摘要:
Embodiments of the invention generally provide an apparatus and technique for sharing an internally generated voltage between devices of a multi-chip package (MCP). The internally generated voltage may be shared via a conductive structure that electrically couples the devices and carries the internally generated voltage.
摘要:
The present invention is generally related to integrated circuit devices, and more particularly, to methods and systems of a multi-chip package (MCP) containing a self-diagnostic scheme for detecting errors in the MCP. The MCP generally comprises a controller, at least one volatile memory chip having error detection logic, at least one non-volatile memory chip, and at least one fail signature register for storing fail signature data related to memory errors detected in the MCP. The controller can poll the fail signature register for fail signature data related to memory errors stored therein. Upon detection of fail signature data, the controller can store the fail signature data on a fail signature register located on a non-volatile memory.
摘要:
A multi-chip package is provided that has at least a first, second and third chip, each comprising a top and bottom surface. The multi-chip package also has a package substrate for interfacing with a printed circuit board (PCB). The chips and the package substrate are housed within an encapsulation material. The bottom surface of the first chip is attached to the package substrate. The top surface of the first chip has a first plurality of landing pads, which serve as a mechanical and electrical interface between the first and second chip. The bottom surface of the second chip has a second plurality of landing pads that serve as a mechanical and electrical interface between the second and first chip. Additionally, the top surface of the second chip has a third plurality of landing pads that serve as a mechanical and electrical interface between the second and third chip.
摘要:
A multi-chip package is provided that has at least a first, second and third chip, each comprising a top and bottom surface. The multi-chip package also has a package substrate for interfacing with a printed circuit board (PCB). The chips and the package substrate are housed within an encapsulation material. The bottom surface of the first chip is attached to the package substrate. The top surface of the first chip has a first plurality of landing pads, which serve as a mechanical and electrical interface between the first and second chip. The bottom surface of the second chip has a second plurality of landing pads that serve as a mechanical and electrical interface between the second and first chip. Additionally, the top surface of the second chip has a third plurality of landing pads that serve as a mechanical and electrical interface between the second and third chip.
摘要:
A multi-element device includes a plurality of memory elements, each of which includes a memory array, access circuitry to control access to the memory array, and power control circuitry. The power control circuitry, which includes one or more control registers for storing first and second control values, controls distribution of power to the access circuitry in accordance with the first control value, and controls distribution of power to the memory array in accordance with the second control value. Each memory element also includes sideband circuitry for enabling a host system to set at least the first control value and the second control value in the one or more control registers.
摘要:
A ring oscillator (and test circuit incorporating the ring oscillator and test method therefor) includes an odd number of elements interconnected in a serially-connected infinite loop, each oscillator element having an associated programmable delay feature. The circuit can be used to measure effects of Negative Bias Temperature Instability (NBTI) in p-channel MOSFETs (PFETs).
摘要:
Provides within a semiconductor chip a plurality of internal DRAM arrays connected to each section data bus. A cross-point switch simultaneously connects the plural section data buses to a corresponding plurality of port registers that transfer data between a plurality of ports (I/O pins) on the chip and the section data buses in parallel in either data direction to effectively support a high multi-port data rate to/from the memory chip. For any section, the data may be transferred entirely in parallel between the associated port and a corresponding port register, or the data may be multiplexed between each port and its port register in plural sets of parallel bits. Each of the DRAM banks in the chip is addressed and accessed in parallel with the other DRAM banks through a bank address control in the chip which receives all address requests from four processors in a computer system. Each section data bus is comprised of a large number of data lines that transfer data bits in parallel to/from all of DRAM cells in an address-selected row in one of the DRAM banks at a time in each section. The four DRAM section buses in the chip may be transferring data at the same time in independent directions to/from the four chip ports.
摘要:
A memory device is placed in a mode that redefines the command set used to control the memory device. This may occur either in anticipation of the memory system falling out of calibration, or after it has already fallen out of calibration. The redefined command set is designed such that it may be reliably received by the memory device at the specified rate even if the memory system has fallen out of calibration. The redefined command set is then used to issue command(s) to recalibrate one or more communication links such that they can exchange data, commands, and/or addresses at a specified rate. After recalibration, the memory device is returned to responding to the original command set.
摘要:
A multi-element device includes a plurality of memory elements, each of which includes a memory array, access circuitry to control access to the memory array, and power control circuitry. The power control circuitry, which includes one or more control registers for storing first and second control values, controls distribution of power to the access circuitry in accordance with the first control value, and controls distribution of power to the memory array in accordance with the second control value. Each memory element also includes side-band circuitry for enabling a host system to set at least the first control value and the second control value in the one or more control registers.
摘要:
A programmable self-time refresh circuit for a semiconductor memory and methods for programming the self-refresh rate for non-invasively and deterministically testing the self-timed refresh circuit for establishing/verifying a refresh rate and a wait state interval for the self-refresh operation. The programmable refresh circuit includes a self-timed oscillator that outputs a clocking signal, and a programmable pattern generator that outputs a first signal pattern and a second signal pattern. The first signal pattern is fed to a counter circuit which also receives the clocking signal. The counter circuit outputs a signal pulse whenever the count driven by the clocking signal reaches a digital pattern representation corresponding to the first signal pattern generated by the programmable pattern generator. Refresh control logic is connected to receive the pulse signal and respond thereto by refreshing a portion of the memory array of the semiconductor memory device. The second signal pattern is employed by the refresh control logic to set the wait state interval for the self-refresh operation. Multiple methods for testing the programmable self-refresh circuit are also set forth.