公开(公告)号：US20150054101A1

公开(公告)日：2015-02-26

申请号：US14467726

申请日：2014-08-25

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0078 ,  B81B7/0016 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00825

摘要： A micromechanical component comprising a substrate having a main plane of extension, comprising a movable element, and comprising a spring arrangement assemblage is provided, the movable element being attached to the substrate by way of the spring arrangement assemblage, the movable element being deflectable out of a rest position into a deflection position, the movable element encompassing a first sub-element and a second sub-element connected to the first sub-element, the first sub-element extending mainly along the main plane of extension of the substrate, the second sub-element extending mainly along a functional plane, the functional plane being disposed substantially parallel to the main plane of extension of the substrate, the functional plane being spaced away from the main plane of extension.

摘要翻译： 一种微机械部件，包括具有主平面延伸部的基板，包括可移动元件，并且包括弹簧装置组合件，所述可移动元件通过所述弹簧装置组合件附接到所述基板，所述可移动元件可偏转 静止位置进入偏转位置，所述可移动元件包围第一子元件和连接到第一子元件的第二子元件，第一子元件主要沿着基板的延伸主平面延伸，第二子元件 子元件主要沿着功能平面延伸，功能平面设置成基本上平行于基板延伸的主平面，功能平面与主延伸平面间隔开。

公开(公告)号：US20140027927A1

公开(公告)日：2014-01-30

申请号：US13923035

申请日：2013-06-20

申请人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Jens FREY ,  Yvonne BERGMANN

IPC分类号： H01L23/48 ,  H01L21/762

CPC分类号： H01L21/76224 ,  B81B7/007 ,  B81B2207/096 ,  B81C1/00095 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/05009 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83193 ,  H01L2224/83805 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  H01L2224/0231 ,  H01L2224/83 ,  H01L21/78 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/00

摘要： A method for manufacturing a component having an electrical through-connection is described. The method includes the following steps: providing a semiconductor substrate having a front side and a back side opposite from the front side, producing an insulating trench, which annularly surrounds a contact area, on the front side of the semiconductor substrate, filling the insulating trench with an insulating material, producing an electrical contact structure on the front side of the semiconductor substrate by depositing an electrically conductive material in the contact area, removing the semiconductor material remaining in the contact area on the back side of the semiconductor substrate in order to produce a contact hole which opens up the bottom side of the contact structure, and depositing a metallic material in the contact hole in order to electrically connect the electrical contact structure to the back side of the semiconductor substrate.

摘要翻译： 描述了一种用于制造具有电穿通连接的部件的方法。 该方法包括以下步骤：提供具有与前侧相反的前侧和后侧的半导体衬底，在半导体衬底的正面上产生环形地包围接触区域的绝缘沟槽，填充绝缘沟槽 具有绝缘材料，通过在接触区域中沉积导电材料，在半导体衬底的正面上产生电接触结构，去除残留在半导体衬底背面接触区域中的半导体材料，以便产生 接触孔，其向开放接触结构的底侧开口，并且在接触孔中沉积金属材料，以将电接触结构电连接到半导体衬底的背面。

公开(公告)号：US20130189483A1

公开(公告)日：2013-07-25

申请号：US13744611

申请日：2013-01-18

申请人： Jochen REINMUTH ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Yvonne BERGMANN

IPC分类号： H05K13/00

CPC分类号： H05K13/00 ,  B81B2201/0264 ,  B81B2207/095 ,  B81C1/00301 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/4076 ,  H05K3/421 ,  H05K2201/068 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2924/00

摘要： A method is described for manufacturing a component having a through-connection. The method includes providing a substrate; forming a trench structure in the substrate, a substrate area which is completely surrounded by the trench structure being produced; forming a closing layer for closing off the trench structure, a cavity girded by the closing layer being formed in the area of the trench structure; removing substrate material from the substrate area surrounded by the closed-off trench structure; and at least partially filling the substrate area surrounded by the closed-off trench structure with a metallic material. A component having a through-connection is also described.

摘要翻译： 描述了用于制造具有贯通连接的部件的方法。 该方法包括提供基板; 在衬底中形成沟槽结构，被正被制造的沟槽结构完全包围的衬底区域; 形成用于封闭所述沟槽结构的封闭层，由所述封闭层围绕的腔体形成在所述沟槽结构的区域中; 从由封闭沟槽结构包围的衬底区域中去除衬底材料; 并且用金属材料至少部分地填充由封闭沟槽结构包围的衬底区域。 还描述了具有贯通连接的部件。

公开(公告)号：US20120133003A1

公开(公告)日：2012-05-31

申请号：US13298753

申请日：2011-11-17

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： H01L29/84

CPC分类号： B81C1/00246 ,  B81B2201/0235 ,  B81B2203/053 ,  B81C2203/0735 ,  B81C2203/0742 ,  G01P15/0802 ,  G01P15/125

摘要： A micromechanical component includes: a substrate having a multitude of trench structures which separate a first and a second mass element of the substrate from a web element of the substrate, in such a way that the first and second mass elements enclose the web element along an extension direction of the main surface of the substrate and are disposed to allow movement relative to the substrate in the direction of a surface normal of the main surface; a first electrode layer applied on the main surface of the substrate and forms a first electrode on the web element between the first and second mass elements; and a second electrode layer applied on the first and second mass elements and forming a self-supporting second electrode above the first electrode in the area of the web element, the first and second electrode forming a capacitance.

摘要翻译： 微机械部件包括：具有多个沟槽结构的衬底，其将衬底的第一和第二质量元件与衬底的腹板元件分开，使得第一和第二质量元件沿着 并且被设置为允许在主表面的法线方向上相对于基板的移动; 施加在所述基板的主表面上的第一电极层，并且在所述网状元件上在所述第一和第二质量元件之间形成第一电极; 以及施加在所述第一和第二质量元件上的第二电极层，并且在所述网状元件的区域中在所述第一电极的上方形成自支撑的第二电极，所述第一和第二电极形成电容。

公开(公告)号：US20100327883A1

公开(公告)日：2010-12-30

申请号：US12814160

申请日：2010-06-11

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： G01R27/26

CPC分类号： G01L9/0072

摘要： A measuring device has a sensor unit and an evaluation unit which is electrically isolated from the sensor unit by a partition wall. The sensor unit includes a first capacitive sensor which is electrically connected to a first coil to form a first oscillating circuit, and a reference capacitor which is electrically connected to a second coil to form a second oscillating circuit. The evaluation unit includes a third coil which is inductively coupled to the first coil and the second coil, and the evaluation unit is designed to determine and output a beat frequency of a beat signal which is inductively injected into the third coil by the first oscillating circuit and the second oscillating circuit.

摘要翻译： 测量装置具有传感器单元和评估单元，其通过分隔壁与传感器单元电隔离。 传感器单元包括电连接到第一线圈以形成第一振荡电路的第一电容传感器和电连接到第二线圈以形成第二振荡电路的参考电容器。 评估单元包括电感耦合到第一线圈和第二线圈的第三线圈，并且评估单元被设计为确定并输出由第一振荡电路感应注入到第三线圈中的差拍信号的拍频 和第二振荡电路。

公开(公告)号：US20130209672A1

公开(公告)日：2013-08-15

申请号：US13763223

申请日：2013-02-08

申请人： Jochen REINMUTH ,  Frank SCHNELL ,  Heribert WEBER ,  Erhard HIRTH ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Frank SCHNELL ,  Heribert WEBER ,  Erhard HIRTH ,  Yvonne BERGMANN

IPC分类号： H05K3/00

CPC分类号： H05K3/0094 ,  B81B2201/0235 ,  B81B2207/096 ,  B81C1/00301 ,  H01L21/743 ,  H01L21/76898 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2924/1461 ,  H05K3/4061 ,  H05K2201/09563 ,  H01L2924/00

摘要： A method for manufacturing a component having a through-connection. The method includes providing a semiconductor substrate, forming a recess in the semiconductor substrate, and introducing into the recess a pourable starting material which has a metal. The method furthermore includes carrying out a heating process, an electrically conductive structure forming the through-connection being developed from the pourable starting material.

摘要翻译： 一种用于制造具有通过连接的部件的方法。 该方法包括提供半导体衬底，在半导体衬底中形成凹陷，并将具有金属的可倾倒起始材料引入凹槽中。 该方法还包括进行加热过程，形成从可倾倒起始材料形成的贯通连接的导电结构。

公开(公告)号：US20120248931A1

公开(公告)日：2012-10-04

申请号：US13431613

申请日：2012-03-27

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： H02N1/00 ,  H02K15/00

CPC分类号： B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0264 ,  G01L9/0005 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0831 ,  Y10T29/49009

摘要： A micromechanical component is described having a substrate which has at least one stator electrode fixedly mounted with respect to the substrate, a movable mass having at least one actuator electrode fixedly mounted with respect to the movable mass, and at least one spring via which the movable mass is displaceable. The movable mass is structured from the substrate with the aid of at least one separating trench, at least one outer stator electrode spans at least one section of the at least one separating trench and/or of the movable mass, the at least one actuator electrode protrudes between the at least one outer stator electrode and the substrate, and at least one inner stator electrode protrudes between the at least one actuator electrode and the substrate. A related manufacturing method is also described for a micromechanical component.

摘要翻译： 描述了一种微机械部件，其具有相对于基板固定地安装有至少一个定子电极的基板，具有至少一个致动器电极相对于可移动质量块固定地安装的可移动质量块，以及至少一个弹簧， 质量是可移位的。 借助于至少一个分离沟槽，可移动质量体由衬底构成，至少一个外部定子电极跨越至少一个分离沟槽和/或可移动质量块的至少一个部分，至少一个致动器电极 突出在所述至少一个外部定子电极和所述基板之间，并且至少一个内部定子电极在所述至少一个致动器电极和所述基板之间突出。 还描述了用于微机械部件的相关制造方法。

公开(公告)号：US20120133002A1

公开(公告)日：2012-05-31

申请号：US13298571

申请日：2011-11-17

申请人： Jochen REINMUTH ,  Heiko Stahl

发明人： Jochen REINMUTH ,  Heiko Stahl

IPC分类号： H01L29/84 ,  H01L21/00

CPC分类号： B81C1/00571 ,  B81B2203/0118 ,  B81B2203/0136 ,  B81C2201/014

摘要： A method for producing microelectromechanical structures in a substrate includes: arranging at least one metal-plated layer on a main surface of the substrate in a structure pattern; leaving substrate webs open beneath a structure pattern region by introducing first trenches into the substrate perpendicular to a surface normal of the main surface in a region surrounding the structure pattern; coating the walls of the first trenches perpendicular to the surface normal of the main surface with a passivation layer; and introducing cavity structures into the substrate at the base of the first trenches in a region beneath the structure pattern region.

摘要翻译： 在基板中制造微机电结构的方法包括：以结构图案在基板的主表面上布置至少一个金属镀层; 通过在围绕结构图案的区域中垂直于主表面的表面法垂直地将第一沟槽引入到衬底中，使衬底腹板打开在结构图案区域下方; 用钝化层涂覆垂直于主表面的法线的第一沟槽的壁; 以及在结构图案区域下方的区域中在第一沟槽的基部处将空腔结构引入衬底。

公开(公告)号：US20120037412A1

公开(公告)日：2012-02-16

申请号：US13195470

申请日：2011-08-01

申请人： Jochen REINMUTH

发明人： Jochen REINMUTH

IPC分类号： H05K1/16 ,  H05K1/11 ,  H01K3/10

CPC分类号： H01L21/76898 ,  B81B3/0086 ,  B81B2201/0264 ,  B81B2207/096 ,  G01L9/0042 ,  G01L19/0076 ,  H01L21/7682 ,  H01L23/481 ,  H01L2924/0002 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method is described for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough. The method has the following operations of forming the electrical feedthrough so that it extends through the substrate from the front side to the back side of the substrate, forming a first closing layer on a front side of the substrate, forming an annular isolation trench in the substrate which encloses the electrical feedthrough, using an etching process starting from the back side of the substrate, the etching process terminating at the first closing layer, and closing off the annular isolation trench in the substrate by forming a second closing layer on the back side of the substrate.

摘要翻译： 描述了一种用于在基板中制造电馈通的方法，以及具有电馈通的基板。 该方法具有形成电馈通的以下操作，使得其从衬底的前侧延伸到后侧，在衬底的前侧形成第一闭合层，在衬底的前侧形成环形隔离沟槽 衬底，其包围电馈通，使用从衬底的背面开始的蚀刻工艺，蚀刻工艺终止于第一封闭层，并且通过在背面形成第二封闭层来封闭衬底中的环形隔离沟槽 的基底。

公开(公告)号：US20110169125A1

公开(公告)日：2011-07-14

申请号：US13004599

申请日：2011-01-11

申请人： Jochen REINMUTH ,  Barbara Will ,  Heribert Weber

发明人： Jochen REINMUTH ,  Barbara Will ,  Heribert Weber

IPC分类号： H01L29/06 ,  H01L21/60

CPC分类号： H01L21/3081 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/033 ,  B81C1/00404 ,  B81C1/00626 ,  H01L21/0334 ,  H01L21/76229

摘要： A method is described for creating at least one recess in a semiconductor component, in particular a micromechanical or electrical semiconductor component, having the following steps: applying at least one mask to the semiconductor component, forming at least one lattice having at least one or more lattice openings in the mask over the recess to be formed, the lattice opening or lattice openings being formed as a function of the etching rate and/or the dimensioning of the recess to be formed; forming the recess below the lattice.

摘要翻译： 描述了一种用于在半导体部件，特别是微机电或电半导体部件中形成至少一个凹部的方法，其具有以下步骤：将至少一个掩模施加到半导体部件，形成至少一个具有至少一个或多个 在要形成的凹部上的掩模中的格子孔，形成作为蚀刻速率和/或要形成的凹部的尺寸的函数的格子孔或格子孔; 在网格下面形成凹陷。