公开(公告)号：US06538308B1

公开(公告)日：2003-03-25

申请号：US09351458

申请日：1999-07-12

申请人： Yoshimi Nakase ,  Takanori Teshima ,  Yukinori Migitaka

发明人： Yoshimi Nakase ,  Takanori Teshima ,  Yukinori Migitaka

IPC分类号： H01L23495

CPC分类号： H01L23/42 ,  H01L23/4338 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor element, and a pair of insulation substrates sandwiching the semiconductor element therebetween forms a substrate unit. The substrate unit is press-fitted in a recess provided between first radiation block and cooling block. The press-fitting of the substrate unit is performed by a second radiation block which is screwed to push the first radiation block toward the cooling block. A high thermal-conductive radiation material is disposed at the interfaces between each of the insulation substrates and each of the blocks to keep adhesiveness therebetween.

摘要翻译： 半导体元件和夹在其间的半导体元件的一对绝缘基板形成基板单元。 衬底单元被压配合在设置在第一辐射块和冷却块之间的凹部中。 衬底单元的压配是通过第二辐射块进行的，该第二辐射块被拧紧以将第一辐射块推向冷却块。 在每个绝缘基板和每个块之间的界面处设置有高导热辐射材料以保持它们之间的粘合性。

公开(公告)号：US06693350B2

公开(公告)日：2004-02-17

申请号：US10321365

申请日：2002-12-18

申请人： Takanori Teshima ,  Yutaka Fukuda ,  Yoshimi Nakase ,  Kuniaki Mamitsu ,  Tomoatsu Makino

发明人： Takanori Teshima ,  Yutaka Fukuda ,  Yoshimi Nakase ,  Kuniaki Mamitsu ,  Tomoatsu Makino

IPC分类号： H01L2334

CPC分类号： H01L24/33 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a first conductive member, a second conductive member, a semiconductor chip, which is located between the conductive members, a bonding member, which is located between the first conductive member and the semiconductor chip, another bonding member, which is located between the second conductive member and the semiconductor chip, a molding resin, which is located between the first and second conductive members to seal the semiconductor chip, and a bonding member anti-sticking means, which is located between the molding resin and a surface of one member selected from the group consisting of the semiconductor chip and the conductive members. The bonding member anti-sticking means prevents the bonding members from sticking to the surface in the manufacturing process. As a result, the otherwise insufficient connection due to the sticking between the molding resin and the surface is improved, and the semiconductor device becomes durable in electric performance.

摘要翻译： 半导体器件包括第一导电构件，第二导电构件，位于导电构件之间的半导体芯片，位于第一导电构件和半导体芯片之间的接合构件，位于 在第二导电构件和半导体芯片之间，位于第一导电构件和第二导电构件之间以密封半导体芯片的模制树脂以及位于模制树脂和表面之间的接合构件防粘装置 选自由半导体芯片和导电构件组成的组中的一个构件。 接合构件防粘装置在制造过程中防止接合构件粘附到表面。 结果，由于模塑树脂和表面之间的粘附而导致的不充分的连接得到改善，并且半导体器件在电气性能方面变得耐用。

公开(公告)号：US07019395B2

公开(公告)日：2006-03-28

申请号：US10802720

申请日：2004-03-18

申请人： Naohiko Hirano ,  Takanori Teshima

发明人： Naohiko Hirano ,  Takanori Teshima

IPC分类号： H01L23/34

CPC分类号： H01L23/4338 ,  H01L23/473 ,  H01L2224/32245 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor module includes a fixed type and transformable type coolers and a flat semiconductor package sandwiched between the coolers. A relative positional relationship of the semiconductor package is fixed with the fixed type cooler, but variable with the transformable type cooler. The transformable type cooler includes a transformable member of a metal thin plate covering a coolant chamber. The semiconductor module includes a sandwiching mechanism causing the fixed type cooler to be pressed toward the transformable type cooler. Fastening adjustment screws of the sandwiching mechanism causes a pressing frame to approach a cooler body of the transformable type cooler. Therefore, the semiconductor package is pressed via the fixed type cooler while the transformable member is slightly transformed. This enhances a degree of contact between the semiconductor package and transformable member via an insulating member.

摘要翻译： 半导体模块包括固定型和可变形型冷却器以及夹在冷却器之间的扁平半导体封装。 半导体封装的相对位置关系用固定式冷却器固定，但是可变形冷却器可变。 可变形型冷却器包括覆盖冷却剂室的金属薄板的可变形构件。 半导体模块包括使固定式冷却器朝向可变形型冷却器按压的夹持机构。 夹紧机构的紧固调节螺钉使得压框接近可变形式冷却器的较冷体。 因此，通过固定式冷却器对半导体封装进行压制，而可变形构件稍微变形。 这通过绝缘构件增强了半导体封装和可变形构件之间的接触程度。

公开(公告)号：US20050073042A1

公开(公告)日：2005-04-07

申请号：US10802720

申请日：2004-03-18

申请人： Naohiko Hirano ,  Takanori Teshima

发明人： Naohiko Hirano ,  Takanori Teshima

IPC分类号： H01L23/40 ,  H01L23/433 ,  H01L23/473 ,  H01L23/34

CPC分类号： H01L23/4338 ,  H01L23/473 ,  H01L2224/32245 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor module includes a fixed type and transformable type coolers and a flat semiconductor package sandwiched between the coolers. A relative positional relationship of the semiconductor package is fixed with the fixed type cooler, but variable with the transformable type cooler. The transformable type cooler includes a transformable member of a metal thin plate covering a coolant chamber. The semiconductor module includes a sandwiching mechanism causing the fixed type cooler to be pressed toward the transformable type cooler. Fastening adjustment screws of the sandwiching mechanism causes a pressing frame to approach a cooler body of the transformable type cooler. Therefore, the semiconductor package is pressed via the fixed type cooler while the transformable member is slightly transformed. This enhances a degree of contact between the semiconductor package and transformable member via an insulating member.

摘要翻译： 半导体模块包括固定型和可变形型冷却器以及夹在冷却器之间的扁平半导体封装。 半导体封装的相对位置关系用固定式冷却器固定，但是可变形冷却器是可变的。 可变形型冷却器包括覆盖冷却剂室的金属薄板的可变形构件。 半导体模块包括使固定式冷却器朝向可变形型冷却器按压的夹持机构。 夹紧机构的紧固调节螺钉使得压框接近可变形式冷却器的较冷体。 因此，通过固定式冷却器对半导体封装进行压制，而可变形构件稍微变形。 这通过绝缘构件增强了半导体封装和可变形构件之间的接触程度。

公开(公告)号：US06384431B1

公开(公告)日：2002-05-07

申请号：US09680538

申请日：2000-10-06

申请人： Shigeki Takahashi ,  Takanori Teshima ,  Naohiko Hirano ,  Norihito Tokura

发明人： Shigeki Takahashi ,  Takanori Teshima ,  Naohiko Hirano ,  Norihito Tokura

IPC分类号： H01L2974

CPC分类号： H01L29/1095 ,  H01L29/7395

摘要： Insulated gate bipolar transistors which can restrain causing surge voltage due to an inductance component while an L-load is turned off and can improve a negative characteristic of a sustain voltage during breakdown. An insulated gate bipolar transistor (IGBT) is provided with: a p+-type semiconductor substrate; an n+-type buffer layer having high impurity concentration; an n-type intermediate layer; and an n−-type base layer having low impurity concentration. A p-type well layer and an n+-type emitter layer having high impurity concentration are formed in the n−-type base layer. The n-type intermediate layer has an intermediate impurity concentration between an impurity concentration of the n+-type buffer layer and that of the n−-type base layer. Thickness of the intermediate layer is determined so that the depletion layer does not reach the n+-type buffer layer even when the switching operation of the L-load is turned off. As a result, it can restrain causing surge voltage and can improve a negative characteristic of a sustain voltage.

摘要翻译： 绝缘栅双极晶体管，其可以抑制由于电感分量引起的浪涌电压，同时L负载关断，并且可以在击穿期间改善维持电压的负特性。 绝缘栅双极晶体管（IGBT）具有：p +型半导体衬底; 具有高杂质浓度的n +型缓冲层; n型中间层; 以及杂质浓度低的n型基底层。 在n型基底层中形成具有高杂质浓度的p型阱层和n +型发射极层。 n型中间层在n +型缓冲层的杂质浓度与n型基底层的杂质浓度之间具有中间杂质浓度。 确定中间层的厚度，即使当L负载的切换操作被关闭时，耗尽层也不会到达n +型缓冲层。 结果，能够抑制浪涌电压，能够提高维持电压的负特性。

公开(公告)号：US10079226B2

公开(公告)日：2018-09-18

申请号：US13357690

申请日：2012-01-25

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： H01L23/36 ,  H01L25/11 ,  H01L23/473 ,  H05K7/20 ,  H01L23/40

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

公开(公告)号：US20120119347A1

公开(公告)日：2012-05-17

申请号：US13357690

申请日：2012-01-25

申请人： Kuniaki MAMITSU ,  Takanori Teshima

发明人： Kuniaki MAMITSU ,  Takanori Teshima

IPC分类号： H01L23/36

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

摘要翻译： 半导体器件至少包括半导体模块，该半导体模块包括半导体芯片，与半导体芯片热连接的散热器和用于将半导体芯片和散热片覆盖和密封的密封构件，以暴露热辐射表面 散热器。 辐射表面由制冷剂冷却。 在密封构件的一部分上形成有制冷剂流过制冷剂路径的开口。

公开(公告)号：US4418311A

公开(公告)日：1983-11-29

申请号：US338056

申请日：1982-01-08

申请人： Koshi Torii ,  Toshinori Maruyama ,  Yoshio Akita ,  Takanori Teshima

发明人： Koshi Torii ,  Toshinori Maruyama ,  Yoshio Akita ,  Takanori Teshima

IPC分类号： H02J7/14 ,  H02J7/16 ,  H02J7/24

CPC分类号： H02J7/166 ,  H02J7/1461

摘要： In a battery charge indicating system, there are provided detecting means of an npn-transistor for detecting a closed condition of an ignition switch, and switching means of a pnp-transistor for supplying a base current to a driving transistor in response to an output of the detecting means, so that the driving transistor is made conductive when the ignition switch is closed and a generator is not generating its output. The emitter of the pnp-transistor is connected to a battery not through a current supply terminal for a voltage regulator, whereby even when the current supply terminal is accidentally disconnected from the regulator, the driving transistor is made conductive so that an indicating lamp is activated to indicate that the generator is not in the operation condition.

摘要翻译： 在电池充电指示系统中，提供了用于检测点火开关的闭合状态的npn晶体管的检测装置，以及用于响应于输出的输出向驱动晶体管提供基极电流的pnp晶体管的开关装置 检测装置，使得当点火开关闭合并且发电机不产生其输出时，驱动晶体管导通。 pnp晶体管的发射极不通过用于电压调节器的电流源端子而连接到电池，由此即使当电流供应端子与调节器意外断开时，驱动晶体管导通，使得指示灯被激活 以指示发电机不处于运行状态。

公开(公告)号：US20060096299A1

公开(公告)日：2006-05-11

申请号：US11262764

申请日：2005-11-01

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： F25B21/02 ,  H01L35/28

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

摘要翻译： 半导体器件至少包括半导体模块，该半导体模块包括半导体芯片，与半导体芯片热连接的散热器和用于将半导体芯片和散热片覆盖和密封的密封构件，以暴露热辐射表面 散热器。 辐射表面由制冷剂冷却。 在密封构件的一部分上形成有制冷剂流过制冷剂路径的开口。

公开(公告)号：US06946730B2

公开(公告)日：2005-09-20

申请号：US10787164

申请日：2004-02-27

申请人： Takanori Teshima

发明人： Takanori Teshima

IPC分类号： B29C45/14 ,  B29L31/34 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/433 ,  H01L23/48 ,  H01L23/36 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L24/33 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating sheets, and a mold resin covering the chip, the heat sinks, and the sheets such that the sheets are exposed from the surface of the resin. The mold resin is prevented from covering the outer surfaces of the heat sinks, which are pressed by mold parts, and breakage of the chip is avoided during molding. The plates are insulated by the sheets, so no dedicated insulating sheets for the heat sinks are needed after the device is completed.

摘要翻译： 半导体器件包括产生热的半导体芯片，一对彼此面对的散热片，以从芯片的两个表面，一对可压缩绝缘片和覆盖芯片的模具树脂，散热片， 并且片材使得片材从树脂的表面露出。 防止模制树脂覆盖被模具部件挤压的散热器的外表面，并且在模制期间避免了芯片的断裂。 这些板被片材绝缘，因此在器件完成后，不需要用于散热器的专用绝缘片。