公开(公告)号：US08487304B2

公开(公告)日：2013-07-16

申请号：US12771697

申请日：2010-04-30

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H01L23/58 ,  H01L23/48 ,  H01L23/52

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

公开(公告)号：US20110266539A1

公开(公告)日：2011-11-03

申请号：US12771697

申请日：2010-04-30

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H01L23/544 ,  H01L23/58

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

公开(公告)号：US09335346B2

公开(公告)日：2016-05-10

申请号：US13608706

申请日：2012-09-10

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  G01R1/067

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

公开(公告)号：US20130190742A1

公开(公告)日：2013-07-25

申请号：US13640588

申请日：2011-04-12

申请人： Daniel Patrick Connors ,  Jerome Felsenstein ,  Robert E. Trzcinski ,  James J. Wynne ,  Donna S. Zupanski-Nielsen

发明人： Daniel Patrick Connors ,  Jerome Felsenstein ,  Robert E. Trzcinski ,  James J. Wynne ,  Donna S. Zupanski-Nielsen

IPC分类号： A61B18/20

CPC分类号： A61B18/20 ,  A61B2018/207

摘要： Disclosed is an improved system and method for efficiently removing tissue using laser ablation. A first laser emits a first laser beam with a variable first integrated fluence sufficient to ablate tissue. The first laser beam is movably positioned over one or more surfaces of the tissue and the first integrated fluence varies over different levels with position, so different thicknesses of tissue are ablated at different surface positions in order to modify the contour of the surface of the tissue. Modifications include tissue smoothing, removing, feathering, sharpening, and roughening. In one preferred embodiment the tissue is eschar that is removed, unveiling viable tissue. In alternate preferred embodiments, one or more additional lasers beams with different wavelengths, with integrated fluence sufficient to ablate tissue, are moved over the surface of the tissue until a second ablation reaches a second self-termination point, e.g., determined by affects of chemicals below the termination point that absorb the second laser beam without producing the temperature increase necessary for ablation to continue.

摘要翻译： 公开了一种使用激光烧蚀有效去除组织的改进的系统和方法。 第一激光器发射具有足以消融组织的可变的第一积分能量密度的第一激光束。 第一激光束可移动地定位在组织的一个或多个表面上，并且第一集成能量密度在具有位置的不同水平上变化，因此不同厚度的组织在不同的表面位置被消融，以便修改组织表面的轮廓 。 修改包括组织平滑，去除，羽化，磨锐和粗糙化。 在一个优选实施方案中，组织是被除去的焦痂，揭开活组织。 在替代优选实施例中，具有足以消融组织的积分能量密度的具有不同波长的一个或多个附加激光束在组织的表面上移动，直到第二消融达到第二自终止点，例如由化学物质的影响确定 低于吸收第二激光束的终止点，而不产生消融所需的温度升高。

公开(公告)号：US20120329295A1

公开(公告)日：2012-12-27

申请号：US13608706

申请日：2012-09-10

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H05K1/02

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

公开(公告)号：US07863183B2

公开(公告)日：2011-01-04

申请号：US11306983

申请日：2006-01-18

申请人： Timothy H. Daubenspeck ,  William F. Landers ,  Donna S. Zupanski-Nielsen

发明人： Timothy H. Daubenspeck ,  William F. Landers ,  Donna S. Zupanski-Nielsen

IPC分类号： H01L21/4763

CPC分类号： H01L21/288 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05575 ,  H01L2224/05599 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/01015

摘要： The present invention relates to a method for fabricating a semiconductor device with a last level copper-to-C4 connection that is essentially free of aluminum. Specifically, the last level copper-to-C4 connection comprises an interfacial cap structure containing CoWP, NiMoP, NiMoB, NiReP, NiWP, and combinations thereof. Preferably, the interfacial cap structure comprises at least one CoWP layer. Such a CoWP layer can be readily formed over a last level copper interconnect by a selective electroless plating process.

摘要翻译： 本发明涉及一种用于制造具有基本上不含铝的最后一级铜对C4连接的半导体器件的方法。 具体地说，最后一级的铜对C4连接包括含有CoWP，NiMoP，NiMoB，NiReP，NiWP及其组合的界面盖结构。 优选地，界面帽结构包括至少一个CoWP层。 这种CoWP层可以通过选择性无电镀方法容易地在最后一级铜互连上形成。

公开(公告)号：US20130269780A1

公开(公告)日：2013-10-17

申请号：US13995269

申请日：2011-12-20

申请人： Pierre-Philippe Grand ,  Jesus Salvadoe Jaime Ferrer ,  Emmanuel Roche ,  Hariklia Deligianni ,  Raman Vaidyanathan ,  Kathleen B. Reuter ,  Qiang Huang ,  Lubomyr Romankiw ,  Maurice Mason ,  Donna S. Zupanski-Nielsen

发明人： Pierre-Philippe Grand ,  Jesus Salvadoe Jaime Ferrer ,  Emmanuel Roche ,  Hariklia Deligianni ,  Raman Vaidyanathan ,  Kathleen B. Reuter ,  Qiang Huang ,  Lubomyr Romankiw ,  Maurice Mason ,  Donna S. Zupanski-Nielsen

IPC分类号： H01L31/18 ,  H01L31/032

CPC分类号： H01L31/18 ,  H01L21/02422 ,  H01L21/02491 ,  H01L21/02568 ,  H01L21/02614 ,  H01L31/0322 ,  Y02E10/541

摘要： The present invention relates to a method for fabricating a thin layer made of a alloy and having photovoltaic properties. The method according to the invention comprises first steps of: a) depositing an adaptation layer (MO) on a substrate (SUB), b) depositing at least one layer (SEED) comprising at least elements I and/or III, on said adaptation layer. The adaptation layer is deposited under near vacuum conditions and step b) comprises a first operation of depositing a first layer of I and/or III elements, under same conditions as the deposition of the adaptation layer, without exposing to air the adaptation layer.

摘要翻译： 本发明涉及一种由合金制成并具有光伏特性的薄层制造方法。 根据本发明的方法包括第一步骤：a）在衬底（SUB）上沉积适应层（MO）; b）在所述适配层上沉积包含至少元件I和/或III的至少一层（SEED） 层。 适应层沉积在接近真空条件下，步骤b）包括在与适应层的沉积相同的条件下沉积I和/或III元素的第一层的第一操作，而不暴露于空气中的适配层。

公开(公告)号：US20080029898A1

公开(公告)日：2008-02-07

申请号：US11461511

申请日：2006-08-01

申请人： Mukta G. Farooq ,  Robert Hannon ,  Dae Young Jung ,  Ian D. Melville ,  Donna S. Zupanski-Nielsen

发明人： Mukta G. Farooq ,  Robert Hannon ,  Dae Young Jung ,  Ian D. Melville ,  Donna S. Zupanski-Nielsen

IPC分类号： H01L23/48

CPC分类号： H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

摘要： Via stack structures are disclosed. In one embodiment, a structure includes a via stack including: a first substantially cross-shaped line in a first dielectric layer; a second substantially cross-shaped line set in a second dielectric layer, and a via stud coupling the first substantially cross-shaped line to the second substantially cross-shaped line. In another embodiment, a structure includes a first via stack, and a second via stack, wherein the first via stack and the second via stack extend in a divergent manner from one another. Each via stack structure is useful for support, for example, in under wire bond applications. The via stack structures can be mixed with other via stack structures and selectively placed within a layout to replace conventional metal plate and via stud array configurations.

摘要翻译： 公开了通过堆叠结构。 在一个实施例中，结构包括通孔堆叠，其包括：第一介电层中的第一基本十字形的线; 设置在第二电介质层中的第二基本上十字形的线，以及将第一基本上十字形的线耦合到第二基本十字形线的通孔柱。 在另一个实施例中，结构包括第一通孔堆叠和第二通孔堆叠，其中第一通孔堆叠和第二通孔堆叠以彼此发散的方式延伸。 每个通孔堆叠结构可用于支持，例如在引线键合应用中。 通孔堆叠结构可以与其它通孔堆叠结构混合并且选择性地放置在布局内以代替传统的金属板和经由螺柱阵列配置。

公开(公告)号：US07312529B2

公开(公告)日：2007-12-25

申请号：US11160669

申请日：2005-07-05

申请人： Lawrence Clevenger ,  Mukta G. Farooq ,  Louis L. Hsu ,  William F. Landers ,  Donna S. Zupanski-Nielsen ,  Carl J. Radens ,  Chih-Chao Yang

发明人： Lawrence Clevenger ,  Mukta G. Farooq ,  Louis L. Hsu ,  William F. Landers ,  Donna S. Zupanski-Nielsen ,  Carl J. Radens ,  Chih-Chao Yang

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/40

CPC分类号： H05K3/3436 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/49109 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K2201/094 ,  H05K2201/09736 ,  H05K2201/09845 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.

摘要翻译： 一种电结构和方法，包括电和机械地连接到第二衬底的第一衬底。 第一基板包括第一导电焊盘和第二导电焊盘。 第二基板包括第三导电焊盘，第四导电焊盘和第一导电部件。 第四导电焊盘包括与第一导电构件的高度不同的高度。 导电构件电连接和机械地连接到第四导电垫。 第一焊球将第一导电焊盘连接到第三导电焊盘。 第一焊球包括第一直径。 第二焊球将第二导电焊盘连接到第一导电构件。 第二焊球包括第二直径。 第一直径大于所述第二直径。