公开(公告)号：US08035991B2

公开(公告)日：2011-10-11

申请号：US12010872

申请日：2008-01-30

申请人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

摘要翻译： 公开了一种能够解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 层叠有第一金属层，第一电介质层，第二电介质层和第二金属层的电磁带隙结构可以包括形成在第一电介质层和第二电介质层之间的第一金属板; 形成在与第一金属板相同的平面上的第二金属板，容纳在形成在第一金属板中并通过金属线电连接到第一金属板的孔中; 以及将第二金属板连接到第一金属层和第二金属层中的任一个的通孔。 利用本发明，电磁带隙结构不仅可以小型化，而且具有低带隙频率。

公开(公告)号：US07764149B2

公开(公告)日：2010-07-27

申请号：US12007122

申请日：2008-01-07

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

IPC分类号： H01P1/203 ,  H01P5/08

CPC分类号： H01Q15/008 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括金属层; 以及包括金属板和通孔的多个蘑菇型结构。 这里，多个蘑菇型结构体可以以叠层结构形成在金属层上。 通过本发明，小型电磁带隙结构可以具有较低的带隙频率。

公开(公告)号：US20100132996A1

公开(公告)日：2010-06-03

申请号：US12466677

申请日：2009-05-15

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Kang-Wook Bong

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Kang-Wook Bong

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： In accordance with an embodiment of the present invention, an electromagnetic bandgap structure includes a plurality of conductive plates, and a multi-via connection part, which electrically connects any two of the plurality of conductive plates with each other. Here, the multi-via connection part includes: a first multi-via, including a first via, having one end part connected to one of the two conductive plates, and at least one other via connected in serial to the first via through a conductive trace; a second multi-via, including a second via, having one end part connected to the other of the two conductive plates, and at least one other via connected in serial to the second via through a conductive trace; and a conductive connection pattern, connecting any one of the vias included in the first multi-via and any one of the vias included in the second multi-via with each other.

摘要翻译： 根据本发明的实施例，电磁带隙结构包括多个导电板，以及多通孔连接部，其将多个导电板中的任何两个彼此电连接。 这里，多通孔连接部件包括：包括第一通孔的第一多通孔，其具有连接到两个导电板中的一个的一个端部，以及至少一个其它通孔，其连接到第一通孔，通过导电 跟踪; 包括连接到所述两个导电板中的另一个的一个端部的第二多通孔，以及至少一个通过导电迹线串联连接到所述第二通孔的另一通孔; 以及导电连接图案，其将包括在第一多通孔中的任何一个通孔和包括在第二多通孔中的任何一个通孔彼此连接。

公开(公告)号：US20080266018A1

公开(公告)日：2008-10-30

申请号：US12007122

申请日：2008-01-07

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Hyo-Jic Jung

IPC分类号： H01P1/20

CPC分类号： H01Q15/008 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括金属层; 以及包括金属板和通孔的多个蘑菇型结构。 这里，多个蘑菇型结构体可以以叠层结构形成在金属层上。 通过本发明，小型电磁带隙结构可以具有较低的带隙频率。

公开(公告)号：US20110179642A1

公开(公告)日：2011-07-28

申请号：US13064542

申请日：2011-03-30

申请人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K3/30

CPC分类号： H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A method of embedding a chip capacitor in a printed circuit board including a first conductive layer and a dielectric layer placed on the first conductive layer includes removing the dielectric layer to form a cavity exposing the first conductive layer; seating a chip capacitor in the cavity; filling a filled material at a space excluding a space occupied by the chip capacitor in the cavity; forming a via penetrating the filled material and being connected to the chip capacitor; and stacking a conductive material to constitute a second conductive layer in surfaces of the via and the dielectric layer and in an surface of the filled material filled in the cavity.

摘要翻译： 将片状电容器嵌入到包括放置在第一导电层上的第一导电层和介电层的印刷电路板中的方法包括去除电介质层以形成露出第一导电层的空腔; 将片状电容器放置在空腔中; 在不包括空腔中的片状电容器占据的空间的空间填充填充材料; 形成穿过填充材料并连接到片式电容器的通孔; 并且在通孔和电介质层的表面和填充在空腔中的填充材料的表面中堆叠导电材料以构成第二导电层。

公开(公告)号：US07965521B2

公开(公告)日：2011-06-21

申请号：US12010558

申请日：2008-01-25

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Jae-Joon Lee

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Jae-Joon Lee

IPC分类号： H05K9/00

CPC分类号： H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，将所述第一金属层连接到所述金属板; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 和第二金属层，堆叠在第二介电层中。 这里，可以在金属板上形成孔。 利用本发明，与具有相同尺寸的其他结构相比，电磁带隙结构可以在相同频带内更低噪声水平。

公开(公告)号：US20090085691A1

公开(公告)日：2009-04-02

申请号：US12007793

申请日：2008-01-15

申请人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H03H7/00 ,  H05K3/30

CPC分类号： H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board.

摘要翻译： 公开了一种具有嵌入式芯片电容器的印刷电路板。 根据本发明的实施例，具有嵌入式芯片电容器的印刷电路板可以包括第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，放置在第一导电层和第二导电层之间，并具有连接到第二导电层的第二电极; 以及将所述第一导电层连接到所述芯片电容器的第一电极的通孔。 利用本发明，通过使用嵌入在印刷电路板中的片状电容器作为电磁带隙结构，可以在包括模拟电路和数字电路板的印刷电路板中解决问题混合信号。 这里，各种电气设备或元件安装在印刷电路板中。

公开(公告)号：US20080266026A1

公开(公告)日：2008-10-30

申请号：US12010558

申请日：2008-01-25

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Jae-Joon Lee

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Jae-Joon Lee

IPC分类号： H03H7/00

CPC分类号： H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，将所述第一金属层连接到所述金属板; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 和第二金属层，堆叠在第二介电层中。 这里，可以在金属板上形成孔。 利用本发明，与具有相同尺寸的其他结构相比，电磁带隙结构可以在相同频带内更低噪声水平。

公开(公告)号：US08279616B2

公开(公告)日：2012-10-02

申请号：US13064541

申请日：2011-03-30

申请人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.

摘要翻译： 具有嵌入式芯片电容器的印刷电路板包括：第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，其具有通过位于形成在第一导电层和第二导电层之间的空腔中而连接到第一导电层的第一电极; 填充材料，填充在空腔内不包括由片状电容器占据的空间的空间中; 以及通孔，穿透填充材料并将第二导电层连接到片式电容器的第二电极。

公开(公告)号：US20120162934A1

公开(公告)日：2012-06-28

申请号：US13411005

申请日：2012-03-02

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K7/00

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。