公开(公告)号：US11194372B2

公开(公告)日：2021-12-07

申请号：US16642161

申请日：2017-09-29

Applicant: INTEL CORPORATION

Inventor： Yanbing Sun ,  Xiaoguo Liang ,  Haifeng Gong ,  Ming Zhang

IPC: G06F1/00 ,  G06F1/20 ,  G06F3/06 ,  G11C7/04

Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). A SSD (10, 110, 210, 310, 410, 510, 610, 710) including a housing (12, 112, 212, 312, 412, 512, 612, 712) including a plurality of sides surrounding an interior region. The SSD (10, 110, 210, 310, 410, 510, 610, 710) includes at least one vent (14, 114, 214, 314, 414, 514, 614, 714) on the housing (12, 112, 212, 312, 412, 512, 612, 712), the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) configured to be opened and closed in response to a signal. The SSD (10, 110, 210, 310, 410, 510, 610, 710) also includes a temperature sensor and a controller, the controller configured to send a signal to open the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a first temperature, and the controller configured to close the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a second temperature, wherein the first temperature is greater than the second temperature.

公开(公告)号：US10817102B2

公开(公告)日：2020-10-27

申请号：US16086475

申请日：2016-06-21

Applicant: INTEL CORPORATION

Inventor： Hong W. Wong ,  Wah Yiu Kwong ,  Xiaoguo Liang ,  Jiancheng Tao ,  Yanbing Sun

IPC: G06F3/041 ,  A61F4/00 ,  G06F3/01 ,  G06F1/16 ,  H03K19/173 ,  H04R1/04

Abstract: In one example a input device for an electronic device comprises a first panel comprising an array of pressure sensors, a second panel comprising an array of apertures in fluid communication with the pressure sensors, and a controller comprising logic, at least partly including hardware logic, to receive a plurality of output signals from the plurality of pressure sensors, determine, from the plurality of output signals, a location of an input on the second panel, and generate a data point on a bitmap corresponding to the location of the input on the second panel. Other examples may be described.

公开(公告)号：US10180710B2

公开(公告)日：2019-01-15

申请号：US15325609

申请日：2014-08-11

Applicant: Intel Corporation

Inventor： Yanbing Sun ,  Yongkang Wu ,  Jeff King ,  Peifeng Si

IPC: G06F1/20 ,  F24F11/79 ,  B60H1/00 ,  B60H1/22

Abstract: Apparatuses, methods and storage media associated with a plurality of cooling devices thermally coupled to a plurality of heat-generating components of an electronic device, such as a server, a configured rack of servers, or a configured rack of server elements, are disclosed herein. Each cooling device may be associated with a unique cooling zone for the components. Logic may be coupled with the plurality of cooling devices, and the logic may be configured to cause a first cooling zone of a first cooling device to overlap a second cooling zone of a second cooling device. Other embodiments may be described and/or claimed.

公开(公告)号：US20180138387A1

公开(公告)日：2018-05-17

申请号：US15553372

申请日：2015-03-27

Applicant: INTEL CORPORATION

Inventor： Hong W. Wong ,  Wah Yiu Kwong ,  Shaorong Zhou ,  Xiaoguo Liang ,  Cheong W. Wong ,  Yanbing Sun

IPC: H01L37/02

CPC classification number: H01L37/02 ,  F28D15/02 ,  F28D20/02 ,  F28D20/028 ,  F28D2021/0028 ,  F28F2013/006 ,  H01L23/4275 ,  H01L35/32 ,  H05K3/284 ,  Y02E60/145

Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to receive thermal energy from a source, convert phase change material (102) from an initial state to a secondary state in response to absorption of the thermal energy, and transfer the thermal energy from the phase change material (102) to a thermoelectric component (106). In addition, various embodiments may include collecting, conducting and converting the thermal energy into electrical energy for use in powering one or more electronic components.

公开(公告)号：US20170059263A1

公开(公告)日：2017-03-02

申请号：US15122424

申请日：2014-03-31

Applicant: Yanbing SUN ,  Mark MACDONALD ,  Jiancheng TAO ,  Intel Corporation

Inventor： Yanbing Sun ,  Mark MacDonald ,  Jiancheng Tao ,  Ming Zhang

IPC: F28G7/00 ,  F28G15/00 ,  B08B7/02 ,  G05B15/02 ,  G06F1/20

CPC classification number: F28G7/00 ,  B08B7/026 ,  F28G15/003 ,  G05B15/02 ,  G06F1/203 ,  H05K7/20181

Abstract: A system and method are disclosed for using a sonic frequency to induce a vibration useful for clearing dust accumulation from microelectronics, such as a laptop computer. A speaker driver may be mounted onto a support structure for a heat exchanger (220). At an advantageous time, such as boot up, a sonic frequency may be driven onto the speaker (250), thus inducing vibration in the heat exchanger (220) and helping to clear dust accumulation. In some cases, a resonant frequency may be used to optimize the amount of vibration per unit power delivery.

Abstract translation: 公开了一种系统和方法，用于使用声频来引起用于清除诸如膝上型计算机之类的微电子的灰尘积聚的振动。 扬声器驱动器可以安装在用于热交换器（220）的支撑结构上。 在有利的时间，例如引导，声音频率可以被驱动到扬声器（250）上，从而引起热交换器（220）中的振动并帮助清除灰尘积聚。 在某些情况下，可以使用谐振频率来优化每单位功率输送的振动量。

公开(公告)号：US20240251522A1

公开(公告)日：2024-07-25

申请号：US18587499

申请日：2024-02-26

Applicant: Intel Corporation

Inventor： Yanbing Sun ,  Chao Sun ,  Jie Yan ,  Xiaoguo Liang ,  Lihui Wu

IPC: H05K7/20

CPC classification number: H05K7/20154 ,  H05K7/20209 ,  H05K7/209 ,  H05K7/20927

Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include a rotatable mount; a first heat sink including a first surface and a second surface, the first surface of the first heat sink to be thermally coupled to a semiconductor device on a substrate, the second surface of the first heat sink thermally coupled to the rotatable mount; and a second heat sink including a third surface, the third surface of the second heat sink coupled to the rotatable mount, the second heat sink structured to rotate relative to the first heat sink when a portion of the rotatable mount rotates between a first position and a second position.

公开(公告)号：US11416070B2

公开(公告)日：2022-08-16

申请号：US17216355

申请日：2021-03-29

Applicant: Intel Corporation

Inventor： Jiancheng Tao ,  Hong Wong ,  Xiaoguo Liang ,  Yanbing Sun ,  Jun Liu ,  Wah Yiu Kwong

IPC: G06F3/01 ,  G06T3/40 ,  G09G5/00 ,  G06F3/03 ,  G06F3/04845 ,  G06F40/103 ,  G06V40/10 ,  G06V40/16 ,  G09G5/14 ,  G09G5/26

Abstract: Methods, apparatus, systems are disclosed for altering displayed content on a display device responsive to a user's proximity. In accord with an example, a computing system includes a memory, a sensor to collect data representative of a viewing distance between a display and a user of the display, and a scaler to adjust a size of at least one object displayed by the display based on the viewing distance from the display.

公开(公告)号：US20210345519A1

公开(公告)日：2021-11-04

申请号：US17359405

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Wenbin Tian ,  Yingqiong Bu ,  Yanbing Sun ,  Yang Yao ,  Yuehong Fan ,  Ming Zhang ,  Casey Robert Winkel ,  Jin Yang ,  David Shia ,  Mohanraj Prabhugoud

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/427 ,  H01L23/40

Abstract: Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.

公开(公告)号：US10963044B2

公开(公告)日：2021-03-30

申请号：US15282475

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Jiancheng Tao ,  Hong Wong ,  Xiaoguo Liang ,  Yanbing Sun ,  Jun Liu ,  Wah Yiu Kwong

IPC: G06F3/01 ,  G06T3/40 ,  G06K9/00 ,  G09G5/00 ,  G06F3/03 ,  G06F3/0484 ,  G06F40/103 ,  G09G5/14 ,  G09G5/26

Abstract: Methods, apparatus, systems are disclosed for altering displayed content on a display device responsive to a user's proximity. In accord with one example, a computing system includes a memory, a sensor to collect data representative of a viewing distance between a display and a user of the display, and a scaler to adjust a size of at least one object displayed by the display based on the viewing distance from the display.

公开(公告)号：US10317961B2

公开(公告)日：2019-06-11

申请号：US15487995

申请日：2017-04-14

Applicant: INTEL CORPORATION

Inventor： Yanbing Sun ,  Ming Zhang

IPC: G06F1/16 ,  G06F1/20 ,  H05K5/00 ,  H05K7/00

Abstract: An electronic device may be provided that includes a body having one or more electronic components. The body may have a first portion and a second portion. The second portion may include a first layer of material comprising a first metal and a second layer of material comprising a second metal. At least one electronic component may be between the first portion and the second portion.