公开(公告)号：US20090184407A1

公开(公告)日：2009-07-23

申请号：US12015754

申请日：2008-01-17

申请人： Charles L. Arvin ,  Benjamin V. Fasano ,  Mario J. Interrante ,  Glenn A. Pomerantz

发明人： Charles L. Arvin ,  Benjamin V. Fasano ,  Mario J. Interrante ,  Glenn A. Pomerantz

IPC分类号： H01L21/70 ,  H01L23/02

CPC分类号： H05K3/3436 ,  H01L21/56 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H05K3/225 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

摘要： Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate.

摘要翻译： 由此制造的方法和返工的中间和合成的电子模块，由此将需要返工的部件放置并从模块移除，以露出位于底部填充基质内的封装的焊料连接。 焊接连接和底部填充基体的高度减小，随后将焊料从焊料连接处蚀刻出来，以在底部填充基体内形成开口。 然后除去底部填充材料以暴露基底的冶金。 具有具有焊接连接阵列的释放层的坯料与暴露的冶金学对准，并且该焊料阵列从坯料转移到冶金上。 然后，使用热和压力将转移的焊接连接件平坦化，然后将新部件的焊接连接件连接到扁平焊接连接，并对位于新芯片和基板之间的这些返工焊接点进行底部填充。

公开(公告)号：US06280527B1

公开(公告)日：2001-08-28

申请号：US09096841

申请日：1998-06-12

申请人： Krishna G. Sachdev ,  John T. Butler ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  James N. Humenik ,  John U. Knickerbocker ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  David E. Speed ,  Candace A. Sullivan ,  Bruce E. Tripp ,  James C. Utter

发明人： Krishna G. Sachdev ,  John T. Butler ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  James N. Humenik ,  John U. Knickerbocker ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  David E. Speed ,  Candace A. Sullivan ,  Bruce E. Tripp ,  James C. Utter

IPC分类号： B08B308

CPC分类号： C23G1/14 ,  C11D7/06 ,  C11D7/3209 ,  C11D7/3218 ,  C11D11/0047 ,  C23G1/24 ,  G03F7/425 ,  H01L21/4864 ,  H05K1/092 ,  H05K3/1233 ,  H05K3/26 ,  H05K2203/0793 ,  H05K2203/122

摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.

摘要翻译： 本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。 本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。 更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法 陶瓷（MLC）基板。

公开(公告)号：US06351871B1

公开(公告)日：2002-03-05

申请号：US09335420

申请日：1999-06-17

申请人： Krishna G. Sachdev ,  John T. Butler ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  James N. Humenik ,  John U. Knickerbocker ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  David E. Speed ,  Candace A. Sullivan ,  Bruce E. Tripp ,  James C. Utter

发明人： Krishna G. Sachdev ,  John T. Butler ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  James N. Humenik ,  John U. Knickerbocker ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  David E. Speed ,  Candace A. Sullivan ,  Bruce E. Tripp ,  James C. Utter

IPC分类号： A47L2500

CPC分类号： C23G1/14 ,  C11D7/06 ,  C11D7/3209 ,  C11D7/3218 ,  C11D11/0047 ,  C23G1/24 ,  G03F7/425 ,  H01L21/4864 ,  H05K1/092 ,  H05K3/1233 ,  H05K3/26 ,  H05K2203/0793 ,  H05K2203/122

摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.

摘要翻译： 本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。 本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。 更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法 陶瓷（MLC）基板。

公开(公告)号：US07781232B2

公开(公告)日：2010-08-24

申请号：US12015754

申请日：2008-01-17

申请人： Charles L. Arvin ,  Benjamin V. Fasano ,  Mario J. Interrante ,  Glenn A. Pomerantz

发明人： Charles L. Arvin ,  Benjamin V. Fasano ,  Mario J. Interrante ,  Glenn A. Pomerantz

IPC分类号： H01L21/48 ,  H01L21/00

CPC分类号： H05K3/3436 ,  H01L21/56 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H05K3/225 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

摘要： Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate.

摘要翻译： 由此制造的方法和返工的中间和合成的电子模块，由此将需要返工的部件放置并从模块移除，以露出位于底部填充基质内的封装的焊料连接。 焊接连接和底部填充基体的高度减小，随后将焊料从焊料连接处蚀刻出来，以在底部填充基体内形成开口。 然后除去底部填充材料以暴露基底的冶金。 具有具有焊接连接阵列的释放层的坯料与暴露的冶金学对准，并且该焊料阵列从坯料转移到冶金上。 然后，使用热和压力将转移的焊接连接件平坦化，然后将新部件的焊接连接件连接到扁平焊接连接，并对位于新芯片和基板之间的这些返工焊接点进行底部填充。

公开(公告)号：US06742530B2

公开(公告)日：2004-06-01

申请号：US10294236

申请日：2002-11-14

申请人： Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

发明人： Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

IPC分类号： B08B308

CPC分类号： H01L21/02063 ,  B23K35/025 ,  C11D7/263 ,  C11D11/0047 ,  C11D11/007 ,  C23G5/032 ,  H05K3/1233 ,  H05K3/26 ,  Y10S134/902

摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.

摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。

公开(公告)号：US06532654B2

公开(公告)日：2003-03-18

申请号：US09759014

申请日：2001-01-12

申请人： Luc Gilbert Guerin ,  Mario J. Interrante ,  Mark Joseph LaPlante ,  David Clifford Long ,  Gregory Blair Martin ,  Thomas P. Moyer ,  Glenn A. Pomerantz ,  Thomas Weiss

发明人： Luc Gilbert Guerin ,  Mario J. Interrante ,  Mark Joseph LaPlante ,  David Clifford Long ,  Gregory Blair Martin ,  Thomas P. Moyer ,  Glenn A. Pomerantz ,  Thomas Weiss

IPC分类号： H01R4300

CPC分类号： H01R43/16 ,  H01R13/24 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222

摘要： A method of forming an electrical connector including providing a metallic sheet having a multitude of connector blanks formed therein, each of the connector blanks having a base portion, a contact portion and a singulation arm; forming each of the connector blanks into a connector having a predetermined shape wherein each of the connectors remain connected to the metallic sheet by their respective singulation arms and wherein the singulation arms are nonplanar with respect to the metallic sheet; joining the base of each of the connectors to a first substrate; and severing the singulation arms to separate each of the connectors from the metallic sheet wherein the base of each of the connectors is joined to the first substrate. In a preferred embodiment, the contact portion contacts a second substrate.

公开(公告)号：US5888308A

公开(公告)日：1999-03-30

申请号：US808926

申请日：1997-02-28

申请人： Krishna G. Sachdev ,  John U. Knickerbocker ,  Glenn A. Pomerantz ,  Bruce E. Tripp

发明人： Krishna G. Sachdev ,  John U. Knickerbocker ,  Glenn A. Pomerantz ,  Bruce E. Tripp

IPC分类号： B41F35/00 ,  B41N3/06 ,  C04B41/53 ,  C11D1/22 ,  C11D1/72 ,  C11D1/74 ,  C11D1/831 ,  C11D3/02 ,  C11D3/08 ,  C11D3/10 ,  C11D7/06 ,  C11D11/00 ,  H05K3/12 ,  H05K3/26 ,  B08B3/12 ,  C23G1/14

CPC分类号： C11D3/044 ,  B41N3/06 ,  C04B41/53 ,  C11D1/831 ,  C11D11/0041 ,  C11D3/08 ,  C11D3/10 ,  C11D1/22 ,  C11D1/72 ,  C11D1/74 ,  H05K3/1216 ,  H05K3/26

摘要： This invention relates to the use of water-based cleaning solutions and their use as environmentally safe replacements of chlorinated hydrocarbon solvents to remove metal-polymer composite paste residue from screening masks and ancillary equipment, such as, used for screening a conductive metal pattern on a ceramic green sheet in the manufacture of multi-layer ceramic products.

摘要翻译： 本发明涉及水性清洁溶液的使用及其作为氯化烃溶剂的环境安全替代物的用途，以从筛选掩模和辅助设备中除去金属 - 聚合物复合糊料残余物，例如用于筛选导电金属图案 陶瓷生片在多层陶瓷制品的制造中。

公开(公告)号：US5846361A

公开(公告)日：1998-12-08

申请号：US721570

申请日：1996-09-26

申请人： Benjamin Vito Fasano ,  Mark J. LaPlante ,  David Clifford Long ,  Keith Colin O'Neil ,  Brenda Lee Peterson ,  Glenn A. Pomerantz ,  Timothy Titus Popp

发明人： Benjamin Vito Fasano ,  Mark J. LaPlante ,  David Clifford Long ,  Keith Colin O'Neil ,  Brenda Lee Peterson ,  Glenn A. Pomerantz ,  Timothy Titus Popp

IPC分类号： B32B38/00 ,  B32B38/10 ,  H01L21/48 ,  H05K1/03 ,  H05K3/10 ,  H05K3/46 ,  B32B31/18 ,  B32B31/26

CPC分类号： B32B38/10 ,  H01L21/4857 ,  H05K3/4611 ,  H05K3/4629 ,  B32B2038/0092 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K1/0306 ,  H05K3/107 ,  Y10T156/1056 ,  Y10T156/1082

摘要： Forming a green multi-layer component with an embedded pattern of barrier material, which may be in the form of a positive pattern to form a recessed area or in the form of a negative pattern to form raised areas on the component. Peripheral channels are machined into the green laminate surface to outline each negative or positive pattern feature, the channels being cut deep and wide enough to contact and overlap the edges of the barrier material. The layer of barrier material and the overlying layer(s) of ceramic material are separated from the remainder of the component to produce a non-planar part having raised areas in the case of a negative pattern of barrier material or a part having recessed areas in the case of a positive pattern of barrier material. An apparatus and process to control the machining depth of cut using both AC and DC sensing techniques is disclosed. The non-planar component may be provided with recessed surface metallurgy, such as seal bands and filled via connections, which can survive planarization.

摘要翻译： 形成具有阻挡材料嵌入图案的绿色多层部件，其可以是正图案的形式以形成凹陷区域或呈负图案的形式，以在部件上形成凸起区域。 外围通道被加工到绿色层压体表面中以勾画出每个负的或正的图案特征，通道被切割得很深并且足够宽以与阻挡材料的边缘接触和重叠。 阻挡材料层和陶瓷材料的上覆层与部件的其余部分分离，以产生在阻挡材料的负图案的情况下具有凸起区域的非平面部分或具有凹陷区域的部分 情况为屏障材料的正面图案。 公开了使用AC和DC感测技术来控制切割加工深度的装置和工艺。 非平面部件可以设置有可以平坦化地存活的凹陷表面冶金，例如密封带和填充的通孔连接。

公开(公告)号：US5645673A

公开(公告)日：1997-07-08

申请号：US460307

申请日：1995-06-02

申请人： Benjamin Vito Fasano ,  Mark J. LaPlante ,  David Clifford Long ,  Keith Colin O'Neil ,  Brenda Lee Peterson ,  Glenn A. Pomerantz ,  Timothy Titus Popp

发明人： Benjamin Vito Fasano ,  Mark J. LaPlante ,  David Clifford Long ,  Keith Colin O'Neil ,  Brenda Lee Peterson ,  Glenn A. Pomerantz ,  Timothy Titus Popp

IPC分类号： B32B38/00 ,  B32B38/10 ,  H01L21/48 ,  H05K1/03 ,  H05K3/10 ,  H05K3/46 ,  B32B31/18 ,  B32B31/12

CPC分类号： B32B38/10 ,  H01L21/4857 ,  H05K3/4611 ,  H05K3/4629 ,  B32B2038/0092 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K1/0306 ,  H05K3/107 ,  Y10T156/1056 ,  Y10T156/1082

摘要： Forming a green multi-layer component with an embedded pattern of barrier material, which may be in the form of a positive pattern to form a recessed area or in the form of a negative pattern to form raised areas on the component. Peripheral channels are machined into the green laminate surface to outline each negative or positive pattern feature, the channels being cut deep and wide enough to contact and overlap the edges of the barrier material. The layer of barrier material and the overlying layer(s) of ceramic material are separated from the remainder of the component to produce a non-planar part having raised areas in the case of a negative pattern of barrier material or a part having recessed areas in the case of a positive pattern of barrier material. An apparatus and process to control the machining depth of cut using both AC and DC sensing techniques is disclosed. The non-planar component may be provided with recessed surface metallurgy, such as seal bands and filled via connections, which can survive planarization.

摘要翻译： 形成具有阻挡材料嵌入图案的绿色多层部件，其可以是正图案的形式以形成凹陷区域或呈负图案的形式，以在部件上形成凸起区域。 外围通道被加工到绿色层压体表面中以勾画出每个负的或正的图案特征，通道被切割得很深并且足够宽以与阻挡材料的边缘接触和重叠。 阻挡材料层和陶瓷材料的上覆层与部件的其余部分分离，以产生在阻挡材料的负图案的情况下具有凸起区域的非平面部分或具有凹陷区域的部分 情况为屏障材料的正面图案。 公开了使用AC和DC感测技术来控制切割加工深度的装置和工艺。 非平面部件可以设置有可以平坦化地存活的凹陷表面冶金，例如密封带和填充的通孔连接。

公开(公告)号：US06835260B2

公开(公告)日：2004-12-28

申请号：US10265516

申请日：2002-10-04

申请人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Glenn A. Pomerantz ,  Richard A. Shelleman

发明人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Glenn A. Pomerantz ,  Richard A. Shelleman

IPC分类号： B32B3118

CPC分类号： B32B18/00 ,  B32B38/0004 ,  B32B2310/0843 ,  C04B2237/32 ,  C04B2237/341 ,  C04B2237/52 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  H01L21/4807 ,  H01L21/481 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T156/1082

摘要： Methods to create raised pedestal parts in ceramic substrates sintered under a load. The invention uses a patterned, buried, non-sintering layer that provides the needed transfer of load during the sintering process to the raised or pedestal portion of the substrate while maintaining dimensional control of the metallized features on the surface of the pedestal base. The methods involve cutting channels in the ceramic substrate corresponding in position to the perimeter of the opening in the patterned non-sintering contact sheet. The channels may be cut either before or after the sintering of the ceramic substrates.