-
公开(公告)号：US07622800B2
公开(公告)日：2009-11-24
申请号：US11760712
申请日：2007-06-08
IPC分类号： H01L23/34
CPC分类号： H01L25/105 , H01L2224/48237 , H01L2224/49109 , H01L2224/73265 , H01L2225/1029 , H01L2225/1058 , H01L2924/01046 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/00
摘要： A stackable semiconductor package and method includes providing a first semiconductor package having a first plurality of lower leads and a first plurality of upper leads. A second semiconductor package having a second plurality of lower leads is provided. The second plurality of lower leads is attached to the first plurality of upper leads to form a stack of semiconductor packages.
摘要翻译： 可堆叠的半导体封装和方法包括提供具有第一多个下引线和第一多个上引线的第一半导体封装。 提供具有第二多个下引线的第二半导体封装。 第二多个下引线附接到第一多个上引线以形成半导体封装的堆叠。
-
12.发明申请INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND RECESSED PACKAGE 有权集成电路封装系统，具有灵活的基板和封装公开(公告)号：US20090016032A1
公开(公告)日：2009-01-15
申请号：US12136002
申请日：2008-06-09
IPC分类号： H05K1/18
CPC分类号： H01L25/105 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
摘要翻译： 集成电路封装系统包括：提供具有折叠的柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的凹入封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。
-
公开(公告)号：US20080296759A1
公开(公告)日：2008-12-04
申请号：US11757869
申请日：2007-06-04
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/97 , H01L25/105 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/24137 , H01L2224/97 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/82 , H01L2924/00
摘要： A semiconductor package comprises a semiconductor component (e.g., a die) and a via at least partially covered by an encapsulant. The encapsulant forms substantially parallel top and bottom surfaces, with at least part of the via being exposed on the top surface. At least one conductive pad is exposed on the bottom surface, and the via can electrically couple the top and bottom surfaces, as well as couple the semiconductor component at the top and bottom surfaces. An additional semiconductor component can be coupled to the top surface with a circuit pattern formed on the top surface and coupled to the via.
摘要翻译： 半导体封装包括半导体部件（例如，管芯）和至少部分被密封剂覆盖的通孔。 密封剂形成基本上平行的顶表面和底表面，其中通孔的至少一部分暴露在顶表面上。 至少一个导电焊盘暴露在底表面上，并且通孔可以电耦合顶表面和底表面，以及在顶表面和底表面处连接半导体部件。 附加的半导体部件可以与形成在顶表面上并耦合到通孔的电路图案耦合到顶表面。
-
公开(公告)号：US20080157402A1
公开(公告)日：2008-07-03
申请号：US11618806
申请日：2006-12-30
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3135 , H01L23/49861 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/96 , H01L24/97 , H01L25/0652 , H01L25/165 , H01L2224/12105 , H01L2224/24137 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A dual molded multi-chip package system is provided including forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto, mounting a semiconductor device over the first encapsulation and connected to the lead, and forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
摘要翻译： 提供了一种双模塑多芯片封装系统，包括形成嵌入式集成电路封装系统，其具有部分覆盖第一集成电路管芯的第一封装和与其连接的引线，将半导体器件安装在第一封装上并连接到引线上，以及 在半导体器件和嵌入式集成电路封装系统上形成第二封装。
-
15.发明授权公开(公告)号：US07364945B2
公开(公告)日：2008-04-29
申请号：US11306628
申请日：2006-01-04
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/3135 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L31/0203 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
摘要翻译： 一种密封腔集成电路封装系统，包括形成第一集成电路封装，其具有具有封装空腔和插入件的反向底部端子，并将组件附接在封装腔中的插入件上。
-
公开(公告)号：US20070108568A1
公开(公告)日：2007-05-17
申请号：US11382983
申请日：2006-05-12
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/49555 , H01L23/3107 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package to package stacking system is provided including providing a first integrated circuit package, having a configured leadframe, providing a second integrated circuit package, having the configured leadframe, and forming an integrated circuit package pair by electrically connecting the configured leadframe of the first integrated circuit package to the configured leadframe of the second integrated circuit package.
摘要翻译： 提供集成电路封装到封装堆叠系统，包括提供第一集成电路封装，具有构造的引线框架，提供具有所配置的引线框架的第二集成电路封装，以及通过电连接所配置的引线框，形成集成电路封装对 第一集成电路封装到第二集成电路封装的配置的引线框架。
-
公开(公告)号：US08178982B2
公开(公告)日：2012-05-15
申请号：US11618806
申请日：2006-12-30
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3135 , H01L23/49861 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/96 , H01L24/97 , H01L25/0652 , H01L25/165 , H01L2224/12105 , H01L2224/24137 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A dual molded multi-chip package system is provided including forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto, mounting a semiconductor device over the first encapsulation and connected to the lead, and forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.
摘要翻译： 提供了一种双模塑多芯片封装系统，包括形成嵌入式集成电路封装系统，其具有部分覆盖第一集成电路管芯的第一封装和与其连接的引线，将半导体器件安装在第一封装上并连接到引线上，以及 在半导体器件和嵌入式集成电路封装系统上形成第二封装。
-
18.发明授权Integrated circuit package system with flexible substrate and mounded package 有权集成电路封装系统，具有柔性基板和堆叠封装公开(公告)号：US08031475B2
公开(公告)日：2011-10-04
申请号：US12136007
申请日：2008-06-09
CPC分类号： H05K1/189 , H01L23/49816 , H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/105 , H01L25/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/141 , H05K1/147 , H05K3/284 , H05K3/3436 , H05K2201/042 , H05K2201/056 , H05K2201/10515 , H05K2201/1053 , H05K2203/1316 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/45099
摘要： An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
摘要翻译： 集成电路封装系统包括：提供柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的堆叠封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。
-
19.发明申请ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF 有权集成电路集成电路封装系统及其制造方法公开(公告)号：US20110018084A1
公开(公告)日：2011-01-27
申请号：US12892907
申请日：2010-09-28
IPC分类号： H01L31/0203 , H01L21/56 , H01L31/18
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/3135 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L31/0203 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating an encapsulant cavity integrated circuit package system includes: forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
摘要翻译： 一种用于制造密封腔的集成电路封装系统的方法，包括：形成第一集成电路封装，其具有具有封装腔和反射器的倒置底端，并且将组件附着在封装腔中的插入件上。
-
公开(公告)号：US07309913B2
公开(公告)日：2007-12-18
申请号：US10986510
申请日：2004-11-10
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/73 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2225/06582 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A stacked semiconductor package includes a substrate and a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is mounted on the interposer.
摘要翻译： 堆叠的半导体封装包括衬底和衬底上的第一半导体器件。 插入器被支撑在与衬底相对的第一半导体器件的上方。 插入器电连接到基板。 第二半导体器件安装在插入器上。
-
-
-
-
-
-
-
-
-
搜索结果
252 条记录 (耗时 0.026 秒)
