公开(公告)号：US20140159324A1

公开(公告)日：2014-06-12

申请号：US13710442

申请日：2012-12-10

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: B23Q3/15 ,  H02N13/00

CPC classification number: H02N13/00 ,  B81C99/002 ,  Y10T279/23

Abstract: Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads.

Abstract translation: 描述了合适的单极和双极微器件转移头阵列和从SOI衬底形成的方法。 在一个实施例中，柔性传送头阵列形成在基底基板上并且可朝向基底基板偏转，并且图案化金属层包括金属互连层，金属互连层与柔性传送头阵列中的金属电极阵列电连接。

公开(公告)号：US08716767B2

公开(公告)日：2014-05-06

申请号：US14063963

申请日：2013-10-25

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L29/76 ,  H01L21/266 ,  H01L29/06 ,  H01L21/02 ,  H01L21/329 ,  H01L21/331 ,  H01L21/336 ,  H01L29/66 ,  H01L29/78 ,  H01L29/872 ,  H01L29/40

CPC classification number: H01L21/6833 ,  B32B38/18 ,  B81C99/002 ,  H01L21/266 ,  H01L21/3083 ,  H01L21/76264 ,  H01L24/75 ,  H01L29/06 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66143 ,  H01L29/66348 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725 ,  H01L2224/7598 ,  H01L2924/1461 ,  H02N13/00 ,  Y10T156/17

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

Abstract translation: 描述了一种兼容的双极微器件传输头阵列和从SOI衬底形成兼容的双极微器件传输阵列的方法。 在一个实施例中，柔性双极微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括第一和第二硅互连以及与第一和第二硅互连电连接并可偏转到基底基板和硅电极之间的一个或多个空腔中的第一和第二硅电极阵列。

公开(公告)号：US20140008813A1

公开(公告)日：2014-01-09

申请号：US13828117

申请日：2013-03-14

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L23/538

CPC classification number: B32B38/18 ,  B81C99/002 ,  H01L21/6835 ,  H01L23/5384 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  Y10T156/17 ,  H01L2924/00

Abstract: A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了一种兼容的单极微器件传输头阵列和从SOI衬底形成兼容单极微器件传输阵列的方法。 在一个实施例中，微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括在硅互连上方突出的台面结构，并且每个硅电极可偏转到基底基板和硅电极之间的空腔中。 介电层覆盖每个台面结构的顶面。

公开(公告)号：US09406541B2

公开(公告)日：2016-08-02

申请号：US14957331

申请日：2015-12-02

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L29/76 ,  H01L21/683 ,  H02N13/00

CPC classification number: H01L21/6833 ,  B32B38/18 ,  B81C99/002 ,  H01L21/266 ,  H01L21/3083 ,  H01L21/76264 ,  H01L24/75 ,  H01L29/06 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66143 ,  H01L29/66348 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725 ,  H01L2224/7598 ,  H01L2924/1461 ,  H02N13/00 ,  Y10T156/17

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

公开(公告)号：US20160196998A1

公开(公告)日：2016-07-07

申请号：US15052767

申请日：2016-02-24

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L2221/68368 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/03 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09036

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

公开(公告)号：US20160176045A1

公开(公告)日：2016-06-23

申请号：US15054977

申请日：2016-02-26

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl ,  Paul Argus Parks ,  Stephen Paul Bathurst

IPC: B25J9/10 ,  B25J15/00 ,  H01L23/00 ,  H01L21/677 ,  H01L21/68 ,  B25J7/00 ,  H01L21/683

CPC classification number: B25J9/1015 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0052 ,  B25J15/0085 ,  B25J17/0208 ,  H01L21/67144 ,  H01L21/67721 ,  H01L21/68 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75282 ,  H01L2224/7565 ,  H01L2224/75723 ,  H01L2224/75725 ,  H01L2224/75823 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。

公开(公告)号：US20150364424A1

公开(公告)日：2015-12-17

申请号：US14307325

申请日：2014-06-17

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl ,  Jeffrey Birkmeyer

IPC: H01L23/538 ,  H01L21/768

CPC classification number: H01L23/5384 ,  B81C99/002 ,  H01L21/76898 ,  H01L24/75 ,  H01L24/95

Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.

Abstract translation: 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中，顺应性静电转印头包括基底衬底中的空腔，在基底衬底上的弹簧支撑层，以及弹簧支撑层上的图案化器件层。 弹簧支撑层包括弹簧支撑层梁轮廓，该弹性支撑层梁型材向空腔延伸并且可偏转，并且图案化的装置层包括由弹簧支撑层梁轮廓支撑并且朝向腔体可偏转的电极梁轮廓 。

公开(公告)号：US20150340262A1

公开(公告)日：2015-11-26

申请号：US14814307

申请日：2015-07-30

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  B81C99/002 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L24/75 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的微拾取阵列。 在一个实施例中，微拾取阵列包括用于将工作电压从电压源传送到静电转印头阵列的柔性接触件。 在一个实施例中，柔性接触件可相对于微拾取阵列的基底基板移动。

公开(公告)号：US09136161B2

公开(公告)日：2015-09-15

申请号：US13909892

申请日：2013-06-04

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/768 ,  B81C99/00

CPC classification number: H01L21/6833 ,  B81C99/002 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L24/75 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的微拾取阵列。 在一个实施例中，微拾取阵列包括用于将工作电压从电压源传送到静电转印头阵列的柔性接触件。 在一个实施例中，柔性接触件可相对于微拾取阵列的基底基板移动。

公开(公告)号：US20140299572A1

公开(公告)日：2014-10-09

申请号：US14312551

申请日：2014-06-23

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: B81C1/00

CPC classification number: B81C1/0015 ,  B81B2203/0118 ,  B81C99/002 ,  H01L33/0095

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm.