摘要:
This invention provides a surface acoustic wave device mounted module which is miniature, light, and highly reliable. The surface acoustic wave device mounted module also has excellent frequency characteristics. The surface acoustic wave device mounted module includes a multilayer substrate which has at least one layer of a shield pattern, input-output electrodes, grounding electrodes, through holes used for connecting electrodes, and a surface acoustic wave element. The surface acoustic wave element has metallic bumps, which are transfer-coated with a conductive resin, on electrode pads and an insulating resin around the surface acoustic wave element. The electrode pads are input-output terminals and grounding terminals formed on the surface acoustic wave element. Continuities between the input-output terminals and the input-output electrodes, and between the grounding terminals and the grounding electrodes are established by the through holes. An electrode pattern is formed on the surface of the multilayer substrate facing and surrounding the surface acoustic wave element. A metallic lid is attached to the electrode pattern by a solder or a conductive resin so that the surface acoustic wave element is sealed in an airtight condition. The electrode pattern is connected to the grounding electrodes by the through holes.
摘要:
A semiconductor laser apparatus includes a semiconductor laser for emitting a light beam. The semiconductor laser has, as an external cavity, a quadruple light wave mixing optical phase conjugate element for inverting a spatial phase of an incident light beam. The apparatus further includes a pair of pump light sources which are arranged such that a superimposed portion of spectra of wavelengths of three light beams including two pump light beams emitted from the pair of pump light sources and entering into the optical phase conjugate element and another light beam emitted from the semiconductor laser is narrower than the spectral width of wavelengths of each of the three light beams. This enables the laser apparatus to generate an oscillating output wavelength of extremely narrow spectral width.
摘要:
A voltage-dependent resistor comprising a sintered body comprising ZnO as a major part and additives wherein at least 10 weight percent of the ZnO is composed of ZnO grains having a grain size in the range from 100 to 500 microns; and method of making the same wherein the starting mixture comprises ZnO grains having a grain size in the range from 20 to 200 microns. This voltage-dependent resistor has both a low C-value and a high surge energy withstanding capability. It also has a low leakage current at a high temperature due to the addition of an antimony component as a spinel type polycrystalline Zn.sub.7/3 Sb.sub.2/3 O.sub.4.
摘要:
In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
摘要:
According to the present invention, a hybrid magnetic substrate is provided, which includes: a magnetic substrate; and a holding substrate directly bonded to the magnetic substrate through at least one of a hydrogen bond and a covalent bond. Furthermore, a method for producing a hybrid magnetic substrate having the magnetic substrate and the holding substrate is provided, which includes the steps of: cleaning a surface of the magnetic substrate to be bonded and a surface of the holding substrate to be bonded; allowing the cleaned surfaces to be subjected to a hydrophilic treatment; and attaching the surfaces, which are subjected to the hydrophilic treatment, to each other to directly bond the magnetic substrate to the holding substrate.
摘要:
A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.
摘要:
A piezoelectric device is manufactured by: (1) mirror finishing surfaces of a first substrate and a second substrate made of a piezoelectric element; (2) forming grooves on at least one of the two surfaces of the first and second substrates; (3) joining the mirror-finished surfaces of the first substrate and the second substrate; (4) applying heat to the joined substrates and bonding them; (5) forming an opening on the first substrate so that a part of the exposed areas of the second substrate is exposed through the opening; (6) forming piezoelectric devices by forming electrodes on at least one of the second substrate through the opening and a corresponding area to the exposed area on the rear side of the second substrate; and (7) dividing the bonded substrates into portions each having one of the piezoelectric devices. Through this manufacturing method, piezoelectric devices with high yield ratios and high reliability can be obtained.
摘要:
A compact, low height, low cost, and high reliability surface acoustic wave device, and its method of manufacture. The surface acoustic wave device consists of a substrate, a comb-electrode disposed on the main surface of the substrate, plural electrode pads disposed around the comb-electrode, protecting means covering the comb-electrode through a closed space produced by combining the comb-electrode and the electrode pads with the substrate by using substantially covalent bonding force acting between conductive bumps formed on the electrode bumps, a conductive adhesive layer disposed at least on the top of the conductive bumps, and a package adhered on the conductive bumps by means of the conductive adhesive, and insulation adhesive filled into the package contacting the conductive adhesive, the conductive bumps and the protective means.
摘要:
A resonator ladder surface acoustic wave (SAW) filter, which has a wide and flat pass band without spurious signals therein is provided. An input electrode, a serial arm SAW resonator, an output electrode, a parallel arm SAW resonator and a ground electrode are respectively formed on a 41.degree.-rotated Y-cut X-propagation lithium niobate substrate. The serial arm SAW resonator comprises a pair of interdigital transducers (IDTs) to excite SAW, one of which is connected to the input electrode. The output electrode is connected to the other IDT of the serial arm SAW resonator. The parallel arm SAW resonator comprises a pair of IDTs to excite SAW, one of which is connected to the output electrode. And the ground electrode is connected to the other IDT of the parallel arm SAW resonator. The IDTs are metal films of Al or Al-based alloy, and the thickness of the metal films ranges from 2.5% to 7.5% of the electrode cycle of the IDT of the parallel arm SAW resonator.
摘要:
A method of manufacturing a composite substrate and the composite substrate manufactured thereby wherein surfaces of first and second substrates having different thermal expansion coefficients are mirror finished and layered on each other. A first heat treatment is applied after which a part of the second substrate is removed to a depth sufficient to expose the first substrate. A final second heat treatment directly bonds the substrates.