公开(公告)号：US11051402B2

公开(公告)日：2021-06-29

申请号：US16664075

申请日：2019-10-25

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: H05K1/05 ,  H05K1/03

Abstract: A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 μm to 1 μm. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 μm and 100 μm.

公开(公告)号：US10781297B2

公开(公告)日：2020-09-22

申请号：US15834259

申请日：2017-12-07

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Ying-Te Huang ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08K5/5333 ,  H05K1/09 ,  C08K3/36 ,  C08J5/24 ,  B32B15/14 ,  B32B17/04 ,  B32B15/20 ,  C08L71/12 ,  C08K3/22 ,  C08K5/20 ,  C08K5/3492 ,  C08K5/52 ,  C08K3/26 ,  C08K5/523 ,  C08K5/02

Abstract: A thermosetting resin composition contains a primary resin formed from mixing a styrene-type polyphenylene ether resin thermally modified with styrene with an acrylic-type polyphenylene ether resin thermally modified with acrylic at a weight ratio ranging between 0.5 and 1.5, consequently having excellent heat resistance, flowability, and filling ability; and when cured, having a dielectric constant smaller than 3.0 and a dielectric dissipation factor smaller less than 0.0020 at the frequency of 1 GHz as well as a glass transition temperature higher than 210° C.; in application, the composition is suitable to impregnate reinforcement to form prepregs with excellent curability.

公开(公告)号：US09512257B2

公开(公告)日：2016-12-06

申请号：US14223300

申请日：2014-03-24

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Dein-Run Fung ,  Te-Chao Liao ,  Chia-Cheng Chao ,  Hao-Sheng Chen

IPC: C08G8/28 ,  C08G8/04 ,  C08G8/08 ,  C08G59/62

CPC classification number: C08G8/28 ,  C08G8/04 ,  C08G8/08 ,  C08G59/621

Abstract: A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).

Abstract translation: 酚类磷固化剂通过将磷化合物接枝到苯环上以代替氢原子而工作，并且是无卤素且不可燃的; 当与环氧树脂一起作用和固化时，固化剂有助于形成更高的交联密度和优异的耐热性，以使环氧树脂适合用于制造PCB绝缘层或半导体封装以及赋予PCB绝缘层或半导体 包装具有优异的阻燃性和高玻璃化转变温度（Tg）。

公开(公告)号：US11707876B2

公开(公告)日：2023-07-25

申请号：US16839452

申请日：2020-04-03

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Wen-Cheng Yang ,  Te-Chao Liao ,  Hao-Sheng Chen ,  Chien-Chih Lin

IPC: B29C48/19 ,  B29C48/40 ,  B29B7/14 ,  C08J3/22 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  B29K67/00

CPC classification number: B29C48/19 ,  B29B7/14 ,  B29C48/40 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  C08J3/22 ,  B29K2067/00 ,  B29K2995/004 ,  B29K2995/0016 ,  B29K2995/0039 ,  B29K2995/0041 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2307/306 ,  C08J2367/00 ,  C08J2471/00 ,  C08J2479/08 ,  C08J2481/06

Abstract: A polyester film and a method for producing the same are provided. The polyester film includes a heat resistant layer. The heat resistant layer includes a high temperature resistant resin material and a polyester resin material. The high temperature resistant resin material and the polyester resin material are melted and kneaded with each other via a twin screw granulator. The twin-screw granulator has a twin-screw temperature between 250° C. and 320° C., and the twin-screw granulator has a twin-screw rotation speed between 300 rpm and 800 rpm, so that the high temperature resistant resin material is dispersed in the polyester resin material with a particle size of between 50 nm and 200 nm.

公开(公告)号：US11623434B2

公开(公告)日：2023-04-11

申请号：US17012239

申请日：2020-09-04

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wen-Cheng Yang ,  Hao-Sheng Chen ,  Chia-Yen Hsiao

IPC: B32B27/20 ,  C08K3/013 ,  B32B27/08 ,  B32B27/36 ,  B29C48/08 ,  B29C48/21 ,  C08J5/18 ,  B29K67/00 ,  B29C55/14 ,  B29C48/00 ,  B29K509/02

Abstract: A biaxially stretched polyester film and a method for producing the same are provided. The biaxially stretched polyester film includes a polyester resin base layer and a matte layer. The polyester resin base layer includes: (1) 50 to 95 wt % of a polyester resin base material, and an intrinsic viscosity of the polyester resin base material being between 0.5 and 0.8 dL/g; and (2) 0.01 to 5 wt % of a high viscosity polyester resin material, and an intrinsic viscosity of the high viscosity polyester resin material being between 0.9 and 1.1 dL/g. The matte layer includes: (1) 50 to 95 wt % of a polyester resin matrix material, and an intrinsic viscosity of the polyester resin matrix material being between 0.5 and 0.8 dL/g; and (2) 0.3 to 40 wt % of a plurality of filler particles, and the filler particles having an average particle size of between 0.15 μm and 10 μm.

公开(公告)号：US11607872B2

公开(公告)日：2023-03-21

申请号：US16785707

申请日：2020-02-10

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Wen-Cheng Yang ,  Hao-Sheng Chen ,  Chia-Yen Hsiao

IPC: B32B27/36 ,  B32B27/08 ,  B32B27/20 ,  B32B3/26 ,  C08J5/18

Abstract: A biaxially stretched polyester film and a method for producing the same are provided. The biaxially stretched polyester film includes a polyester resin base layer and a matte layer formed on the polyester resin base layer. The matte layer has a total weight of 100 wt %, and the matte layer includes: (1) 50 to 95 wt % of a polyester resin matrix, an intrinsic viscosity of the polyester resin matrix being between 0.5 and 0.8 dL/g; (2) 0.01 to 5 wt % of a high viscosity polyester resin, an intrinsic viscosity of the high viscosity polyester resin being between 0.9 and 1.1 dL/g; (3) 0.3 to 40 wt % of a plurality of filler particles, the filler particles having an average particle size of between 0.15 and 10 μm.

公开(公告)号：US11008451B2

公开(公告)日：2021-05-18

申请号：US16202165

申请日：2018-11-28

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Ying-Te Huang ,  Chih-Kai Chang ,  Hung-Yi Chang ,  Hao-Sheng Chen ,  Chia-Lin Liu

IPC: C08L27/18 ,  C08J5/24 ,  H05K1/03 ,  H05K1/02

Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.

公开(公告)号：US09663617B2

公开(公告)日：2017-05-30

申请号：US14958065

申请日：2015-12-03

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Dein-Run Fung ,  Cheng-Li Chao ,  Hao-Sheng Chen ,  Yung-Sheng Wang

IPC: C08G73/12

CPC classification number: C08G73/128 ,  C08G73/121 ,  C08G73/123 ,  C08G73/126 ,  C08G73/127

Abstract: A modified bismaleimide resin is made by modify bismaleimide with aromatic diamine that contains fluoro substituents through chain-growth polymerization; and modified bismaleimide resin is excellent in physical properties including a low dielectric constant Dk (3 GHz) less than 3.0, a dissipation factors (3 GHz) less than 0.02, a low resin water absorptivity ranging from 0.21% to 0.33% and an excellent processability, and is particularly suited for producing a copper clad laminate that is required to have dielectric constant Dk (3 GHz) less than 3.