公开(公告)号：US11474568B2

公开(公告)日：2022-10-18

申请号：US17227962

申请日：2021-04-12

Applicant: Intel Corporation

Inventor： Bijendra Singh ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  Kathiravan D

IPC: G06F1/16

Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.

公开(公告)号：US20220330454A1

公开(公告)日：2022-10-13

申请号：US17853239

申请日：2022-06-29

Applicant: Intel Corporation

Inventor： Bijendra Singh ,  Govindaraj G

IPC: H05K7/20 ,  F01P1/06

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to remove dust from an electronic device. An example apparatus includes a fan to rotate in a first direction in a first mode of operation of the electronic device, the first mode of operation corresponding to user operation of the electronic device, at least one memory, machine readable instructions, and processor circuitry to at least one of instantiate or execute the machine readable instructions to determine an operation time of the fan in the first mode of operation, and cause the fan to operate in a second mode of operation based on the operation time exceeding a threshold time, and, wherein in the second mode, pulsed power is applied to the fan to rotate the fan in a second direction opposite the first direction.

公开(公告)号：US20220326096A1

公开(公告)日：2022-10-13

申请号：US17850561

申请日：2022-06-27

Applicant: Intel Corporation

Inventor： Smit Kapila ,  Abhishek Srivastav ,  Sumod Cherukkate ,  Manit Biswas ,  Zhongsheng Wang ,  Bijendra Singh ,  Deepak Ganapathy ,  Dipen Dudhat

IPC: G01K11/22 ,  H05K7/20

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to monitor thermal degradation of a compute device. One such method includes calculating, by executing instructions with processor circuitry, a thermal degradation value based on an equation, the equation generated based on testing of thermal interface materials having varying degrees of degradation. The method also includes comparing, by executing instructions with the processor circuitry, the thermal degradation value to a thermal degradation threshold to determine whether the thermal degradation threshold is satisfied, and, when the thermal degradation threshold is satisfied, triggering generation of a thermal degradation alert.

公开(公告)号：US11360528B2

公开(公告)日：2022-06-14

申请号：US16728774

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Columbia Mishra ,  Carin Ruiz ,  Helin Cao ,  Soethiha Soe ,  James Hermerding, II ,  Bijendra Singh ,  Navneet Singh

IPC: G06F1/3203 ,  G06F1/20 ,  H04B1/3827 ,  G10L25/51 ,  G06F3/01 ,  G06F1/32 ,  G06V40/10

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example electronic device disclosed herein includes a housing, a fan, a first sensor, a second sensor, and a processor to at least one of analyze first sensor data generated by the first sensor to detect a presence of a subject proximate to the electronic device or analyze second sensor data generated by the second sensor to detect a gesture of the subject, and adjust one or more of an acoustic noise level generated the fan or a temperature of an exterior surface of the housing based on one or more of the presence of the subject or the gesture.

公开(公告)号：US20210096618A1

公开(公告)日：2021-04-01

申请号：US17119253

申请日：2020-12-11

Applicant: Intel Corporation

Inventor： Arunpandi Radhakrishnan ,  Bijendra Singh ,  Samarth Alva ,  Raghavendra S. Kanivihalli

IPC: G06F1/20 ,  G06F1/16

Abstract: In one embodiment, a computer system (e.g., a notebook computer) includes a lid with a display and a base coupled to the lid at one end of the base. The base defines one or more openings proximate to the end at which the lid is coupled to the base, and the computer system further includes a solid panel positioned proximate to the openings in the base such that the panel partially blocks the openings of the base. The position of the solid panel with respect to the openings of the base is based on a position of the lid with respect to the base.

公开(公告)号：US10594015B2

公开(公告)日：2020-03-17

申请号：US15609144

申请日：2017-05-31

Applicant: Intel Corporation

Inventor： Praveen Kumar ,  Bijendra Singh ,  Saku Lahti ,  Seppo Vesamaki ,  Marko Bonden

IPC: H01Q1/00 ,  F28D15/02 ,  F28D15/04 ,  F28F21/04 ,  F28F21/06 ,  H01Q1/02 ,  H01Q1/42 ,  H01R24/40 ,  H01Q1/24 ,  H01Q1/44 ,  F28D21/00

Abstract: A heat pipe is provided that is adapted for use as part of an antenna. The heat pipe includes a first conductive shell portion; a second conductive shell portion; and an insulating shell portion disposed between and connected to the first conductive shell portion and the second conductive shell portion. A wick structure is disposed within the sealed chamber.

公开(公告)号：US20190326081A1

公开(公告)日：2019-10-24

申请号：US16455576

申请日：2019-06-27

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Raghavendra Doddi ,  Prasanna Pichumani ,  Sachin Bedare ,  Bijendra Singh ,  Gopinath Kandasamy

IPC: H01H13/84 ,  H01H13/705 ,  G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.

公开(公告)号：US11966268B2

公开(公告)日：2024-04-23

申请号：US17732173

申请日：2022-04-28

Applicant: Intel Corporation

Inventor： Columbia Mishra ,  Carin Ruiz ,  Helin Cao ,  Soethiha Soe ,  James Hermerding, II ,  Bijendra Singh ,  Navneet Singh

IPC: G06F1/20 ,  G06F1/32 ,  G06F3/01 ,  G06V10/774 ,  G06V40/10 ,  G06V40/16 ,  G10L25/51 ,  H04B1/3827

CPC classification number: G06F1/206 ,  G06F1/32 ,  G06F3/013 ,  G06V10/774 ,  G06V40/10 ,  G06V40/165 ,  G10L25/51 ,  H04B1/3827 ,  G06F2200/201

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

公开(公告)号：US20230209775A1

公开(公告)日：2023-06-29

申请号：US17561916

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Kathiravan Dhandapani ,  Greeshmaja Govind ,  Asif S. Khan ,  Bijendra Singh ,  Yagnesh V. Waghela

IPC: H05K7/20 ,  F28D15/04 ,  F28D15/06 ,  F28D15/02 ,  G06F1/20

CPC classification number: H05K7/20336 ,  F28D15/06 ,  F28D15/046 ,  F28D15/0208 ,  F28D15/0233 ,  G06F1/20 ,  H05K7/20381 ,  G06F2200/201

Abstract: Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.

公开(公告)号：US11551891B2

公开(公告)日：2023-01-10

申请号：US16455576

申请日：2019-06-27

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Raghavendra Doddi ,  Prasanna Pichumani ,  Sachin Bedare ,  Bijendra Singh ,  Gopinath Kandasamy

IPC: H01H13/84 ,  H01H13/705 ,  G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.