公开(公告)号：US10079226B2

公开(公告)日：2018-09-18

申请号：US13357690

申请日：2012-01-25

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： H01L23/36 ,  H01L25/11 ,  H01L23/473 ,  H05K7/20 ,  H01L23/40

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

公开(公告)号：US20120119347A1

公开(公告)日：2012-05-17

申请号：US13357690

申请日：2012-01-25

申请人： Kuniaki MAMITSU ,  Takanori Teshima

发明人： Kuniaki MAMITSU ,  Takanori Teshima

IPC分类号： H01L23/36

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

摘要翻译： 半导体器件至少包括半导体模块，该半导体模块包括半导体芯片，与半导体芯片热连接的散热器和用于将半导体芯片和散热片覆盖和密封的密封构件，以暴露热辐射表面 散热器。 辐射表面由制冷剂冷却。 在密封构件的一部分上形成有制冷剂流过制冷剂路径的开口。

公开(公告)号：US20060096299A1

公开(公告)日：2006-05-11

申请号：US11262764

申请日：2005-11-01

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： F25B21/02 ,  H01L35/28

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

摘要翻译： 半导体器件至少包括半导体模块，该半导体模块包括半导体芯片，与半导体芯片热连接的散热器和用于将半导体芯片和散热片覆盖和密封的密封构件，以暴露热辐射表面 散热器。 辐射表面由制冷剂冷却。 在密封构件的一部分上形成有制冷剂流过制冷剂路径的开口。

公开(公告)号：US08441122B2

公开(公告)日：2013-05-14

申请号：US12805733

申请日：2010-08-17

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

IPC分类号： H01L23/34

CPC分类号： H01L23/3192 ,  H01L23/4334 ,  H01L23/492 ,  H01L24/01 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/48491 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor device includes a first protection film for covering a first metal wiring. A second protection film is disposed on the first protection film, which is covered with a solder layer. Even if a crack is generated in the second protection film before the solder layer is formed on the second protection film, the crack is restricted from proceeding into the first protection film.

摘要翻译： 半导体器件包括用于覆盖第一金属布线的第一保护膜。 第一保护膜设置在第一保护膜上，该第一保护膜被焊料层覆盖。 即使在第二保护膜上形成焊料层之前，在第二保护膜中产生裂纹，限制裂纹进入第一保护膜。

公开(公告)号：US06693350B2

公开(公告)日：2004-02-17

申请号：US10321365

申请日：2002-12-18

申请人： Takanori Teshima ,  Yutaka Fukuda ,  Yoshimi Nakase ,  Kuniaki Mamitsu ,  Tomoatsu Makino

发明人： Takanori Teshima ,  Yutaka Fukuda ,  Yoshimi Nakase ,  Kuniaki Mamitsu ,  Tomoatsu Makino

IPC分类号： H01L2334

CPC分类号： H01L24/33 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a first conductive member, a second conductive member, a semiconductor chip, which is located between the conductive members, a bonding member, which is located between the first conductive member and the semiconductor chip, another bonding member, which is located between the second conductive member and the semiconductor chip, a molding resin, which is located between the first and second conductive members to seal the semiconductor chip, and a bonding member anti-sticking means, which is located between the molding resin and a surface of one member selected from the group consisting of the semiconductor chip and the conductive members. The bonding member anti-sticking means prevents the bonding members from sticking to the surface in the manufacturing process. As a result, the otherwise insufficient connection due to the sticking between the molding resin and the surface is improved, and the semiconductor device becomes durable in electric performance.

摘要翻译： 半导体器件包括第一导电构件，第二导电构件，位于导电构件之间的半导体芯片，位于第一导电构件和半导体芯片之间的接合构件，位于 在第二导电构件和半导体芯片之间，位于第一导电构件和第二导电构件之间以密封半导体芯片的模制树脂以及位于模制树脂和表面之间的接合构件防粘装置 选自由半导体芯片和导电构件组成的组中的一个构件。 接合构件防粘装置在制造过程中防止接合构件粘附到表面。 结果，由于模塑树脂和表面之间的粘附而导致的不充分的连接得到改善，并且半导体器件在电气性能方面变得耐用。

公开(公告)号：US08963315B2

公开(公告)日：2015-02-24

申请号：US13019390

申请日：2011-02-02

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L23/12 ,  H01L23/053 ,  H01L23/10 ,  H01L23/34 ,  H01L29/40 ,  H01L23/28 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L21/56 ,  H01L23/48 ,  H01L24/96 ,  H01L2224/04026 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73219 ,  H01L2224/73267 ,  H01L2224/73269 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a back-surface electrode on its back surface. The resin member encapsulates the semiconductor element. The front-surface electrode is exposed to a front side of an outer surface of the resin member. The back-surface electrode is exposed to a back side of the outer surface of the resin member. The resin member has an extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element.

摘要翻译： 半导体器件包括板状半导体元件和电绝缘树脂构件。 半导体元件在其前表面具有前表面电极，在其后表面具有背表面电极。 树脂部件封装半导体元件。 前表面电极暴露于树脂构件的外表面的前侧。 背面电极暴露于树脂构件的外表面的背面。 树脂构件具有覆盖半导体元件的整个侧表面的延伸部分，并且在与半导体元件的前表面平行的方向上从半导体元件的侧表面延伸。

公开(公告)号：US08125781B2

公开(公告)日：2012-02-28

申请号：US11262764

申请日：2005-11-01

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： H05K7/20

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

摘要翻译： 半导体器件至少包括半导体模块，该半导体模块包括半导体芯片，与半导体芯片热连接的散热器和用于将半导体芯片和散热片覆盖和密封的密封构件，以暴露热辐射表面 散热器。 辐射表面由制冷剂冷却。 在密封构件的一部分上形成有制冷剂流过制冷剂路径的开口。

公开(公告)号：US20110186981A1

公开(公告)日：2011-08-04

申请号：US13019390

申请日：2011-02-02

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L23/48 ,  H01L24/96 ,  H01L2224/04026 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73219 ,  H01L2224/73267 ,  H01L2224/73269 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a back-surface electrode on its back surface. The resin member encapsulates the semiconductor element. The front-surface electrode is exposed to a front side of an outer surface of the resin member. The back-surface electrode is exposed to a back side of the outer surface of the resin member. The resin member has an extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element.

摘要翻译： 半导体器件包括板状半导体元件和电绝缘树脂构件。 半导体元件在其前表面具有前表面电极，在其后表面具有背表面电极。 树脂部件封装半导体元件。 前表面电极暴露于树脂构件的外表面的前侧。 背面电极暴露于树脂构件的外表面的背面。 树脂构件具有覆盖半导体元件的整个侧表面的延伸部分，并且在与半导体元件的前表面平行的方向上从半导体元件的侧表面延伸。

公开(公告)号：US07944045B2

公开(公告)日：2011-05-17

申请号：US12397640

申请日：2009-03-04

申请人： Chikage Noritake ,  Takanori Teshima ,  Kuniaki Mamitsu

发明人： Chikage Noritake ,  Takanori Teshima ,  Kuniaki Mamitsu

IPC分类号： H01L23/34 ,  H01L23/495 ,  H01L23/10 ,  H01L23/28

CPC分类号： H01L23/473 ,  H01L23/051 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module and a method of manufacturing the same are disclosed including a semiconductor element having an electrode, a heat radiation plate placed in thermal contact with a main surface of the semiconductor element and electrically connected to the electrode thereof, an insulation body directly formed on an outside surface of the heat radiation plate, a metallic body directly formed on an outside surface of the insulation body and having a thickness lower than that of the insulation body, and a mold resin unitarily molding the heat radiation plate, the semiconductor element and the insulation body. The insulation body is covered with the metallic body and the mold resin and the metallic body has an outside surface exposed to an outside of the mold resin.

摘要翻译： 公开了一种半导体模块及其制造方法，其包括具有电极的半导体元件，与半导体元件的主表面热接触并与其电极电连接的散热板，绝缘体直接形成在 散热板的外表面，直接形成在绝缘体的外表面上并且具有比绝缘体低的厚度的金属体，以及模制树脂，将散热板，半导体元件和 绝缘体。 绝缘体被金属体和模制树脂覆盖，并且金属体具有暴露于模制树脂外部的外表面。

公开(公告)号：US20110042741A1

公开(公告)日：2011-02-24

申请号：US12805733

申请日：2010-08-17

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Manabu Tomisaka ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Manabu Tomisaka ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

IPC分类号： H01L29/772 ,  H01L23/498

CPC分类号： H01L23/3192 ,  H01L23/4334 ,  H01L23/492 ,  H01L24/01 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/48491 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor device includes a first protection film for covering a first metal wiring. A second protection film is disposed on the first protection film, which is covered with a solder layer. Even if a crack is generated in the second protection film before the solder layer is formed on the second protection film, the crack is restricted from proceeding into the first protection film.

摘要翻译： 半导体器件包括用于覆盖第一金属布线的第一保护膜。 第一保护膜设置在第一保护膜上，该第一保护膜被焊料层覆盖。 即使在第二保护膜上形成焊料层之前，在第二保护膜中产生裂纹，限制裂纹进入第一保护膜。