Abstract:
This invention concerns a method for epitaxial growth by the use of a so-called heterogeneous reaction and includes disposing a source material in a first area of a horizontal chamber, disposing a growth substrate in a second area thereof, heating the first area thereby keeping the source material at a first temperature, heating the second area thereby keeping the growth substrate at a second temperature, lower than the first temperature, introducing a reaction gas into the chamber thereby causing the reaction gas to react with the source material and depositing the resultant reaction product on the growth substrate and consequently obtaining formation of a film by epitaxial growth.
Abstract:
An apparatus, for forming a film according to an automated continuous CVD (Chemical Vapor Deposition) method includes a wafer holder having a plurality of separate, detachable susceptors, a rotary shaft for rotating the wafer holder to rotate wafer mounting surfaces of the susceptors in one plane, a gas distributor spaced from the wafer holder and facing the moving surface of the wafer mounting surface to discharge a reaction gas onto the wafer mounting surfaces, and a heating instrument spaced from the wafer holder and facing the moving surface of the opposite side of the wafer mounting surfaces, in order to keep the wafer at a stable temperature during forming a film and to allow maintenance and repair to be easily and efficiently performed.
Abstract:
This invention relates to film-forming apparatus for forming an insulating film, for example, by the CVD method using an activated reaction gas. It is aimed at simplifying the apparatus, ensuring high film quality, enhancing the efficiency of formation of a plasma, and improving the uniformity of thickness of the produced film. The film-forming apparatus includes a plasma generator and a first gas discharger for discharging a first reaction gas into the plasma generator and a second gas discharger for discharging a second reaction gas onto a substrate. The second gas discharger includes a plurality of gas discharge pipes, in each of which a plurality of gas discharge holes are formed, whereby the second reaction gas is discharged from the gas discharge holes into contact with the activated first reaction gas and is itself activated so that a film is formed on the substrate through reaction of first and second reaction gases.
Abstract:
A semiconductor fabrication apparatus for forming a film on a wafer by a CVD method provides for easy removal of the dust generated in a film-forming chamber without reducing the uptime/downtime ratio of the equipment. The apparatus includes one or more gas dispersing devices having gas releasing surfaces for releasing a reaction gas to form a film on a wafer; one or more wafer holders having wafer mounting surfaces opposed to the plane defined by the gas releasing surface; and one or more cleaners, each having a suction port and a brush connected to the suction port, provided opposing the gas releasing surface. Either the cleaner or the gas dispersing device is moved so that the brush contacts and traverses the gas releasing surface.
Abstract:
An idling device is able to bring into an idling condition a lever hoist including a change gear provided on driving member threadedly engaged on a driving shaft for driving a sheave for winding-up a chain or rope for a load, an operating lever rockably driven by a hand, winding-up and winding-off driving pawls engageable with teeth of the change gear and changeable in response to the purpose of hoisting or lowering the load, and a braking assembly for preventing the change gear from being driven by a gravity of the load and adapted to be clamped and released by rotative movement of the driving member relative to said driving shaft. According to the invention the idling device comprises a stopper fixed to the driving shaft and a manually operatable knob fitted on and rotatably and axially slidably relative to the driving shaft between the stopper and the driving member and provided with engagement protrusions adapted to be engaged in recesses formed in the driving member. The knob is formed with stopper protrusions integrally on a bottom of its cavity for receiving the stopper. The stopper is formed with recesses for receiving the stopper protrusions in the idling condition and is further formed with engagement surfaces in opposition to the stopper protrusions of the knob for preventing excess release of the braking assembly.
Abstract:
A smoking tobacco product, which is produced by incorporating in smoking material a thermo-gelable .beta.-1,3-glucan-type polysaccharide, either as the sole smoking material or as its partial replacement, has improved smoking characteristics such as flavor, taste and irritability, and its smoking material has improved physical properties such as thickness, wet-proof qualities, tensile strength, elongation and filling capacity.
Abstract:
There is provided an air-conditioning system in which at least one or some of a plurality of air-conditioning apparatuses are each controllable such that the indoor temperature is maintained between two set temperatures. All the plurality of air-conditioning apparatuses are switched to either one of heating operation and cooling operation on the basis of a temperature difference between the indoor temperature related to an air-conditioning apparatus that is in the first operation mode and a set target temperature and a temperature difference between the indoor temperature related to an air-conditioning apparatuses that is in the second operation mode and an upper temperature limit or a lower temperature limit.
Abstract:
A cubic boron nitride radius end mill includes a sintered cubic boron nitride compact bonded to an end of a main body, and a cutting edge provided on the sintered cubic boron nitride compact. The wedge angle θt of the cutting edge is constant over the entire region of the cutting edge. A negative rake face is disposed on a face so as to extend over the entire region of the cutting edge, and the rake angle θn of the negative rake face satisfies the relationship −30°≦θn≦−50°. A joint cutting edge is disposed between an end cutting edge and a radius cutting edge in the cutting edge, the joint cutting edge having a concave angle γ0 which is smaller than the concave angle γ1 of the end cutting edge and which satisfies the relationship 0.5°≦γ0 ≦2°.
Abstract:
A film-forming surface reforming method includes the steps of bringing a gas or an aqueous solution containing ammonia, hydrazine, an amine, an amino compound or a derivative thereof into contact with the film-forming surface before an insulating film is formed on the film-forming surface, and bringing a gas or an aqueous solution containing Hydrogen peroxide, ozone, Oxygen, nitric acid, sulfuric acid or a derivative thereof into contact with the film-forming surface.
Abstract:
A method for forming an interlayer insulating film includes the steps of forming an underlying insulating film on a substrate; forming a film containing B (boron), C (carbon) and H2O) on the underlying insulating film by plasma enhanced chemical vapor deposition using a source gas containing an Si—C—O—H compound, an oxidative gas and a compound containing B (boron); releasing C (carbon) and H2O in the film from the film by annealing the film, and thereby forming a porous SiO2 film containing B (boron); and subjecting to the porous SiO2 film containing B (boron) to H (hydrogen) plasma treatment, and then forming a cover insulating film.