公开(公告)号：US20050249560A1

公开(公告)日：2005-11-10

申请号：US11118165

申请日：2005-04-28

申请人： Hwan Lee ,  Seo Pyun ,  Sang Lee ,  Byung Jin ,  Sang Lee ,  Tae Um ,  Yong Shim ,  Shin Kim

发明人： Hwan Lee ,  Seo Pyun ,  Sang Lee ,  Byung Jin ,  Sang Lee ,  Tae Um ,  Yong Shim ,  Shin Kim

IPC分类号： B23D61/00 ,  B23D61/04 ,  B28D1/12

CPC分类号： B23D61/04 ,  B28D1/121 ,  Y10T407/26

摘要： Disclosed is a diamond tool having a metal plate inserted therein. Between abrasive layers containing diamond particles is inserted a ferrous or non-ferrous metal plate having a wear resistance lower than that of the abrasive layers such that a concave groove is spontaneously formed during a cutting process, thereby reducing the contact load with a workpiece to thereby avoid vibration (wobbling) of a shank, and providing a discharge path for smoothly removing cutting chips and the cooling water. In addition, the content of abrasives and the wear resistance of bonding material are uniformly constituted so that the shrinkage rate does not need to be considered during sintering and the manufacturing process can be simplified, thereby reducing the manufacturing cost and improving the productivity therefor. Furthermore, the area of the metal plate can be controlled, thereby enabling an easy design conforming to the working conditions with a workpiece.

摘要翻译： 公开了一种金刚石工具，其中插入有金属板。 在含有金刚石颗粒的研磨层之间插入耐磨性低于研磨层的耐磨性的铁或非铁金属板，使得在切割过程中自发形成凹槽，从而减少与工件的接触载荷 避免柄的振动（摆动），并且提供用于平滑地去除切屑和冷却水的排出路径。 此外，研磨剂的含量和接合材料的耐磨性均匀地构成，使得在烧结期间不需要考虑收缩率，并且可以简化制造过程，从而降低制造成本并提高其生产率。 此外，可以控制金属板的面积，从而能够使与工件的工作条件相一致的简单设计。

公开(公告)号：US09239389B2

公开(公告)日：2016-01-19

申请号：US13616137

申请日：2012-09-14

申请人： Yeon Kyu Jeong ,  Shin Kim ,  Jeong Hun Kim ,  Jong Owan Kim ,  Sang Sik Yoon ,  Dong Hun Lee ,  Jea Yun So

发明人： Yeon Kyu Jeong ,  Shin Kim ,  Jeong Hun Kim ,  Jong Owan Kim ,  Sang Sik Yoon ,  Dong Hun Lee ,  Jea Yun So

IPC分类号： G02B17/08 ,  G01S17/00 ,  G05D1/02 ,  G01S17/88 ,  G01S17/93 ,  G01S7/481

CPC分类号： G01S17/00 ,  G01S7/4813 ,  G01S7/4814 ,  G01S7/4816 ,  G01S17/88 ,  G01S17/936 ,  G02B17/0808 ,  G05D1/0238 ,  G05D1/0248 ,  G05D2201/0203

摘要： An obstacle sensor includes a line light irradiating unit including a light-emitting unit, a light-emitting driving unit to drive the light-emitting unit, and a first conical mirror, an apex of which is disposed towards the light-emitting unit in a light irradiation direction of the light-emitting unit and which converts light emitted from the light-emitting unit into line light irradiated in all directions, and a reflected light receiving unit including a second conical mirror to condense light, that is irradiated from the first conical mirror and is then reflected from an obstacle, a lens, that is spaced from the apex of the second conical mirror by a predetermined distance and transmits the reflected light, an imaging unit to image the reflected light that passes through the lens, an image processing unit, and an obstacle sensing control unit.

摘要翻译： 障碍传感器包括：行光照射单元，包括发光单元，驱动发光单元的发光驱动单元;以及第一锥形反射镜，其顶点设置在发光单元中 发光单元的光照射方向，并将从发光单元发射的光转换为沿所有方向照射的线光;以及反射光接收单元，包括第二锥形镜以使光从第一锥形 然后从与第二锥形反射镜的顶点隔开预定距离的障碍物，透镜反射并透射反射光，成像单元对通过透镜的反射光进行成像，图像处理 单元和障碍物感测控制单元。

公开(公告)号：US20070150070A1

公开(公告)日：2007-06-28

申请号：US11317419

申请日：2005-12-22

申请人： Shin Kim ,  Moo Moon ,  Jae Ahn

发明人： Shin Kim ,  Moo Moon ,  Jae Ahn

IPC分类号： A61F2/78 ,  A61F2/28

CPC分类号： A61F2/2814 ,  A61F2/30749 ,  A61F2/60 ,  A61F2002/30143 ,  A61F2002/30225 ,  A61F2002/30367 ,  A61F2002/30377 ,  A61F2002/30433 ,  A61F2002/30443 ,  A61F2002/30474 ,  A61F2002/30785 ,  A61F2002/30789 ,  A61F2002/30794 ,  A61F2002/30795 ,  A61F2002/7887 ,  A61F2220/0025 ,  A61F2220/0033 ,  A61F2220/0041 ,  A61F2230/0017 ,  A61F2230/0069

摘要： Disclosed herein is an implant device for osseointegration to endure weight. This implant device includes an insert-type implant inserted into an amputated end of a thighbone or a lower leg bone of a leg of a patient; a load dispersing adaptor having a cap shape, encompassing both the implant and the amputated end of the leg simultaneously at a lower end of the implant; a load support plate having a plate shape, coupled with the lower surface of the adaptor, whose diameter is widened, on which a plurality of muscle fixing holes are dispersedly formed; and a coupling screw, which couples the load dispersing adaptor with the insert-type implant at a bottom of the load dispersing plate through screw-coupling.

摘要翻译： 本文公开了一种用于骨整合以承受体重的植入装置。 该植入装置包括插入患者腿部的大腿骨或小腿骨的截肢端的插入式植入物; 具有帽形状的负载分散适配器，同时在所述植入物的下端同时包围所述植入物和所述腿的截肢端; 具有平板形状的负载支撑板，其与直径扩大的适配器的下表面联接，多个肌肉固定孔分散在其上形成; 以及联接螺钉，其通过螺纹联接将负载分散适配器与插入式植入物连接在负载分散板的底部。

公开(公告)号：US20050198104A1

公开(公告)日：2005-09-08

申请号：US11044557

申请日：2005-01-27

申请人： Oh Kwon ,  Jae Hahm ,  Sang Kim ,  Jong Lee ,  Hyung Park ,  Kyung Park ,  Shin Kim ,  Kwang Koh

发明人： Oh Kwon ,  Jae Hahm ,  Sang Kim ,  Jong Lee ,  Hyung Park ,  Kyung Park ,  Shin Kim ,  Kwang Koh

IPC分类号： G06F15/163 ,  G06F15/16

CPC分类号： G06F9/5072

摘要： Disclosed is a file-based grid MPI job allocation system for a middleware-based grid computing system in which computers having a plurality of resources including an MPI program are distributed and connected to each other through a network, wherein the grid MPI job allocation system differentiates functions of a middleware and the MPI program, thereby achieving MPI initialization without intervention of a separate arbitration process. The job submission service module generates a file containing an address, a port number, etc. of each node, which are necessary for the MPI initialization, and sends the file to the job execution service module of the corresponding node. Each job execution service module executes the MPI job, and the MPI program waits for the generation of the file and then performs initialization by using the information in the file. The present invention clearly differentiates the jobs to be done by the MPI program and by the job submission service module in the middleware, thereby enabling the MPI program to be executed in the grid computing system regardless of the design of the middleware.

摘要翻译： 公开了一种用于基于中间件的网格计算系统的基于文件的网格MPI作业分配系统，其中包括MPI程序的多个资源的计算机通过网络分布并彼此连接，其中网格MPI作业分配系统区分 中间件和MPI程序的功能，从而实现MPI初始化，而不需要单独的仲裁过程。 作业提交服务模块生成包含MPI初始化所需的每个节点的地址，端口号等的文件，并将该文件发送到相应节点的作业执行服务模块。 每个作业执行服务模块执行MPI作业，并且MPI程序等待文件的生成，然后使用文件中的信息执行初始化。 本发明明确区分由MPI程序和作业提交服务模块在中间件中完成的作业，从而使得能够在网格计算系统中执行MPI程序，而不管中间件的设计如何。

公开(公告)号：US06876074B2

公开(公告)日：2005-04-05

申请号：US10201805

申请日：2002-07-23

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L23/14 ,  H01L23/02 ,  H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A Chip Scale Package (CSP) type unit package including a semiconductor chip and a double wiring substrate, the double wiring substrate including an adhesive and a flexible tape having an upper surface with a first wiring pattern, a lower surface with a second wiring pattern and a plurality of vias electrically connecting portions of the first and second wiring patterns. Additionally, the unit package may be stacked on a conventional base package or on another unit package, where stacked packages are electrically interconnected.

摘要翻译： 一种包括半导体芯片和双重布线基板的芯片级封装（CSP）型单元封装，所述双重布线基板包括粘合剂和具有第一布线图案的上表面的柔性带，具有第二布线图案的下表面和 电连接第一和第二布线图案的多个通孔。 另外，单元封装可以堆叠在传统的基底封装上或者堆叠的封装电互连的另一个单元封装上。

公开(公告)号：US06812578B2

公开(公告)日：2004-11-02

申请号：US10068628

申请日：2002-02-06

申请人： Shin Kim ,  Tae-Gyeong Chung ,  Nam-Seog Kim ,  Woo-Dong Lee ,  Jin-Hyuk Lee

发明人： Shin Kim ,  Tae-Gyeong Chung ,  Nam-Seog Kim ,  Woo-Dong Lee ,  Jin-Hyuk Lee

IPC分类号： H01L2348

CPC分类号： H01L24/05 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to various embodiments of the present invention, a bonding pad structure of a semiconductor device reduces damage caused by thermo-mechanical stress in beam lead bonding. A method of fabricating an improved bonding pad structure is also provided. A polysilicon film plate is preferably formed between a bonding pad metal layer and a dielectric layer. The polysilicon film plate absorbs external thermo-mechanical stress and improves the durability of the bonding pad in a bond pull test (BPT). The bonding between the bonding pad metal layer and the dielectric layer is also improved. Other features and advantages are also provided.

摘要翻译： 根据本发明的各种实施例，半导体器件的焊盘结构减少了光束引线接合中由热机械应力引起的损伤。 还提供了一种制造改进的焊盘结构的方法。 优选在接合焊盘金属层和电介质层之间形成多晶硅膜片。 多晶硅薄膜板吸收外部热机械应力，并提高粘合拉伸试验（BPT）中的焊盘的耐久性。 接合焊盘金属层与电介质层之间的接合也得到改善。 还提供了其他特点和优点。

公开(公告)号：US06432746B1

公开(公告)日：2002-08-13

申请号：US09840725

申请日：2001-04-23

申请人： Shin Kim ,  Hee-Guk Choi ,  Se Ill Kim ,  Se Yong Oh

发明人： Shin Kim ,  Hee-Guk Choi ,  Se Ill Kim ,  Se Yong Oh

IPC分类号： H01L2144

摘要： A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

公开(公告)号：US20130001616A1

公开(公告)日：2013-01-03

申请号：US13361612

申请日：2012-01-30

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L33/36 ,  H01L33/58 ,  H01L33/50

CPC分类号： H01L33/44 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a light emitting device including a light emitting structure comprising a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer, a first electrode disposed on the first conductive type semiconductor layer, a second electrode disposed on the second conductivity type semiconductor layer, and a low temperature oxide film disposed on the light emitting structure, with an irregular thickness.

摘要翻译： 公开了一种发光器件，其包括发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层，设置在第一导电类型半导体层上的第一电极，设置在第二导电类型半导体层上的第二电极 型半导体层和设置在发光结构上的低温氧化膜，具有不规则的厚度。

公开(公告)号：US07880289B2

公开(公告)日：2011-02-01

申请号：US11752770

申请日：2007-05-23

申请人： Shin Kim

发明人： Shin Kim

IPC分类号： H01L23/48 ,  H01L21/30 ,  H01L21/58

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/105 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/16105 ,  H01L2224/16157 ,  H01L2224/274 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83 ,  H01L2225/1005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H05K1/183 ,  H05K1/184 ,  H05K2201/09845 ,  H05K2201/10477 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00014

摘要： Provided are a semiconductor package having connection terminals whose side surfaces are exposed and a semiconductor module including such a semiconductor package. Also provided are methods of fabricating the semiconductor package and semiconductor module. According to an embodiment of the present invention, a semiconductor package includes a semiconductor chip including a semiconductor wafer having first and second opposite surfaces and a plurality of conductive pads arranged in a row on the first surface along the edges of the semiconductor wafer such that a side surface of each conductive pad is exposed. An insulating layer is formed on the first surface of the semiconductor wafer and includes openings for exposing parts of the conductive pads. A plurality of connection terminals are respectively arranged on the conductive pads exposed through the openings and a reinforcing member is arranged on the insulating layer to cover a portion of each connection terminal.

摘要翻译： 提供了具有侧表面露出的连接端子和包括这种半导体封装的半导体模块的半导体封装。 还提供了制造半导体封装和半导体模块的方法。 根据本发明的实施例，半导体封装包括半导体芯片，其包括具有第一和第二相对表面的半导体晶片和沿着半导体晶片的边缘在第一表面上排成一行的多个导电焊盘，使得 每个导电焊盘的侧面露出。 绝缘层形成在半导体晶片的第一表面上，并且包括用于暴露导电焊盘部分的开口。 多个连接端子分别布置在通过开口暴露的导电焊盘上，并且在绝缘层上布置加强构件以覆盖每个连接端子的一部分。

公开(公告)号：US20100043301A1

公开(公告)日：2010-02-25

申请号：US12461806

申请日：2009-08-26

申请人： Sang-Ok Yoon ,  Kwan-Soo Kim ,  Shin Kim ,  Yun-Han Kim

发明人： Sang-Ok Yoon ,  Kwan-Soo Kim ,  Shin Kim ,  Yun-Han Kim

IPC分类号： C09K3/14

CPC分类号： C10M173/02 ,  C10M2201/041 ,  C10M2201/103 ,  C10M2201/12 ,  C10M2209/04 ,  C10M2209/12 ,  C10N2240/401

摘要： A water-based cutting fluid includes a water-soluble polymer dissolved in water and ceramic powder dispersed in the water. The cutting fluid further includes water glass. Further, the water-soluble polymer is one selected from a group consisting of polyvinyl alcohol (PVA), cellulose, methyl cellulose, carboxymethyl cellulose (CMC), starch, or a combination thereof.

摘要翻译： 水性切削液包括溶于水的水溶性聚合物和分散在水中的陶瓷粉末。 切削液还包括水玻璃。 此外，水溶性聚合物是选自聚乙烯醇（PVA），纤维素，甲基纤维素，羧甲基纤维素（CMC），淀粉或其组合中的一种。