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    Localized soldering station using state changing medium
    11.
    发明授权
    Localized soldering station using state changing medium 失效
    使用状态转换介质的本地焊台

    公开(公告)号：US5102028A

    公开(公告)日：1992-04-07

    申请号：US725415

    申请日：1991-07-01

    申请人： Andrew Z. Glovatsky ,  Robert J. Lynch ,  James G. Motto, Jr. ,  Steve A. Repchak ,  Jean M. Vittone ,  Lawrence R. Yetter

    发明人： Andrew Z. Glovatsky ,  Robert J. Lynch ,  James G. Motto, Jr. ,  Steve A. Repchak ,  Jean M. Vittone ,  Lawrence R. Yetter

    IPC分类号： B23K1/00 ,  B23K1/015 ,  B23K1/018 ,  H05K13/04

    CPC分类号： H05K13/0465 ,  B23K1/0016 ,  B23K1/015 ,  B23K1/018 ,  B23K2201/42

    摘要： A localized soldering station is described that uses the vapor phase reflow principle. A container has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit maintains the vapor state while conveying the vapor to a work location where a module with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light. Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve through cooling fins where it changes back to a liquid and returns to the container, avoiding loss.

    摘要翻译： 描述了使用气相回流原理的局部焊接站。 容器具有选择的介质，因为其变化到蒸气的温度。 一个加热的导管保持蒸汽状态，同时将蒸气输送到一个工作位置，在那里一个模块具有要被去除或通过焊接连接附着的部件。 透明的石英喷嘴将蒸气限制在零件上及其焊接连接处，并通过包括引导灯的单元精确定位。 蒸汽将在与零件及其焊料连接接触时失去其蒸发潜热，导致焊料回流并返回到液体中，液体被收集以供再利用。 当处于待机状态或就绪状态时，蒸汽通过冷却片向上通过截止阀向上传送，在此处，蒸汽变回液体并返回容器，避免损失。

    LIGHTING SYSTEM FOR APPLIANCE
    12.
    发明申请
    LIGHTING SYSTEM FOR APPLIANCE 有权
    灯具照明系统

    公开(公告)号：US20120106129A1

    公开(公告)日：2012-05-03

    申请号：US12938546

    申请日：2010-11-03

    申请人： Andrew Z. Glovatsky ,  Christopher W. Gattis

    发明人： Andrew Z. Glovatsky ,  Christopher W. Gattis

    IPC分类号： F25D27/00

    CPC分类号： G02B6/0095 ,  F21V33/0044 ,  F21W2131/305 ,  F25D23/067 ,  F25D25/02 ,  F25D27/00 ,  F25D2400/40 ,  G02B6/0058 ,  G02B6/0068

    摘要： A lighting system for an appliance is disclosed. In one embodiment, the lighting system includes a light shelf including a substantially planar light guide having a support member for releaseably coupling the light shelf to the appliance, a light injector coupled to a first end the light shelf, the light injector including a substrate having at least one light source disposed thereon and a housing for at least partially enclosing the at least one light source, wherein light emitted from the at least one light source is directed into the light guide, and an end piece coupled to a second end of the light shelf opposite the first end.

    摘要翻译： 公开了一种用于器具的照明系统。 在一个实施例中，照明系统包括光架，其包括基本上平面的光导，其具有用于将灯架可释放地耦合到器具的支撑构件;耦合到第一端的灯架的光注射器，所述光注射器包括具有 设置在其上的至少一个光源和用于至少部分地包围所述至少一个光源的壳体，其中从所述至少一个光源发射的光被引导到所述光导中，以及端部件，其连接到所述至少一个光源的第二端 轻型货架与第一端相对。

    Microelectronic package within cylindrical housing
    14.
    发明授权
    Microelectronic package within cylindrical housing 失效
    圆柱形外壳内的微电子封装

    公开(公告)号：US07180736B2

    公开(公告)日：2007-02-20

    申请号：US10616528

    申请日：2003-07-10

    申请人： Andrew Z. Glovatsky ,  Vladimir Stoica

    发明人： Andrew Z. Glovatsky ,  Vladimir Stoica

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20163 ,  H05K7/1434

    摘要： A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. The housing is preferably formed of semi-cylindrical sections that are joined along axial edges. The housing includes one or more axial channels interposed between the outer wall and the inner wall for conveying coolant gas. In this manner, the housing provides more uniform thermal dissipati9on of heat generated by the microelectronic assemblies during operation, despite variations in the thickness between the cylindrical outer wall and the support surfaces, which are preferably planar.

    摘要翻译： 微电子封装包括微电子组件和具有圆柱形外壁的壳体。 微电子组件包括安装在基板上的电子部件，并且固定到壳体的内壁的支撑表面。 壳体优选地由沿着轴向边缘连接的半圆柱形部分形成。 壳体包括插入在外壁和内壁之间的用于输送冷却剂气体的一个或多个轴向通道。 以这种方式，尽管在圆柱形外壁和支撑表面之间的厚度的变化（其优选是平面的），壳体在操作期间提供了由微电子组件产生的热更均匀的热耗散。

    Electronically integrated vehicle structure
    15.
    发明授权
    Electronically integrated vehicle structure 有权
    电子集成车辆结构

    公开(公告)号：US07102888B2

    公开(公告)日：2006-09-05

    申请号：US10828396

    申请日：2004-04-20

    申请人： Andrew Z. Glovatsky ,  Jay D. Baker ,  Richard Keith McMillan ,  Myron Lemecha ,  Daniel Roger Vander Sluis

    发明人： Andrew Z. Glovatsky ,  Jay D. Baker ,  Richard Keith McMillan ,  Myron Lemecha ,  Daniel Roger Vander Sluis

    IPC分类号： H05K7/20 ,  B62D25/14

    CPC分类号： B60R16/0207

    摘要： An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

    摘要翻译： 集成车辆结构包括塑料支撑结构中的电子位置。 该电子站点具有安装在其上的电子部件的柔性基板。 塑料支撑结构限定了塑料安装表面，其包括从塑料支撑结构突出的多个细长肋。 每个肋具有形成塑料安装表面的一部分的侧边缘。 柔性基板安装到塑料安装表面，并且多个气流通道由柔性基板中的相邻肋限定。 也可以提供限定金属安装表面的方法支撑结构。 一个或多个电子侧可以附接到金属和塑料安装表面。

    Flatwire jumper patch
    17.
    发明授权
    Flatwire jumper patch 失效
    扁线跳线贴片

    公开(公告)号：US06753477B1

    公开(公告)日：2004-06-22

    申请号：US10426304

    申请日：2003-04-30

    申请人： Peter J. Sinkunas ,  Andrew Z. Glovatsky ,  Xu Song ,  Anne M. Sullivan ,  Yutaka Kawase

    发明人： Peter J. Sinkunas ,  Andrew Z. Glovatsky ,  Xu Song ,  Anne M. Sullivan ,  Yutaka Kawase

    IPC分类号： H01B708

    CPC分类号： H01R12/613 ,  H05K1/141 ,  H05K3/222 ,  H05K3/363 ,  H05K2201/10363

    摘要： A flatwire assembly includes a pair of elongate flatwire segments that are interconnected with a thin, flexible patch that overlies the opposed longitudinal ends of the segments. Conductive traces on the bottom face of the patch are electrically connected to the respective conductive traces of the segments by solder layers that, upon reflow under heat and pressure, respectively extend past an edge of the patch, whereupon visual confirmation of the solder joints between the traces of the patch and the segment is readily obtained. A layer of a thermally-activated or pressure-sensitive adhesive is disposed between the patch and each segment to further mechanically couple the patch to each segment during solder reflow. Longitudinal extensions of the patch substrate are bonded by the adhesive layer to respective portions of the segments farther removed from the segment ends than the solder layer extensions provide enhanced strain relief.

    摘要翻译： 扁线组件包括一对细长的扁平线段，其与覆盖在段的相对的纵向端部之间的薄的柔性补片相互连接。 贴片底面上的导电迹线通过焊料层电连接到片段的相应导电迹线，焊料层在热和压力下回流分别延伸经过贴片的边缘，于是可见地确认焊点 贴片和片段的痕迹容易获得。 在贴片和每个片段之间设置热激活或压敏粘合剂层，以在焊料回流期间进一步将贴片机械地耦合到每个片段。 贴片衬底的纵向延伸部分通过粘合剂层粘合到比段焊接层延伸更远部分的相应部分，而焊料层延伸部提供增强的应变消除。

    LED Interconnection Integrated Connector Holder Package
    20.
    发明申请
    LED Interconnection Integrated Connector Holder Package 有权
    LED互连集成连接器支架包装

    公开(公告)号：US20090023323A1

    公开(公告)日：2009-01-22

    申请号：US11778945

    申请日：2007-07-17

    申请人： Jeff C. Lin ,  Viren B. Merchant ,  Edwin Mitchell Sayers ,  Andrew Z. Glovatsky

    发明人： Jeff C. Lin ,  Viren B. Merchant ,  Edwin Mitchell Sayers ,  Andrew Z. Glovatsky

    IPC分类号： H01R13/625

    CPC分类号： F21V19/0015 ,  F21S41/141 ,  F21S41/192 ,  F21Y2115/10

    摘要： Disclosed is an LED package holder for retaining and electrically connecting an LED package. The LED package holder includes a housing configured to hold an LED package and has at least one center opening defined therein. A connector shroud is integrally formed with the housing and has a cavity for receiving a connector operable to supply power to the LED package. Two contact features are retained by the housing, and each contact feature has an inner contact and an outer contact. Each inner contact engages an LED electric terminal of the LED package. Each outer contact extends into the connector shroud so as to engage connector terminals when a connector is inserted into the connector shroud.

    摘要翻译： 公开了一种用于保持和电连接LED封装的LED封装架。 所述LED封装架包括构造成保持LED封装并具有限定在其中的至少一个中心开口的壳体。 连接器护罩与壳体整体形成，并且具有用于接收可操作以向LED封装供电的连接器的空腔。 两个接触特征由壳体保持，并且每个接触特征具有内接触件和外接触件。 每个内部接触件接合LED封装的LED电气端子。 每个外部接触件延伸到连接器护罩中，以便当连接器插入连接器护罩中时接合连接器端子。