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公开(公告)号：US07977618B2
公开(公告)日：2011-07-12
申请号：US12545320
申请日：2009-08-21
IPC分类号： G01R33/00
CPC分类号： H04B10/25
摘要： Testing is performed on an amplifier wafer housing a transimpedance amplifier prior to packaging the transimpedance amplifier with an external photodetector, wherein the transimpedance amplifier includes a small, auxiliary, integrated silicon photodetector provided at the input of the transimpedance, in parallel with external photodetector attachment points. To test the transimpedance amplifier, the transimpedance amplifier is stimulated by optically exciting the small auxiliary photodetector, wherein the small auxiliary photodetector is excited using short wavelength light, whereby advantages such as higher efficiency may be obtained. The testing method includes placing the amplifier wafer in a testing system, probing the power and ground connections on the amplifier wafer, illuminating the small auxiliary photodetector on the amplifier wafer, and detecting the output of the transimpedance amplifier housed on the amplifier wafer.
摘要翻译： 在将跨阻抗放大器封装在外部光电检测器之前，在放大器晶片上进行测试，其中跨导放大器包括一个小的辅助集成硅光电检测器，其设置在跨阻抗的输入处，与外部光电检测器连接点 。 为了测试跨阻抗放大器，通过光学激励小型辅助光电探测器来刺激跨阻放大器，其中使用短波长光来激发小的辅助光电探测器，由此可以获得诸如更高效率的优点。 测试方法包括将放大器晶片放置在测试系统中，探测放大器晶片上的电源和接地连接，照射放大器晶片上的小辅助光电检测器，以及检测放大晶片上的跨阻放大器的输出。
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公开(公告)号：US20070286293A1
公开(公告)日：2007-12-13
申请号：US11450583
申请日：2006-06-12
IPC分类号： H04B14/04
CPC分类号： H04B3/14
摘要： A circuit includes an input signal line, a high performance resonant element connected to the input signal line, and an output signal line connected to the high performance resonant element. The high performance resonant element is a via.
摘要翻译： 电路包括输入信号线，连接到输入信号线的高性能谐振元件和连接到高性能谐振元件的输出信号线。 高性能谐振元件是通孔。
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公开(公告)号：US09713258B2
公开(公告)日：2017-07-18
申请号：US11411920
申请日：2006-04-27
申请人： Young Hoon Kwark
发明人： Young Hoon Kwark
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H05K1/18 , H01L23/13 , H01L23/367 , H01L23/66 , H01L23/00 , H01L25/16
CPC分类号： H05K1/183 , H01L23/13 , H01L23/3677 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/165 , H01L2223/6627 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/45014 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15192 , H01L2924/1903 , H01L2924/3011 , H01L2924/3025 , H05K2201/092 , H05K2201/09845 , H05K2203/049 , H01L2224/45099 , H01L2224/05599
摘要： An electrical circuit device that includes a circuit board with an integrated circuit chip in a cavity that extends from a surface of the circuit board to an embedded conductor, and an electrical connection between the integrated circuit chip and the embedded conductor.
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公开(公告)号：US08436701B2
公开(公告)日：2013-05-07
申请号：US12701957
申请日：2010-02-08
IPC分类号： H01H51/22
CPC分类号： H01H49/00 , H01F2007/068 , H01H50/005 , H01H50/16 , Y10T29/49075
摘要： Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
摘要翻译： 提出了机电继电器和半导体结构以及包括机电继电器的至少一部分的微机电系统。 例如，机电继电器包括印刷电路板内的导电端子，一个或多个导电触点和一个或多个磁性致动器。 一个或多个磁性致动器分别与一个或多个导电触点相关联，并且每个磁性致动器包括（i）延伸穿过印刷电路板的一个或多个层的至少一个通孔内的磁芯，以及（ii） 围绕磁芯的至少一部分并且在印刷电路板的一个或多个层内的电线圈。 一个或多个致动器的激活导致端子与一个或多个导电触点中相关联的一个之间的电接触。
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15.发明授权Mapping system and method for determining optimal radio transponder placement 失效用于确定最佳无线电应答器放置的映射系统和方法公开(公告)号：US07541925B2
公开(公告)日：2009-06-02
申请号：US11257408
申请日：2005-10-24
IPC分类号： G08B13/14
CPC分类号： G01R29/0871 , G01R29/0814
摘要： A mapping system and method. The mapping system comprises an electromagnetic field generator, a layer of electromagnetic field absorbing material over an object, and an infrared camera. The electromagnetic field generator is adapted to generate an electromagnetic field and expose the electromagnetic field absorbing material and object to the electromagnetic field. The layer of electromagnetic field absorbing material is adapted to absorb the electromagnetic field and generate areas of thermal differences within the electromagnetic field absorbing material. The infrared camera is adapted to detect the areas of thermal differences.
摘要翻译： 映射系统和方法。 映射系统包括电磁场发生器，物体上的电磁场吸收材料层和红外摄像机。 电磁场发生器适于产生电磁场，并将电磁场吸收材料暴露于电磁场。 电磁场吸收材料层适于吸收电磁场并产生电磁场吸收材料内的热差区域。 红外摄像机适用于检测热差异的区域。
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16.发明授权High performance interposer for a chip package using deformable button contacts 有权用于使用可变形按钮触点的芯片封装的高性能插入器公开(公告)号：US06994570B2
公开(公告)日：2006-02-07
申请号：US10765042
申请日：2004-01-28
申请人： Young Hoon Kwark
发明人： Young Hoon Kwark
IPC分类号： H01R4/58
CPC分类号： H05K3/325 , H01L23/49811 , H01L23/49827 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/3011 , H01L2924/3025 , H01R12/714 , H05K2201/0367 , H05K2201/10303 , H05K2201/10333 , H01L2924/00
摘要： An interposer includes an array of buttons on a carrier having a proximity to each other that allows contact between two adjacent buttons to occur when at least one of the two adjacent buttons is axially compressed above a predetermined threshold. The chip package includes a chip having a first surface and a second surface, a printed circuit board having a first surface and a second surface, and an interposer having an array of buttons between the chip and the printed circuit board. The first surfaces are closer to each other than the second surfaces.
摘要翻译： 插入器包括在载体上具有彼此接近的按钮阵列，当两个相邻按钮中的至少一个被轴向压缩到高于预定阈值时，允许两个相邻按钮之间的接触。 芯片封装包括具有第一表面和第二表面的芯片，具有第一表面和第二表面的印刷电路板，以及在芯片和印刷电路板之间具有按钮阵列的插入件。 第一表面比第二表面更接近。
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17.发明授权Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers 有权使用电介质间隔物共同分配的受控阻抗线接合的方法和结构公开(公告)号：US07854368B2
公开(公告)日：2010-12-21
申请号：US11923413
申请日：2007-10-24
IPC分类号： B23K31/02
CPC分类号： H01L24/46 , H01L23/66 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L2223/6611 , H01L2223/6627 , H01L2224/43 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49174 , H01L2224/8502 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/1903 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/0219 , H05K1/0243 , H05K2201/0792 , H05K2201/09236 , H05K2201/1028 , H05K2203/049 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.
摘要翻译： 制造电子互连的方法（和结构）包括用于要互连的信号线，使用被配置为提供受控阻抗效应的多个接合线。
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公开(公告)号：US20090102451A1
公开(公告)日：2009-04-23
申请号：US12346308
申请日：2008-12-30
申请人： Young Hoon Kwark
发明人： Young Hoon Kwark
IPC分类号： G01R31/02
CPC分类号： G01R1/06772 , Y10T29/49002
摘要： A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.
摘要翻译： 共面波导（CPW）探针包括至少一个中心探针元件，每个中心探针元件具有相应的中心探针接触点和至少一个外围探针元件，每个具有相应的外围接触点。 所述至少一个中心接触点和所述至少一个外围接触点之间的间距是可调节的。
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公开(公告)号：US07161344B2
公开(公告)日：2007-01-09
申请号：US10827230
申请日：2004-04-20
申请人： Young Hoon Kwark
发明人： Young Hoon Kwark
CPC分类号： G01R1/06772 , Y10T29/49002
摘要： A coplanar waveguide (CPW) probe includes at least one center probe element, each having a respective center probe contact point and at least one peripheral probe element, each having a respective peripheral contact point. The pitch between the at least one center contact point and the at least one peripheral contact point is adjustable.
摘要翻译： 共面波导（CPW）探针包括至少一个中心探针元件，每个中心探针元件具有相应的中心探针接触点和至少一个外围探针元件，每个具有相应的外围接触点。 所述至少一个中心接触点和所述至少一个外围接触点之间的间距是可调节的。
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公开(公告)号：US20120282749A1
公开(公告)日：2012-11-08
申请号：US13287198
申请日：2011-11-02
IPC分类号： H01L21/768
CPC分类号： H04B3/14
摘要： A method of forming a semiconductor device for processing a signal includes providing a circuit board including an input signal line, providing a high performance resonant element connected to the input signal line, and providing an output signal line connected to the high performance resonant element. The high performance resonant element includes a via.
摘要翻译： 形成用于处理信号的半导体器件的方法包括提供包括输入信号线的电路板，提供连接到输入信号线的高性能谐振元件，以及提供连接到高性能谐振元件的输出信号线。 高性能谐振元件包括通孔。
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