公开(公告)号：US20200073074A1

公开(公告)日：2020-03-05

申请号：US16558275

申请日：2019-09-02

Applicant: NICHIA CORPORATION

Inventor： Tomohisa KISHIMOTO ,  Tsuyoshi OKAHISA ,  Toshiyuki FUJII

IPC: G02B7/02 ,  B29D11/00 ,  G02B7/00

Abstract: A lens includes a cover part and a light-shielding part. The cover part includes a lens part, a connection part extending downward from lateral sides of the lens part, and one or more flange parts each extending outward from a lower-end portion of the connection part. The lens part and the connection part define a recess having an opening facing downward. The flange parts extend outward from a periphery of the opening of the recess. The lens part, the flange parts, and the connection part are formed of a thermosetting first resin and continuous to one another. The light-shielding part covers outer lateral surface of the connection part and is formed of a thermosetting second resin having a greater light-absorptance or a greater light-reflectance than the thermosetting first resin. The flange parts have a greater thickness than the connection part.

公开(公告)号：US20190103531A1

公开(公告)日：2019-04-04

申请号：US16209339

申请日：2018-12-04

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Tomohisa KISHIMOTO

IPC: H01L33/60 ,  H01L33/48

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for manufacturing a package includes molding a precursor of a package including a cup-shaped resin component having a bottom surface and side walls, an opening opened at am upper part of the side walls, and a pair of leads exposed on the bottom surface. The side walls include a side wall that extends along the Y axis and the X axis and that has a first outer surface, and a side wall that extends along the Y axis and the Z axis. A thickness of the side wall extending along Y axis and the X axis is less than a thickness of the side wall extending along axis and the Z axis, The first outer surface has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening. The method further includes forming a reflective film in the recess.

公开(公告)号：US20180033823A1

公开(公告)日：2018-02-01

申请号：US15658397

申请日：2017-07-25

Applicant: NICHIA CORPORATION

Inventor： Masaki HAYASHI ,  Tomohisa KISHIMOTO

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/32 ,  H01L33/58

CPC classification number: H01L27/156 ,  H01L33/32 ,  H01L33/502 ,  H01L33/58

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a third light emitting element, a fluorescent material, a film, a first lens, a second lens, and a third lens. The first light emitting element is to emit a first light having a peak wavelength in a range from 440 nm to 485 nm. The second light emitting element is to emit a second light having a peak wavelength in a range from 495 nm to 573 nm. The third light emitting element is configured to emit from a third front surface a third light having a peak wavelength in a range from 440 nm to 485 nm. The fluorescent material is provided on the third front surface and has a fluorescent side surface extending along a front-rear direction. The film is provided to surround the side surface and the fluorescent side surface.

公开(公告)号：US20180175253A1

公开(公告)日：2018-06-21

申请号：US15896856

申请日：2018-02-14

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/64 ,  H01L23/00

CPC classification number: H01L33/486 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus.The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

公开(公告)号：US20170229615A1

公开(公告)日：2017-08-10

申请号：US15466268

申请日：2017-03-22

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus.The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

公开(公告)号：US20170170367A1

公开(公告)日：2017-06-15

申请号：US15373345

申请日：2016-12-08

Applicant: NICHIA CORPORATION

Inventor： Mayumi FUKUDA ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  B29C33/12 ,  B29C41/00 ,  B29C45/14065 ,  B29C45/14655 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method for manufacturing a package includes the steps of; preparing a lead frame having a frame, a first electrode, a second electrode, a first connecting portion connecting the frame and the first electrode, and a second connecting portion connecting the frame and the second electrode; placing the lead frame in a mold; injecting a first resin into the mold from an inlet of the mold located adjacent to the first electrode to mold a flange portion and a wall portion of the package; and cutting the lead frame and a part of the flange portion located adjacent to the first electrode. In the step of injecting the first resin, the mold and the lead frame together provide a hollow space into which the first resin is injected and in which a part of the flange portion is formed so as to have a thickness different from a thickness of the lead frame.

公开(公告)号：US20170170366A1

公开(公告)日：2017-06-15

申请号：US15371214

申请日：2016-12-07

Applicant: NICHIA CORPORATION

Inventor： Mayumi FUKUDA ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/495 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L23/49575 ,  H01L33/56 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A method for manufacturing a package includes a step of injecting a first resin through an injection port of a dies in which a lead frame has been placed. The method includes a step of cutting out a portion of a border between a first electrode and a first connection portion running through a first through hole, and cutting out a portion of a border between a second electrode and a second connection portion running through a second through hole after molding the first resin. The method includes a step of electroplating the first and second electrodes. The method includes a step of cutting out a remaining portion of the border between the first electrode and the first connection portion, and cutting out a remaining portion of the border between the second electrode and the second connection portion.

公开(公告)号：US20170030549A1

公开(公告)日：2017-02-02

申请号：US15220397

申请日：2016-07-27

Applicant: NICHIA CORPORATION

Inventor： Kazuhiro KAMADA ,  Yusaku ACHI ,  Tomohisa KISHIMOTO ,  Satoshi YOSHINAGA

IPC: F21V5/00 ,  G02F1/1335 ,  G02B3/00 ,  F21V9/16 ,  G02B5/04

CPC classification number: G02F1/133611 ,  F21V7/0083 ,  G02B3/0062 ,  G02B5/045 ,  G02F1/133603 ,  G02F1/133606 ,  G02F2001/133607

Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface.

Abstract translation: 底座有一个基面。 发光元件沿着X轴以X间距设置在基面上，并且沿着Y轴以Y间距设置以形成矩阵。 X间距小于Y间距。 镜头具有蝙蝠照明分布。 每个透镜覆盖每个发光元件。 第一双凸透镜片设置在基座上，使得第一双凸透镜片下表面与基面相对。 第二双凸透镜片设置在第一双凸透镜片上，使得第二双凸透镜片下表面与第一双凸透镜片上表面相对。

公开(公告)号：US20130249127A1

公开(公告)日：2013-09-26

申请号：US13893924

申请日：2013-05-14

Applicant: Nichia Corporation

Inventor： Masaki HAYASHI ,  Hiroto TAMAKI ,  Masafumi KURAMOTO ,  Tomohide MIKI ,  Takayuki SANO ,  Tomohisa KISHIMOTO

IPC: B29D11/00

CPC classification number: B29C45/02 ,  B29C45/2806 ,  B29D11/0074 ,  B29K2063/00 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  Y10T428/31511 ,  H01L2924/00012

Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.

Abstract translation: 发光装置在模制部件上包括发光元件。 模制部件通过模制和固化热固性环氧树脂组合物而形成，该热固性环氧树脂组合物包含（A）三嗪衍生的环氧树脂与酸酐的反应产物，（B）具有m.p。的内分离剂。 50-90℃，（C）反射剂，（D）无机填料和（E）固化催化剂。

公开(公告)号：US20230076561A1

公开(公告)日：2023-03-09

申请号：US17984202

申请日：2022-11-09

Applicant: NICHIA CORPORATION

Inventor： Tsuyoshi OKAHISA ,  Toshiyuki FUJII ,  Tomohisa KISHIMOTO

IPC: G02B7/02 ,  B29D11/00 ,  H01L33/58 ,  G02B7/00

Abstract: A method of manufacturing a lens including forming a cover blank having cover parts by injecting a thermosetting first resin in a first mold and curing the thermosetting first resin, removing a part or all parts of the first mold, and arranging the cover blank in a second mold. The method further includes forming a lens blank having a light-shielding part between adjacent cover parts by injecting a thermosetting second resin having a greater light absorptance or light reflectance than the thermosetting first resin into the second mold and curing the thermosetting second resin, and obtaining individual lenses by taking out the lens blank from the second mold, and cutting the lens blank at the light-shielding part located between adjacent cover parts to obtain individual lenses each with lateral end surfaces and an upper surface of each of flange parts and lateral side walls covered by the light-shielding part.