公开(公告)号：US20120133002A1

公开(公告)日：2012-05-31

申请号：US13298571

申请日：2011-11-17

申请人： Jochen REINMUTH ,  Heiko Stahl

发明人： Jochen REINMUTH ,  Heiko Stahl

IPC分类号： H01L29/84 ,  H01L21/00

CPC分类号： B81C1/00571 ,  B81B2203/0118 ,  B81B2203/0136 ,  B81C2201/014

摘要： A method for producing microelectromechanical structures in a substrate includes: arranging at least one metal-plated layer on a main surface of the substrate in a structure pattern; leaving substrate webs open beneath a structure pattern region by introducing first trenches into the substrate perpendicular to a surface normal of the main surface in a region surrounding the structure pattern; coating the walls of the first trenches perpendicular to the surface normal of the main surface with a passivation layer; and introducing cavity structures into the substrate at the base of the first trenches in a region beneath the structure pattern region.

摘要翻译： 在基板中制造微机电结构的方法包括：以结构图案在基板的主表面上布置至少一个金属镀层; 通过在围绕结构图案的区域中垂直于主表面的表面法垂直地将第一沟槽引入到衬底中，使衬底腹板打开在结构图案区域下方; 用钝化层涂覆垂直于主表面的法线的第一沟槽的壁; 以及在结构图案区域下方的区域中在第一沟槽的基部处将空腔结构引入衬底。

公开(公告)号：US20120037412A1

公开(公告)日：2012-02-16

申请号：US13195470

申请日：2011-08-01

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： H05K1/16 ,  H05K1/11 ,  H01K3/10

CPC分类号： H01L21/76898 ,  B81B3/0086 ,  B81B2201/0264 ,  B81B2207/096 ,  G01L9/0042 ,  G01L19/0076 ,  H01L21/7682 ,  H01L23/481 ,  H01L2924/0002 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method is described for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough. The method has the following operations of forming the electrical feedthrough so that it extends through the substrate from the front side to the back side of the substrate, forming a first closing layer on a front side of the substrate, forming an annular isolation trench in the substrate which encloses the electrical feedthrough, using an etching process starting from the back side of the substrate, the etching process terminating at the first closing layer, and closing off the annular isolation trench in the substrate by forming a second closing layer on the back side of the substrate.

摘要翻译： 描述了一种用于在基板中制造电馈通的方法，以及具有电馈通的基板。 该方法具有形成电馈通的以下操作，使得其从衬底的前侧延伸到后侧，在衬底的前侧形成第一闭合层，在衬底的前侧形成环形隔离沟槽 衬底，其包围电馈通，使用从衬底的背面开始的蚀刻工艺，蚀刻工艺终止于第一封闭层，并且通过在背面形成第二封闭层来封闭衬底中的环形隔离沟槽 的基底。

公开(公告)号：US20110169125A1

公开(公告)日：2011-07-14

申请号：US13004599

申请日：2011-01-11

申请人： Jochen REINMUTH ,  Barbara Will ,  Heribert Weber

发明人： Jochen REINMUTH ,  Barbara Will ,  Heribert Weber

IPC分类号： H01L29/06 ,  H01L21/60

CPC分类号： H01L21/3081 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/033 ,  B81C1/00404 ,  B81C1/00626 ,  H01L21/0334 ,  H01L21/76229

摘要： A method is described for creating at least one recess in a semiconductor component, in particular a micromechanical or electrical semiconductor component, having the following steps: applying at least one mask to the semiconductor component, forming at least one lattice having at least one or more lattice openings in the mask over the recess to be formed, the lattice opening or lattice openings being formed as a function of the etching rate and/or the dimensioning of the recess to be formed; forming the recess below the lattice.

摘要翻译： 描述了一种用于在半导体部件，特别是微机电或电半导体部件中形成至少一个凹部的方法，其具有以下步骤：将至少一个掩模施加到半导体部件，形成至少一个具有至少一个或多个 在要形成的凹部上的掩模中的格子孔，形成作为蚀刻速率和/或要形成的凹部的尺寸的函数的格子孔或格子孔; 在网格下面形成凹陷。

公开(公告)号：US20140376069A1

公开(公告)日：2014-12-25

申请号：US14311760

申请日：2014-06-23

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： G02B26/08 ,  B81C1/00

CPC分类号： G02B26/0841 ,  Y10T29/49117

摘要： A micro-electromechanical reflector is described including an electrode substrate having a first surface and a second surface, which is opposite to the first surface, on whose first surface a carrier layer is situated, a plurality of electrode recesses, which are introduced under the carrier layer from the first surface into the electrode substrate, a plurality of second electrode recesses, which are introduced from the second surface into the electrode substrate, at least one torsion spring structure which is formed in the carrier layer over one of the first electrode recesses, a carrier substrate, which is attached to the second surface of the electrode substrate, and a reflector surface, which is situated on the carrier layer.

摘要翻译： 描述了一种微机电反射器，其包括具有第一表面和第二表面的电极基底，第一表面和第二表面与第一表面相对，在其第一表面上具有载体层，多个电极凹槽，引入载体 从所述第一表面到所述电极基板的多个第二电极凹部，从所述第二表面引入所述电极基板的至少一个扭转弹簧结构，所述扭转弹簧结构形成在所述第一电极凹部中的一个上方的所述载体层中， 附着到电极基板的第二表面的载体基板和位于载体层上的反射器表面。

公开(公告)号：US20130334622A1

公开(公告)日：2013-12-19

申请号：US13917044

申请日：2013-06-13

申请人： Julian GONSKA ,  Jochen REINMUTH ,  Kathrin GUTSCHE

发明人： Julian GONSKA ,  Jochen REINMUTH ,  Kathrin GUTSCHE

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0018 ,  B81B7/0038 ,  B81B7/02 ,  B81B2201/025 ,  B81C1/00134

摘要： A micromechanical device, in particular a sensor device, and a method for manufacturing a micromechanical device are provided. The micromechanical device has a housing, the housing including a first cavity, and the housing including a second cavity that is separate from the first cavity. The micromechanical device is configured in such a way that a predetermined first gas pressure prevails in the first cavity, and a predetermined second gas pressure which is reduced compared to the first gas pressure prevails in the second cavity. A heating element is situated in the area of the second cavity. The micromechanical device has a printed conductor, the heating element being heatable with the aid of the printed conductor.

摘要翻译： 提供微机械装置，特别是传感器装置，以及微机械装置的制造方法。 微机械装置具有壳体，壳体包括第一空腔，并且壳体包括与第一空腔分离的第二空腔。 微机械装置被配置成使得在第一空腔中存在预定的第一气体压力，并且与第一气体压力相比降低的预定的第二气体压力在第二空腔中占优势。 加热元件位于第二腔的区域中。 微机械装置具有印刷导体，加热元件借助印刷导体可加热。

公开(公告)号：US20130299923A1

公开(公告)日：2013-11-14

申请号：US13889814

申请日：2013-05-08

申请人： Johannes CLASSEN ,  Jochen REINMUTH ,  Guenther-Nino-Carlo ULLRICH

发明人： Johannes CLASSEN ,  Jochen REINMUTH ,  Guenther-Nino-Carlo ULLRICH

IPC分类号： B81B3/00

CPC分类号： B81B3/0018 ,  B81B3/0051 ,  B81B2201/0235 ,  G01P2015/0871

摘要： A micromechanical acceleration sensor includes a seismic mass and a substrate that has a reference electrode. The seismic mass is deflectable in a direction perpendicular to the reference electrode, and the seismic mass has a flexible stop in the deflection direction. The flexible stop of the seismic mass includes an elastic layer.

摘要翻译： 微机械加速度传感器包括地震块和具有参考电极的基底。 地震质量可以在垂直于参考电极的方向上偏转，并且地震质量在偏转方向上具有柔性停止。 抗震块的柔性挡块包括弹性层。

公开(公告)号：US20140376070A1

公开(公告)日：2014-12-25

申请号：US14313716

申请日：2014-06-24

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： G02B26/08

CPC分类号： G02B26/0841 ,  Y10T29/49155

摘要： A micro-electromechanical reflector includes an electrode substrate having first and second surfaces opposite to the first surface, on whose first surface a monocrystalline silicon layer is situated, a plurality of electrode recesses, which are introduced from the second surface into the electrode substrate, at least one torsion spring structure, which is implemented in the monocrystalline silicon layer above one of the electrode recesses, a carrier substrate, which is applied to the second surface of the electrode substrate, and a reflector surface situated on the monocrystalline silicon layer. At least one first electrode, movably mounted in the electrode substrate via the torsion spring structure, and at least one second electrode, mechanically fixedly anchored to the carrier substrate and the monocrystalline silicon layer, are formed by the electrode recesses. The electrode surfaces of the first and second electrodes are situated in parallel to one another and perpendicularly to the electrode substrate surfaces.

摘要翻译： 微机电反射器包括具有与第一表面相对的第一表面和第二表面的电极基板，其第一表面是单晶硅层，多个电极凹槽从第二表面引入电极基板， 至少一个扭转弹簧结构，其在单电极硅层中的一个电极凹槽中的一个上实现，施加到电极基板的第二表面的载体基板和位于单晶硅层上的反射器表面。 通过电极凹部形成至少一个通过扭簧结构可移动地安装在电极基板中的第一电极和至少一个第二电极，机械地固定地锚定到载体基板和单晶硅层。 第一和第二电极的电极表面彼此平行并垂直于电极基底表面。

公开(公告)号：US20130044363A1

公开(公告)日：2013-02-21

申请号：US13586363

申请日：2012-08-15

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： G02B26/00 ,  B05D5/06 ,  B05D3/10

CPC分类号： G02B21/084 ,  B81B2201/042 ,  B81B2203/0163 ,  B81B2203/04 ,  B81B2203/058 ,  B81C1/00166 ,  G02B26/0841

摘要： A micromechanical component having a displaceable part connected to a residual substrate by at least one spring, and including first and second subunits, between which an insulating intermediate layer and at least one semiconductor boundary layer is formed; an inner region of the first subunit, which inner region is aligned with the second subunit, being patterned out of a substrate using at least one cavity etched in a first etching direction; an outer region of the first subunit of the displaceable part, which outer region faces away from the second subunit, being patterned out of the substrate using at least one hollowed-out section etched in a second etching direction; the second subunit being patterned out of a semiconductor layer deposited onto the insulating intermediate layer and/or on the at least one semiconductor boundary layer using at least one continuous separating trench. Also described is a related manufacturing method.

摘要翻译： 一种微机械部件，其具有通过至少一个弹簧连接到残留基板的位移部件，并且包括第一和第二子单元，其间形成绝缘中间层和至少一个半导体边界层; 所述第一子单元的内部区域与所述第二子单元对准，使用在第一蚀刻方向上蚀刻的至少一个空腔从衬底图案化; 使用在第二蚀刻方向上蚀刻的至少一个中空部分，使所述外部区域远离所述第二子单元的所述可移位部分的第一子单元的外部区域从所述基板图案化; 所述第二子单元使用至少一个连续分离沟槽从沉积在所述绝缘中间层和/或所述至少一个半导体边界层上的半导体层图案化。 还描述了相关的制造方法。

公开(公告)号：US20120251799A1

公开(公告)日：2012-10-04

申请号：US13434486

申请日：2012-03-29

申请人： Jochen REINMUTH ,  Andreas SCHEURLE ,  Christian BIERHOFF

发明人： Jochen REINMUTH ,  Andreas SCHEURLE ,  Christian BIERHOFF

IPC分类号： B32B7/14 ,  B44C1/22

CPC分类号： B81C1/00039 ,  B81B2207/07 ,  G01P15/0802 ,  Y10T428/24851

摘要： A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.

摘要翻译： 具有基板的微机械系统被描述; 位于基板上方的第一微机械功能区域; 第二微机械功能区域，其位于第一微机械功能区域上方，并且经由第一网状锚定结构连接到第一微机械功能区域; 第三微机械功能区域，其位于第二微机械功能区域上方，并且具有第一子区域和第二子区域; 所述第一子区域经由第二网状锚定结构连接到所述第二微机械功能区域; 并且第二子区域通过第一子区域浮动在衬底上。 本发明还提供了一种用于制造这种微机械系统的方法。

公开(公告)号：US20110048137A1

公开(公告)日：2011-03-03

申请号：US12846423

申请日：2010-07-29

申请人： Jochen REINMUTH ,  Peter Schmollngruber ,  Hans Artmann

发明人： Jochen REINMUTH ,  Peter Schmollngruber ,  Hans Artmann

IPC分类号： G01L7/00

CPC分类号： G01L19/148 ,  G01L19/0061 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/00014

摘要： A simple to implement contacting variant makes it possible to create a reliable electrical connection between the sensor element and the evaluation electronics of a pressure sensor, including at least one media-resistant sensor element, evaluation electronics in the form of at least one additional component connected electrically to the sensor element, and a multipart housing, the sensor element being situated in a first housing area having at least one pressure connection, and the evaluation electronics being situated in a second sealed housing area which is separated from the first housing area by a separating wall. The electrical connection between the sensor element and the evaluation electronics is implemented in the form of media-resistant bonding wires which are guided from the first into the second housing area through the bonded joint area between the separating wall and an additional housing part.

摘要翻译： 简单实现接触变体使得可以在传感器元件和压力传感器的评估电子器件之间创建可靠的电连接，包括至少一个耐介质传感器元件，至少一个附加部件连接形式的评估电子器件 电传送到传感器元件和多部分壳体，传感器元件位于具有至少一个压力连接的第一壳体区域中，并且评估电子设备位于第二密封壳体区域中，该第二密封壳体区域与第一壳体区域分离 分隔墙。 传感器元件和评估电子元件之间的电连接以不受介质影响的接合线的形式实现，该接合线通过隔离壁和附加壳体部分之间的接合接合区域从第一壳体引导到第二壳体区域。