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公开(公告)号:US06960494B2
公开(公告)日:2005-11-01
申请号:US10968890
申请日:2004-10-21
申请人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
发明人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
CPC分类号: H01L23/49894 , H01L23/3121 , H01L24/48 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.
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公开(公告)号:US06836012B2
公开(公告)日:2004-12-28
申请号:US10108363
申请日:2002-03-29
申请人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
发明人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
IPC分类号: H01L2314
CPC分类号: H01L23/49894 , H01L23/3121 , H01L24/48 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.
摘要翻译: 半导体封装具有(a)封装基座,(b)形成在封装基座上并用于将半导体封装连接到另一器件的封装端子,(c)形成在封装基座上并电连接到封装端子的布线层 ,(d)安装在封装基板上并电连接到布线层的半导体芯片,(e)在树脂模具和布线层之间以及封装基底和树脂模具之间形成的低弹性树脂层,和 f)树脂模具密封封装基座,布线层,半导体芯片和低弹性树脂层。
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公开(公告)号:US06333212B1
公开(公告)日:2001-12-25
申请号:US09707850
申请日:2000-11-08
IPC分类号: H01L2144
CPC分类号: H01L23/3121 , H01L23/49531 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/45099 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.
摘要翻译: 公开了一种厚度为1mm以下的半导体器件,其包括厚度为0.1mm至0.25mm的框架板主体,设置在框架板主体的第一表面上并具有 厚度在0.2mm至0.3mm的范围内,外部连接引线,其一端连接到框架板主体的第一表面的周边部分,其另一端延伸到框架主体的外部 电连接半导体芯片的电极和外部连接引线的端部的连接部分的接合线,以及用于覆盖和密封至少包括半导体芯片,接合线和 连接部分。
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公开(公告)号:US5902320A
公开(公告)日:1999-05-11
申请号:US924659
申请日:1997-09-05
CPC分类号: A61B17/06066 , A61B17/06004 , A61B17/062 , A61B17/0625 , A61B18/1442 , A61B2017/06019 , A61B2017/06028 , A61B2017/06047 , A61B2017/06085
摘要: The present invention provides a surgical needle having a needle tip end and a clamping portion to be clamped by a needle holder for applying a current, whereinthe needle tip end is made from a conductive material which is electrically connected to a conductive material of the clamping portion,an insulating layer is provided over the clamping portion and a tip surrounding portion of the surgical needle, whereas at least the needle tip end is electrically exposed, andwhen the insulating material over the clamping portion is clamped by the needle holder, the conductive material of the clamping portion is electrically connected to the needle holder.
摘要翻译: 本发明提供了一种外科用针,其具有针尖端和夹持部分,用于夹持用于施加电流的针保持器,其中针尖端由导电材料制成,导电材料电连接到夹持的导电材料 在夹持部分上设置有绝缘层和手术针头的尖端周围部分,而至少针头末端被电暴露,并且当夹持部分上的绝缘材料被针保持器夹紧时,导电 夹持部的材料电连接到针保持器。
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公开(公告)号:US5022857A
公开(公告)日:1991-06-11
申请号:US287116
申请日:1988-12-21
申请人: Kanji Matsutani , Masatoshi Fukuda
发明人: Kanji Matsutani , Masatoshi Fukuda
摘要: A dental burr has an axis of rotation and a cooling water passage extending therethrough in coaxial relation to the dental burr. The cooling water passage opens to a front end face of the dental burr, and this opening in the front end of the dental burr is disposed in an area including the axis of rotation of the dental burr. A dental handpiece for rotatably holding a dental burr includes a handgrip portion, a hollow head portion provided at a front end of the handgrip portion, and a cooling water passage. This cooling water passage extends along the handgrip portion,and opens at one end to a rear end of the handgrip portion while the other end thereof is connected to an internal space of the head portion. Part of the internal space serves as a passage for communicating the cooling water passage of the dental handpiece with the cooling water passage of the dental burr held by the dental handpiece.
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公开(公告)号:US08409919B2
公开(公告)日:2013-04-02
申请号:US12882673
申请日:2010-09-15
申请人: Hideo Aoki , Masatoshi Fukuda , Kanako Sawada , Yasuhiro Koshio
发明人: Hideo Aoki , Masatoshi Fukuda , Kanako Sawada , Yasuhiro Koshio
IPC分类号: H01L21/60
CPC分类号: H01L24/81 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/7592 , H01L2224/81065 , H01L2224/81093 , H01L2224/81193 , H01L2224/81203 , H01L2224/81205 , H01L2224/81208 , H01L2224/8121 , H01L2224/81815 , H01L2224/81907 , H01L2224/81986 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/00
摘要: According to a manufacturing method of one embodiment, a first solder bump and a second solder bump are aligned and placed in contact with each other, and thereafter, the first and second solder bumps are heated to a temperature equal or higher than a melting point of the solder bumps and melted, whereby a partially connection body of the first solder bump and the second solder bump is formed. The partially connection body is cooled. The cooled partially connection body is heated to a temperature equal to or higher than the melting point of the solder bump in a reducing atmosphere, thereby to form a permanent connection body by melting the partially connection body while removing an oxide film existing on a surface of the partially connection body.
摘要翻译: 根据一个实施例的制造方法,将第一焊料凸块和第二焊料凸块对齐并且彼此接触放置,然后将第一和第二焊料凸块加热至等于或高于 焊料凸起并熔化,由此形成第一焊料凸块和第二焊料凸块的部分连接体。 部分连接体被冷却。 冷却的部分连接体在还原气氛中被加热到等于或高于焊料凸点的熔点的温度,从而通过熔化部分连接体而形成永久性连接体,同时除去存在于表面上的氧化膜 部分连接体。
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公开(公告)号:US20120119326A1
公开(公告)日:2012-05-17
申请号:US13207728
申请日:2011-08-11
CPC分类号: H01G4/005 , H01G4/01 , H01G11/30 , H01L23/5223 , H01L23/5225 , H01L28/86 , H01L2924/0002 , Y02E60/13 , H01L2924/00
摘要: A capacitor includes first electrode patterns and second electrode patterns disposed alternately on a plane, each of the first electrode patterns having a linear shape and extending in a first direction from a first end to a third end with a first length, each of the second electrodes having a linear shape and extending in said first direction from a second end to a fourth end with a second length shorter than the first length, a first wiring pattern supplying a first voltage to the first electrode patterns by first via-plugs, and a second wiring pattern supplying a second voltage to the second electrode patterns by second via-plugs, wherein the first end of the first electrode pattern extends beyond the second end of the second electrode pattern and the third end of the first electrode pattern extends beyond the fourth end of said the electrode.
摘要翻译: 电容器包括交替地设置在平面上的第一电极图案和第二电极图案,每个第一电极图案具有直线形状并且在第一方向上从第一端延伸到具有第一长度的第三端,每个第二电极 具有线性形状并且在所述第一方向上从第二端延伸到具有比所述第一长度短的第二长度的第四端;第一布线图案,通过第一通孔插头向所述第一电极图案提供第一电压,第二布线图案 布线图案通过第二通孔将第二电压提供给第二电极图案,其中第一电极图案的第一端延伸超过第二电极图案的第二端,并且第一电极图案的第三端延伸超过第四端 的电极。
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公开(公告)号:US20060191974A1
公开(公告)日:2006-08-31
申请号:US11357814
申请日:2006-02-21
IPC分类号: A61B17/10
CPC分类号: A61B17/0684 , A61B34/76 , A61B2090/0811
摘要: A surgical stapler has a body capable of containing a plurality of staples in an aligned state; a ram provided inside said body, having a central concave portion and pressure armatures on both sides of the concave portion; an anvil that, when the armatures of said ram contact both sides of a crown of a staple, forces the center of the crown into the concave portion of the ram; and a trigger rotatably supported on the body so as to cause relative movement between the ram and the anvil. A moving member strikes another member so as to produce a sound or a sensation of impact after a staple sandwiched between the ram and the anvil is bent by the advance of the anvil into the concave portion of the ram and bending of the staple is completed.
摘要翻译: 手术吻合器具有能够容纳处于对准状态的多个钉的主体; 设置在所述主体内的冲头,在所述凹部的两侧具有中心凹部和压力衔铁; 砧座,当所述柱塞的电枢接触订书钉的冠部的两侧时,迫使冠部的中心进入压头的凹部; 以及触发器,其被可旋转地支撑在所述主体上,以便在所述压头和所述砧座之间产生相对运动。 移动构件撞击另一构件,以便在夹在砧座和砧座之间的钉子被砧座前进到冲头的凹部中弯曲的钉子之后产生冲击的声音或感觉,并且钉子的弯曲完成。
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公开(公告)号:US06987297B2
公开(公告)日:2006-01-17
申请号:US10768188
申请日:2004-02-02
IPC分类号: H01L29/788
CPC分类号: H01L21/28273 , G11C16/0475 , H01L29/7887
摘要: A polysilicon film and the like are patterned to form n− diffusion layers on a silicon substrate. Subsequently, an outer edge of an Al2O3 film is made retreat to be smaller than that of a gate electrode by performing isotropic etching of the Al2O3 film, using a solution of sulfuric acid with hydrogen peroxide. A silicon oxide film, a silicon nitride film, the polysilicon film and the like are hardly removed although the solution of sulfuric acid with hydrogen peroxide exhibits higher etching rate to the Al2O3 film, enabling almost exclusive etching of the Al2O3 film at a high selectivity ratio. Subsequently, another polysilicon film is formed so as to fill spaces formed after the retreat of the Al2O3 film under the silicon oxide film. Subsequently, a sidewall insulating film is formed by remaining portions of the later polysilicon film in the spaces by performing RIE, oxidation, or the like of the later polysilicon film.
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公开(公告)号:US06537874B2
公开(公告)日:2003-03-25
申请号:US09815012
申请日:2001-03-23
申请人: Shunji Nakamura , Masatoshi Fukuda
发明人: Shunji Nakamura , Masatoshi Fukuda
IPC分类号: H01L218242
CPC分类号: H01L27/10855 , H01L27/10814 , H01L27/11502 , H01L28/91
摘要: Insulation films 45, 56 having a contact hole 58 are formed on a substrate. A dummy plug 62 is formed in the contact hole 58. Insulation films 64, 66 are formed on the insulation film 56. An opening 70 for exposing at least a part of the dummy plug 62 is formed in the insulation films 64, 66. The dummy plug 62 is selectively removed through the opening 70. A storage electrode 72 is formed in the contact hole 58 and the opening 70. The insulation film 66 is selectively removed. A dielectric film 74 and a plate electrode are formed on the storage electrode 72. Whereby, without an extra support for supporting the storage electrode 72, the storage electrode 72 is prevented form falling down or peeling off, and defective contact and breakage of the lower structure due to disalignment can be precluded.
摘要翻译: 在基板上形成具有接触孔58的绝缘膜45,56。 虚拟插头62形成在接触孔58中。绝缘膜64,66形成在绝缘膜56上。用于暴露虚拟插头62的至少一部分的开口70形成在绝缘膜64,66中。 虚拟插头62通过开口70选择性地去除。存储电极72形成在接触孔58和开口70中。绝缘膜66被选择性地去除。 在存储电极72上形成有电介质膜74和平板电极。由此,在没有用于支撑存储电极72的额外支撑的情况下,可以防止存储电极72的下落或剥离,并且下部的接触和断裂不良 可以排除由于不对准导致的结构。
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