公开(公告)号：US20230230805A1

公开(公告)日：2023-07-20

申请号：US18009978

申请日：2021-10-15

Applicant: Lam Research Corporation

Inventor： John Stephen Drewery ,  Ying Wu ,  Alexander Miller Paterson ,  Luc Albarede

IPC: H01J37/32

CPC classification number: H01J37/32174 ,  H01J37/32146

Abstract: Systems and methods for synchronization of radio frequency (RF) pulsing schemes and of sensor data collection are described. One of the methods includes receiving, by an RF generator, a first set of one or more variable levels and one or more duty cycles of an RF signal. The method further includes receiving, by the RF generator from a pulse controller, a synchronization signal having a plurality of pulses. The method also includes generating, during a clock cycle of a clock signal, multiple instances of a first plurality of states of the RF signal in synchronization with the plurality of pulses of the synchronization signal. Each of the first plurality of states of the RF signal has a corresponding one of the one or more variable levels of the first set and a corresponding one of the one or more duty cycles of the first set.

公开(公告)号：US10903050B2

公开(公告)日：2021-01-26

申请号：US16214861

申请日：2018-12-10

Applicant: Lam Research Corporation

Inventor： Luc Albarede ,  Yassine Kabouzi

IPC: H01J37/32 ,  H01L21/66 ,  H01L21/67

Abstract: A substrate processing system includes model generation and setpoint modules. The model generation module receives a first time trace based on an output of an endpoint sensor and obtains a target setpoint. A portion of the first time trace is indicative of an endpoint at which a feature has been created in a first substrate. The target setpoint is generated based on a metrology process and is used to compensate for erosion of a first edge ring. The model generation module generates a conversion model based on the portion and the target setpoint. The setpoint module: based on the output, receives a second time trace that is generated subsequent to generation of the first time trace; and based on the conversion model, converts the second time trace to a predicted erosion compensation setpoint, which is set while processing a second substrate using the first or a second edge ring.

公开(公告)号：US20150091441A1

公开(公告)日：2015-04-02

申请号：US14043574

申请日：2013-10-01

Applicant: Lam Research Corporation

Inventor： Alexei Marakhtanov ,  Rajinder Dhindsa ,  Ken Lucchesi ,  Luc Albarede

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32174 ,  H01J37/32449 ,  H01J37/32532 ,  H01J2237/3323 ,  H01J2237/3344

Abstract: A plasma system includes an RF generator and a matchbox including an impedance matching circuit, which is coupled to the RF generator via an RF cable. The plasma system includes a chuck and a plasma reactor coupled to the matchbox via an RF line. The RF line forms a portion of an RF supply path, which extends between the RF generator through the matchbox, and to the chuck. The plasma system further includes a phase adjusting circuit coupled to the RF supply path between the impedance matching circuit and the chuck. The phase adjusting circuit has an end coupled to the RF supply path and another end that is grounded. The plasma system includes a controller coupled to the phase adjusting circuit. The controller is used for changing a parameter of the phase adjusting circuit to control an impedance of the RF supply path based on a tune recipe.

Abstract translation: 等离子体系统包括RF发生器和包括阻抗匹配电路的火柴盒，其通过RF电缆耦合到RF发生器。 等离子体系统包括通过RF线耦合到火柴盒的卡盘和等离子体反应器。 RF线形成RF供应路径的一部分，RF供应路径在RF发生器之间通过火柴盒和卡盘延伸。 等离子体系统还包括耦合到阻抗匹配电路和卡盘之间的RF供给路径的相位调整电路。 相位调整电路具有耦合到RF供给路径的一端和接地的另一端。 等离子体系统包括耦合到相位调整电路的控制器。 控制器用于改变相位调整电路的参数，以基于调谐配方控制RF供应路径的阻抗。

公开(公告)号：US10249476B2

公开(公告)日：2019-04-02

申请号：US15133049

申请日：2016-04-19

Applicant: Lam Research Corporation

Inventor： Alexei Marakhtanov ,  Rajinder Dhindsa ,  Ken Lucchesi ,  Luc Albarede

IPC: H01J37/32

Abstract: A system for controlling an impedance of a radio frequency (RF) return path includes a matchbox further including a match circuitry. The system further includes an RF generator coupled to the matchbox to supply an RF supply signal to the matchbox via a first portion of an RF supply path. The RF generator is coupled to the matchbox to receive an RF return signal via a first portion of an RF return path. The system also includes a switch circuit and a plasma reactor coupled to the switch circuit via a second portion of the RF return path. The plasma reactor is coupled to the match circuitry via a second portion of the RF supply path. The system includes a controller coupled to the switch circuit, the controller configured to control the switch circuit based on a tune recipe to change an impedance of the RF return path.

公开(公告)号：US20170084503A1

公开(公告)日：2017-03-23

申请号：US14862983

申请日：2015-09-23

Applicant: Lam Research Corporation

Inventor： Yassine Kabouzi ,  Luc Albarede ,  Andrew D. Bailey, III ,  Jorge Luque ,  Seonkyung Lee ,  Thorsten Lill

IPC: H01L21/66 ,  H01L21/311 ,  H01L21/3065

CPC classification number: H01L22/26 ,  H01J37/32981 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/3083 ,  H01L21/31056 ,  H01L21/31116 ,  H01L21/32137 ,  H01L28/00

Abstract: A method for dry processing a substrate in a processing chamber is provided. The substrate is placed in the processing chamber. The substrate is dry processed, wherein the dry processing creates at least one gas byproduct. A concentration of the at least one gas byproduct is measured. The concentration of the at least one gas byproduct is used to determine processing rate of the substrate.

公开(公告)号：US20160314943A1

公开(公告)日：2016-10-27

申请号：US14694356

申请日：2015-04-23

Applicant: Lam Research Corporation

Inventor： Luc Albarede ,  Yassine Kabouzi ,  Jorge Luque ,  Andrew D. Bailey, III

IPC: H01J37/32

CPC classification number: H01J37/32963 ,  H01J37/32082 ,  H01J37/321 ,  H01J37/32449 ,  H01J37/32972 ,  H01J37/32981 ,  H01J37/3299 ,  H01J2237/334

Abstract: A substrate etching system includes an etching control module, a filtering module, and an endpoint module. The etching control module selectively begins plasma etching of a substrate within an etching chamber. The filtering module, during the plasma etching of the substrate: receives a signal including endpoint information; decomposes the signal using empirical mode decomposition (EMD); and generates a filtered signal based on results of the EMD. The endpoint module indicates when an endpoint of the plasma etching of the substrate has been reached based on the filtered signal. The etching control module ends the plasma etching of the substrate in response to the indication that the endpoint of the plasma etching of the substrate has been reached.

Abstract translation: 衬底蚀刻系统包括蚀刻控制模块，过滤模块和端点模块。 蚀刻控制模块选择性地开始蚀刻室内的衬底的等离子体蚀刻。 过滤模块在衬底的等离子体蚀刻期间：接收包括端点信息的信号; 使用经验模式分解（EMD）分解信号; 并根据EMD的结果生成滤波信号。 端点模块基于滤波信号指示何时已经到达基板的等离子体蚀刻的端点。 响应于已经达到衬底的等离子体蚀刻的终点的指示，蚀刻控制模块结束衬底的等离子体蚀刻。

公开(公告)号：US20160307738A1

公开(公告)日：2016-10-20

申请号：US15194452

申请日：2016-06-27

Applicant: Lam Research Corporation

Inventor： Alexei Marakhtanov ,  Rajinder Dhindsa ,  Ken Lucchesi ,  Luc Albarede

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32174 ,  H01J37/32449 ,  H01J37/32532 ,  H01J2237/3323 ,  H01J2237/3344

Abstract: A plasma system includes an RF generator and a matchbox including an impedance matching circuit, which is coupled to the RF generator via an RF cable. The plasma system includes a chuck and a plasma reactor coupled to the matchbox via an RF line. The RF line forms a portion of an RF supply path, which extends between the RF generator through the matchbox, and to the chuck. The plasma system further includes a phase adjusting circuit coupled to the RF supply path between the impedance matching circuit and the chuck. The phase adjusting circuit has an end coupled to the RF supply path and another end that is grounded. The plasma system includes a controller coupled to the phase adjusting circuit. The controller is used for changing a parameter of the phase adjusting circuit to control an impedance of the RF supply path based on a tune recipe.

Abstract translation: 等离子体系统包括RF发生器和包括阻抗匹配电路的火柴盒，其通过RF电缆耦合到RF发生器。 等离子体系统包括通过RF线耦合到火柴盒的卡盘和等离子体反应器。 RF线形成RF供应路径的一部分，RF供应路径在RF发生器之间通过火柴盒和卡盘延伸。 等离子体系统还包括耦合到阻抗匹配电路和卡盘之间的RF供给路径的相位调整电路。 相位调整电路具有耦合到RF供给路径的一端和接地的另一端。 等离子体系统包括耦合到相位调整电路的控制器。 控制器用于改变相位调整电路的参数，以基于调谐配方控制RF供应路径的阻抗。

公开(公告)号：US20160233058A1

公开(公告)日：2016-08-11

申请号：US15133049

申请日：2016-04-19

Applicant: Lam Research Corporation

Inventor： Alexei Marakhtanov ,  Rajinder Dhindsa ,  Ken Lucchesi ,  Luc Albarede

IPC: H01J37/32

CPC classification number: H01J37/32183

Abstract: A system for controlling an impedance of a radio frequency (RF) return path includes a matchbox further including a match circuitry. The system further includes an RF generator coupled to the matchbox to supply an RF supply signal to the matchbox via a first portion of an RF supply path. The RF generator is coupled to the matchbox to receive an RF return signal via a first portion of an RF return path. The system also includes a switch circuit and a plasma reactor coupled to the switch circuit via a second portion of the RF return path. The plasma reactor is coupled to the match circuitry via a second portion of the RF supply path. The system includes a controller coupled to the switch circuit, the controller configured to control the switch circuit based on a tune recipe to change an impedance of the RF return path.

公开(公告)号：US09337000B2

公开(公告)日：2016-05-10

申请号：US14043525

申请日：2013-10-01

Applicant: Lam Research Corporation

Inventor： Alexei Marakhtanov ,  Rajinder Dhindsa ,  Ken Lucchesi ,  Luc Albarede

IPC: H01J7/24 ,  H01J37/32

CPC classification number: H01J37/32183

Abstract: A system for controlling an impedance of a radio frequency (RF) return path includes a matchbox further including a match circuitry. The system further includes an RF generator coupled to the matchbox to supply an RF supply signal to the matchbox via a first portion of an RF supply path. The RF generator is coupled to the matchbox to receive an RF return signal via a first portion of an RF return path. The system also includes a switch circuit and a plasma reactor coupled to the switch circuit via a second portion of the RF return path. The plasma reactor is coupled to the match circuitry via a second portion of the RF supply path. The system includes a controller coupled to the switch circuit, the controller configured to control the switch circuit based on a tune recipe to change an impedance of the RF return path.

Abstract translation: 用于控制射频（RF）返回路径的阻抗的系统包括还包括匹配电路的火柴盒。 该系统还包括耦合到火柴盒的RF发生器，以经由RF供应路径的第一部分向火柴盒提供RF供应信号。 RF发生器耦合到火柴盒，以经由RF返回路径的第一部分接收RF返回信号。 该系统还包括经由RF返回路径的第二部分耦合到开关电路的开关电路和等离子体电抗器。 等离子体反应器经由RF供应路径的第二部分耦合到匹配电路。 该系统包括耦合到开关电路的控制器，该控制器被配置为基于调谐配方来控制开关电路以改变RF返回路径的阻抗。

公开(公告)号：US09107284B2

公开(公告)日：2015-08-11

申请号：US13800381

申请日：2013-03-13

Applicant: Lam Research Corporation

Inventor： Luc Albarede

IPC: H05H1/46 ,  H01J37/32

CPC classification number: H05H1/46 ,  H01J37/32183

Abstract: Systems and methods for compensating for harmonics produced during plasma processing in a plasma chamber are described. One of the methods includes retrieving a measurement of a combined waveform. The combined waveform includes a fundamental waveform and a harmonic waveform. The combined waveform defines a voltage proximate to a surface of a chuck, which is coupled to a radio frequency (RF) transmission line. The RF transmission line is coupled to an impedance matching circuit. The impedance matching circuit is coupled to an RF generator. The method further includes extracting the fundamental waveform from the combined waveform, determining a difference between a magnitude of the combined waveform and a magnitude of the fundamental waveform, and controlling the RF generator to compensate for the difference.

Abstract translation: 描述了用于补偿等离子体室中的等离子体处理期间产生的谐波的系统和方法。 其中一种方法包括检索组合波形的测量。 组合波形包括基波和谐波波形。 组合波形定义了靠近卡盘表面的电压，其耦合到射频（RF）传输线。 RF传输线耦合到阻抗匹配电路。 阻抗匹配电路耦合到RF发生器。 该方法还包括从组合波形中提取基波形，确定组合波形的幅度与基波的大小之差，以及控制RF发生器来补偿差值。