公开(公告)号：US5850691A

公开(公告)日：1998-12-22

申请号：US740833

申请日：1996-11-04

Applicant: James S. Bell

Inventor： James S. Bell

IPC: H05K3/30 ,  H05K7/10 ,  H05K3/32 ,  H05K7/12 ,  H05K13/04

CPC classification number: H05K7/1069 ,  H05K3/301 ,  H05K7/1084 ,  H05K3/306 ,  Y10S269/903 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49153 ,  Y10T29/53265

Abstract: The present invention is directed to a device for securing an electrical component to a pin grid array (PGA) socket that has a substantially planar body portion and a plurality of conductor pins, which are electrically connectable to a circuit board and project outwardly in a direction substantially perpendicular to the planar body portion. The device comprises a base member that has a plurality of conductor pin apertures which extend through the base member. Each of the conductor pin apertures are registered to receive therethrough a corresponding one of the plurality of conductor pins, to thereby sandwich the base member between and anchor the base member to the circuit board and the PGA socket when the PGA socket is electrically connected to the circuit board. The device further comprises a retainer for releasably securing the electrical component to the PGA socket. The retainer is coupled to the base member and a surface of the electrical component and transmits a retaining force from the base member to the electrical component, thereby substantially preventing the electrical component from separating from the PGA socket.

Abstract translation: 本发明涉及一种用于将电气部件固定到具有基本上平坦的主体部分和多个导体销的针状格栅阵列（PGA）插座的装置，其可电连接到电路板并沿着方向向外突出 基本上垂直于平面主体部分。 该装置包括具有延伸穿过基底构件的多个导体销孔的基座构件。 每个导体销孔被配准为通过其中的相应的一个导体销来接纳，从而当基座部件电连接到电路板和PGA插座时，将基座夹在基板之间并将其固定到PGA插座 电路板。 该装置还包括用于将电气部件可释放地固定到PGA插座的保持器。 保持器联接到基部构件和电气部件的表面，并且将保持力从基部构件传递到电气部件，从而基本上防止电气部件与PGA插座分离。

公开(公告)号：US5535330A

公开(公告)日：1996-07-09

申请号：US279759

申请日：1994-07-22

Applicant: James S. Bell

Inventor： James S. Bell

IPC: G01R31/28 ,  G06F11/22 ,  G06F11/24 ,  G06F11/34

CPC classification number: G01R31/2803 ,  G06F11/22 ,  G06F11/2273 ,  G06F11/24

Abstract: A system for detecting and locating errors in printed wire assemblies contained in a device with capabilities of performing a power on self test (POST) comprised of testing subroutines. The system monitors the device during execution of the POST. If a run error occurs during the POST, the system, through its monitoring, receives an indication of the run error. The system then delivers to the device a command, external to the POST routine, which directs the POST routine to thereafter separately execute each of the testing subroutines of the POST. If a run error occurs in any testing subroutine as it is being separately executed, a signal indicative of the run error and particular testing subroutine in which it occurred is sent to the system. The system, in this manner, may track a particular printed wire assembly and, with information about where within the printed wire assembly execution steps of the particular testing subroutine occur, determine the source within the printed wire assembly of the failure which caused the run error.

Abstract translation: 一种用于检测和定位包含在具有执行由测试子程序组成的电源自检（POST）的能力的设备中的印刷线组件中的错误的系统。 系统在执行POST期间监视设备。 如果在POST期间发生运行错误，则系统通过其监视接收运行错误的指示。 然后，系统将该例程的外部命令传递给设备，该命令指示POST例程，然后单独执行POST的每个测试子例程。 如果在任何测试子程序中分别执行运行错误，则表示运行错误的信号及其发生的特定测试子程序被发送到系统。 以这种方式，该系统可以跟踪特定的印刷线组件，并且关于在特定测试子程序的印刷线组件执行步骤中的位置的信息，确定导致运行误差的故障的印刷线组件内的源 。

公开(公告)号：US5284097A

公开(公告)日：1994-02-08

申请号：US786332

申请日：1991-10-31

Applicant: Richard A. Peppin ,  Robert G. Vieau ,  James S. Bell

Inventor： Richard A. Peppin ,  Robert G. Vieau ,  James S. Bell

IPC: E01B27/02 ,  E02F5/22 ,  B61D7/02

CPC classification number: E01B27/02 ,  E02F5/22 ,  E01B2203/028 ,  E01B2203/038 ,  E01B2203/083

Abstract: A railroad maintenance device distributes, regulates and reclaims ballast along a railway road bed. The device includes one or more hopper cars for transporting and depositing ballast, a regulating car including a track regulator, a shoulder regulator, and an extensible plow arm for reclaiming ballast deposited at a distance from the shoulder of the road bed. The hopper cars include radio controlled gates for the remote control of ballast depositing operations, and a computer controlled system for optimizing the distribution of ballast according to predetermined parameters. A bucket elevator is located rearwardly of the track regulator for lifting excess ballast from the road bed, and a belt conveyor transports the lifted ballast to a hopper car.

Abstract translation: 铁路维修装置沿铁路路床分配，调节和回收镇流器。 该装置包括用于运输和沉积压载物的一个或多个料斗车，包括轨道调节器的调节车，肩部调节器和用于回收距离道路床的肩部一定距离沉积的压载物的可延伸的犁臂。 漏斗车包括用于遥控镇流器沉积操作的无线电控制门，以及用于根据预定参数优化镇流器分配的计算机控制系统。 斗式提升机位于轨道调节器的后方，用于从路床提升多余的压载物，而带式输送机将提升的镇流器运送到料斗车厢。

公开(公告)号：US07262354B2

公开(公告)日：2007-08-28

申请号：US11072702

申请日：2005-03-04

Applicant: Gregory D. Orred ,  James S. Bell

Inventor： Gregory D. Orred ,  James S. Bell

IPC: G10D3/00

CPC classification number: G10D3/06

Abstract: The disclosed apparatus relates to a stringed practice device comprising: a neck with an upper end and a lower end; a headstock coupled to the lower end of the neck; and where the headstock comprises a plurality of tuning posts. The disclosed method relates to a using a stringed practice device. The method comprises resting a headstock against a thigh of the user; and fingering the strings on a neck of the stringed practice device with one hand of the user.

Abstract translation: 所公开的装置涉及一种弦乐练习装置，包括：具有上端和下端的颈部; 头架与颈部的下端连接; 并且其中主轴箱包括多个调音柱。 所公开的方法涉及使用弦乐练习装置。 该方法包括将头架靠在使用者的大腿上; 并用用户的一只手指着弦乐练习装置的颈部上的弦。

公开(公告)号：US06492803B2

公开(公告)日：2002-12-10

申请号：US09727668

申请日：2000-12-01

Applicant: James S. Bell ,  Lonnie W. Smith

Inventor： James S. Bell ,  Lonnie W. Smith

IPC: G01R3102

CPC classification number: G06F11/2289 ,  G01R31/31905

Abstract: An apparatus is provided for retaining a production level device for use with an automated testing device for testing personal computer components. The apparatus includes an extrusion having a first portion for receiving the production level device and a second portion for attaching the extrusion to the automated test device. The apparatus also includes a moldable fastener for precisely fastening the production-level device to the first portion.

Abstract translation: 提供了一种用于保持用于测试个人计算机部件的自动测试装置使用的生产级装置的装置。 该装置包括具有用于接收生产级装置的第一部分和用于将挤压连接到自动化测试装置的第二部分的挤压件。 该设备还包括用于将生产级设备精确地紧固到第一部分的可模制紧固件。

公开(公告)号：US06037764A

公开(公告)日：2000-03-14

申请号：US785498

申请日：1997-01-17

Applicant: Lonnie W. Smith ,  James S. Bell

Inventor： Lonnie W. Smith ,  James S. Bell

IPC: G01R31/28 ,  G01R31/02

CPC classification number: G01R31/2887

Abstract: A hold-down finger for holding a circuit board in a test fixture. The hold-down finger includes an attachment portion and a finger. The attachment portion is for attaching the hold-down finger to the test fixture. The attachment portion has a central axis. The finger is coupled to the attachment portion at a location displaced from the central axis of the attachment portion. Displacing the finger from the central axis allows for the tip of the finger to be located more precisely in a radial manner about the center point of the device to hold a circuit board down against the extreme pressures of test probe springs.

Abstract translation: 用于将电路板保持在测试夹具中的按压指状物。 压紧手指包括附接部分和手指。 附接部分用于将压紧手指附接到测试夹具。 附接部分具有中心轴线。 手指在从附接部分的中心轴线偏移的位置处联接到附接部分。 将指状物从中心轴线移开允许手指的尖端以围绕装置的中心点的径向方式更精确地定位，以将电路板向下抵抗测试探针弹簧的极限压力。

公开(公告)号：US5806178A

公开(公告)日：1998-09-15

申请号：US785868

申请日：1997-01-21

Applicant: James S. Bell

Inventor： James S. Bell

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34

CPC classification number: H05K1/0292 ,  H05K1/114 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/0393 ,  H05K2201/09227 ,  H05K2201/09518 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10651 ,  H05K2203/0455 ,  Y10T29/49004 ,  Y10T29/49144 ,  Y10T29/49815

Abstract: A rework configuration is provided for disconnecting defective lithography-formed conductors and/or overlying electrical components from the printed circuit wiring netlist and connecting rework elements at the substituted sites. In particular, defective regions can be severed at spaced first and second target areas the upper surface of the PCB and one or more interconnect structures can be coupled therebetween. The interconnect structures allow re-routing of PCB conductors, allow connectivity between the upper and lower surfaces, allow connectivity to power and ground planes, and allow pull-up, pull-down and decoupling connectivity.

Abstract translation: 提供了返工配置，用于将有缺陷的光刻形成的导体和/或从印刷电路布线网表上覆盖电气部件和连接替代部位的返工元件。 特别地，缺陷区域可以在间隔开的第一和第二目标区域被切断，PCB的上表面和一个或多个互连结构可以在它们之间耦合。 互连结构允许重新布线PCB导体，允许上表面和下表面之间的连接，允许连接电源和接地层，并允许上拉，下拉和去耦连接。

公开(公告)号：US5486657A

公开(公告)日：1996-01-23

申请号：US257755

申请日：1994-06-09

Applicant: James S. Bell ,  Patricia L. Herman ,  Richard I. Phillips

Inventor： James S. Bell ,  Patricia L. Herman ,  Richard I. Phillips

IPC: H05K1/11 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K3/3405 ,  H05K1/117 ,  H05K3/3452 ,  H05K2201/09154 ,  H05K2201/09381 ,  H05K2201/09709 ,  H05K2201/09736 ,  H05K2201/099 ,  H05K2201/10189 ,  H05K2203/0545 ,  H05K2203/0594 ,  H05K2203/167 ,  H05K3/3484

Abstract: A printed circuit board is provided having a beveled edge for ease of insertion into a receptor. The beveled edge is extended onto the solder mask to present a contiguous beveled surface. Moreover, the PCB includes bonding pads which can be surface mounted with pins extending from the receptor. Each bonding pad includes a forward portion and a rearward portion. The forward portion is covered with the solder mask layer to present a smooth surface channeled inward in a V-shaped configuration. The forward portion channels or directs the pin along a central axis near the apex of the V-shaped forward portion onto the upper surface of the bonding pad rearward portion. Accordingly, the pin is channeled to an area absent solder paste along the central axis such that during subsequent reflow operation the solder paste is reliably extended over and around the centrally placed pin.

Abstract translation: 提供了一种印刷电路板，其具有倾斜边缘，以便于插入到受体中。 斜边缘延伸到焊接掩模上以呈现相邻的斜面。 此外，PCB包括可以从接收器延伸的针表面安装的接合焊盘。 每个焊盘包括前部和后部。 前面部分被焊接掩模层覆盖，以呈现呈V形构造向内的光滑表面。 前部部分将销钉沿着V形前部的顶点附近的中心轴线引导到接合垫后部的上表面上。 因此，引脚沿着中心轴被引导到没有焊膏的区域，使得在随后的回流操作期间，焊膏被可靠地延伸到中心放置的引脚上方和周围。

公开(公告)号：US5463191A

公开(公告)日：1995-10-31

申请号：US212477

申请日：1994-03-14

Applicant: James S. Bell ,  Deepak Swamy

Inventor： James S. Bell ,  Deepak Swamy

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H05K1/00

CPC classification number: H05K3/0094 ,  H05K1/113 ,  H05K3/3463 ,  H05K2201/09572 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K3/3431 ,  H05K3/429

Abstract: A circuit board design featuring a fine pitch ball grid array ("BGA") having a simplified construction. The circuit board comprises: (1) an insulating substrate, the substrate having a via therethrough, (2) a conductive layer located over the substrate, the via passing through the layer and laterally uninterrupted through the circuit board, (3) a first solder having a first melting point located within and substantially blocking the via and (4) a second solder having a second melting point located over the blocked via, the second melting point lower than the first melting point, the first solder remaining substantially solid and preventing the second solder from substantially entering the via when the first and second solders are heated to a temperature between the first and second melting points. The present invention eliminates precision drilling required by current blind via BGA pad designs.

Abstract translation: 具有简化结构的细间距球栅阵列（“BGA”）的电路板设计。 所述电路板包括：（1）绝缘基板，所述基板具有通孔，（2）位于所述基板上方的导电层，所述通孔穿过所述层并横向不间断地穿过所述电路板，（3）第一焊料 具有位于并基本上阻塞通孔的第一熔点和（4）具有位于阻塞通路上方的第二熔点的第二焊料，第二熔点低于第一熔点，第一焊料基本上保持固体，并防止 当第一和第二焊料被加热到第一和第二熔点之间的温度时，第二焊料基本上进入通孔。 本发明消除了当前通过BGA焊盘设计的盲孔所需的精密钻孔。