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公开(公告)号：US09171742B2
公开(公告)日：2015-10-27
申请号：US13947543
申请日：2013-07-22
Applicant: International Business Machines Corporation
Inventor： Evan G. Colgan , Steven A. Cordes , Daniel C. Edelstein , Vijayeshwar D. Khanna , Kenneth Latzko , Qinghuang Lin , Peter J. Sorce , Sri M. Sri-Jayantha , Robert L. Wisnieff , Roy R. Yu
IPC: H01L21/00 , H01L21/50 , H01L25/00 , H01L25/065 , H01L29/06 , H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40
CPC classification number: H01L21/50 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2225/06513 , H01L2225/06593 , H01L2924/0002 , H01L2924/10156 , H01L2924/00
Abstract: The present disclosure relates to methods and devices for manufacturing a three-dimensional chip package. A method includes forming a linear groove on an alignment rail, attaching an alignment rod to the linear groove, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail. Another method includes forming an alignment ridge on an alignment rail, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail.
Abstract translation: 本公开涉及用于制造三维芯片封装的方法和装置。 一种方法包括在对准导轨上形成直线槽，将对准杆连接到线性槽，在多个集成电路芯片上形成对准通道，并通过将多个集成电路芯片沿着 对准导轨 另一种方法包括在对准导轨上形成对准脊，在多个集成电路芯片上形成对准通道，并且通过沿对准导轨堆叠多个集成电路芯片来对准多个集成电路芯片。
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公开(公告)号：US11077475B2
公开(公告)日：2021-08-03
申请号：US15602363
申请日：2017-05-23
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Steven J. Holmes , Emily R. Kinser , Qinghuang Lin , Nathan P. Marchack , Roy R. Yu
Abstract: A biosensor includes an array of metal nanorods formed on a substrate. An electropolymerized conductor is formed over tops of a portion of the nanorods to form a reservoir between the electropolymerized conductor and the substrate. The electropolymerized conductor includes pores that open and close responsively to electrical signals applied to the nanorods. A dispensing material is loaded in the reservoir to be dispersed in accordance with open pores.
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公开(公告)号：US10736997B2
公开(公告)日：2020-08-11
申请号：US15927419
申请日：2018-03-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Stacey M. Gifford , Huan Hu , Emily R. Kinser , Roy R. Yu , Sufi Zafar
IPC: A61L27/30 , A61L31/06 , A61L31/08 , B28B3/00 , H01L21/00 , A61L31/16 , B81C1/00 , A61L27/06 , A61L27/50 , A61L27/34 , A61L31/10 , B82B3/00
Abstract: Aspects include methods of fabricating antibacterial surfaces for medical implant devices including patterning a photoresist layer on a silicon substrate and etching the silicon to generate a plurality of nanopillars. Aspects also include removing the photoresist layer from the structure and coating the plurality of nanopillars with a biocompatible film. Aspects also include a system for preventing bacterial infection associated with medical implants including a thin silicon film including a plurality of nanopillars.
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公开(公告)号：US20200165494A1
公开(公告)日：2020-05-28
申请号：US16750719
申请日：2020-01-23
Applicant: International Business Machines Corporation
Inventor： James L. Hedrick , Robert D. Miller , Deborah A. Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
IPC: C09J9/00 , H01L23/48 , H01L23/00 , H01L21/683 , H01L21/768 , C09J11/04 , H01L25/00 , H01L25/065 , C09J183/04 , C09J179/08 , C09J179/04 , C09J11/06 , H01L23/60
Abstract: The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.
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15.发明授权公开(公告)号：US10585060B2
公开(公告)日：2020-03-10
申请号：US15720986
申请日：2017-09-29
Applicant: International Business Machines Corporation
Inventor： Hariklia Deligianni , Bruce B. Doris , Damon B. Farmer , Steven J. Holmes , Qinghuang Lin , Nathan P. Marchack , Deborah A. Neumayer , Roy R. Yu
IPC: G01N27/327 , G01N33/94 , H01L21/768 , G01N27/48 , H01L23/48 , H01L23/528 , G01N33/543 , H01L27/15 , G01N33/487
Abstract: Embodiments of the invention are directed to a biosensing integrated circuit (IC). A non-limiting example of the biosensing IC includes a plurality of semiconductor substrate layers. A sensor element is formed over a first one of the plurality of semiconductor substrate layers, wherein the sensor element is configured to, based at least in part on the sensor element interacting with a predetermined material, generate data representing a measureable electrical parameter. An adhesion enhancement region is configured to physically couple the sensor element to the first one of the plurality of semiconductor substrate layers. In some embodiments of the invention, the biosensing IC further includes an electrically conductive interconnect network configured to communicatively couple the data representing the measureable electrical parameter to computer elements.
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Patent Agency Ranking
公开(公告)号：US10583282B2
公开(公告)日：2020-03-10
申请号：US15811023
申请日：2017-11-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Steven J. Holmes , Qinghuang Lin , Emily R. Kinser , Nathan P. Marchack , Roy R. Yu
Abstract: A nanodevice includes an array of metal nanorods formed on a substrate. An electropolymerized electrical conductor is formed over tops of a portion of the nanorods to form a reservoir between the electropolymerized conductor and the substrate. The electropolymerized conductor includes pores that open or close responsively to electrical signals applied to the nanorods. A cell loading region is disposed in proximity of the reservoir, and the cell loading region is configured to receive stem cells. A neurotrophic dispensing material is loaded in the reservoir to be dispersed in accordance with open pores to affect growth of the stem cells when in vivo.
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公开(公告)号：US20200009369A1
公开(公告)日：2020-01-09
申请号：US16573644
申请日：2019-09-17
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Steven J. Holmes , Qinghuang Lin , Emily R. Kinser , Nathan P. Marchack , Roy R. Yu
Abstract: A nanodevice includes an array of metal nanorods formed on a substrate. An electropolymerized electrical conductor is formed over tops of a portion of the nanorods to form a reservoir between the electropolymerized conductor and the substrate. The electropolymerized conductor includes pores that open or close responsively to electrical signals applied to the nanorods. A cell loading region is disposed in proximity of the reservoir, and the cell loading region is configured to receive stem cells. A neurotrophic dispensing material is loaded in the reservoir to be dispersed in accordance with open pores to affect growth of the stem cells when in vivo.
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18.发明申请公开(公告)号：US20190101504A1
公开(公告)日：2019-04-04
申请号：US15802802
申请日：2017-11-03
Applicant: International Business Machines Corporation
Inventor： Hariklia Deligianni , Bruce B. Doris , Damon B. Farmer , Steven J. Holmes , Qinghuang Lin , Nathan P. Marchack , Deborah A. Neumayer , Roy R. Yu
IPC: G01N27/327 , H01L21/768 , G01N33/94 , G01N27/48
Abstract: Embodiments of the invention are directed to a biosensing integrated circuit (IC). A non-limiting example of the biosensing IC includes a plurality of semiconductor substrate layers. A sensor element is formed over a first one of the plurality of semiconductor substrate layers, wherein the sensor element is configured to, based at least in part on the sensor element interacting with a predetermined material, generate data representing a measurable electrical parameter. An adhesion enhancement region is configured to physically couple the sensor element to the first one of the plurality of semiconductor substrate layers. In some embodiments of the invention, the biosensing IC further includes an electrically conductive interconnect network configured to communicatively couple the data representing the measurable electrical parameter to computer elements.
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19.发明申请公开(公告)号：US20190101503A1
公开(公告)日：2019-04-04
申请号：US15720986
申请日：2017-09-29
Applicant: International Business Machines Corporation
Inventor： Hariklia Deligianni , Bruce B. Doris , Damon B. Farmer , Steven J. Holmes , Qinghuang Lin , Nathan P. Marchack , Deborah A. Neumayer , Roy R. Yu
IPC: G01N27/327 , H01L23/528 , H01L23/48 , H01L21/768 , G01N27/48 , G01N33/94
CPC classification number: G01N27/3277 , G01N27/3278 , G01N27/48 , G01N33/48728 , G01N33/5438 , G01N33/9413 , H01L21/76877 , H01L21/76898 , H01L23/481 , H01L23/528 , H01L27/153
Abstract: Embodiments of the invention are directed to a biosensing integrated circuit (IC). A non-limiting example of the biosensing IC includes a plurality of semiconductor substrate layers. A sensor element is formed over a first one of the plurality of semiconductor substrate layers, wherein the sensor element is configured to, based at hleast in part on the sensor element interacting with a predetermined material, generate data representing a measureable electrical parameter. An adhesion enhancement region is configured to physically couple the sensor element to the first one of the plurality of semiconductor substrate layers. In some embodiments of the invention, the biosensing IC further includes an electrically conductive interconnect network configured to communicatively couple the data representing the measureable electrical parameter to computer elements.
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公开(公告)号：US20180339155A1
公开(公告)日：2018-11-29
申请号：US15808137
申请日：2017-11-09
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Hariklia Deligianni , Bruce B. Doris , Steven J. Holmes , Emily R. Kinser , Qinghuang Lin , Roy R. Yu
IPC: A61N1/36 , A61B5/06 , A61B5/00 , A61B5/145 , H01L23/58 , H01L21/283 , H01L21/3213 , A61N1/05
Abstract: A sensing and treatment device includes an array of metal nanorod electrodes formed on a substrate, the array including first electrodes for sensing, and second electrodes for electrical pulsation. A data processing system is configured to monitor a parameter using the first electrodes and to activate the electrical pulsation in the second electrodes in accordance with a reading of the parameter.
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