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Feras EID ,  Vijay K. NAIR ,  Johanna M. SWAN

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/13 ,  H03H9/54 ,  H03H9/52

Abstract: Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.

公开(公告)号：US20190051615A1

公开(公告)日：2019-02-14

申请号：US16075513

申请日：2016-04-02

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Pramod MALATKAR

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces and a ground plane therein; a functional semiconductor die electrically interfaced to the electrical traces of the substrate layer; a heat pipe thermally interfaced to a top surface of the functional semiconductor die; one or more interposers of an organic dielectric material electrically connected to the ground plane of the substrate layer and electrically connected to the heat pipe; in which the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die; and further in which the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form. Other related embodiments are disclosed.