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    Method for producing at least one optoelectronic component, and optoelectronic component
    13.
    发明授权
    Method for producing at least one optoelectronic component, and optoelectronic component 有权

    公开(公告)号：US10950765B2

    公开(公告)日：2021-03-16

    申请号：US16491146

    申请日：2018-03-06

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Pindl ,  Markus Burger ,  Markus Boss ,  Matthias Lermer

    IPC: H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/00

    Abstract: A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.

    White light source and method of producing a white light source
    15.
    发明授权
    White light source and method of producing a white light source 有权

    公开(公告)号：US10910353B2

    公开(公告)日：2021-02-02

    申请号：US16469728

    申请日：2017-12-14

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Burger ,  Désirée Queren

    IPC: H01L25/075 ,  H01L33/50

    Abstract: A white light source includes an arrangement of light-emitting diodes, wherein the light-emitting diodes are subdivided into first light-emitting diodes and second light-emitting diodes, and a conversion element configured to absorb light emitted by the light-emitting diodes and generate converted light with a longer wavelength than the emitted light, wherein the conversion element includes a first luminescent conversion material in a first matrix material, the first matrix material with the first luminescent conversion material is arranged two-dimensionally in a continuous layer above the first and second light-emitting diodes, the conversion element includes a second luminescent conversion material in a second matrix material, and the second matrix material with the second luminescent conversion material is arranged only above the second light-emitting diodes.

    METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT
    18.
    发明申请
    METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT 有权
    生产光电组件的方法

    公开(公告)号：US20160163932A1

    公开(公告)日：2016-06-09

    申请号：US14902105

    申请日：2014-07-03

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Martin Brandl ,  Markus Burger

    IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

    CPC classification number: H01L33/505 ,  H01L33/005 ,  H01L33/486 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a mask layer arranged on an upper side of the optoelectronic semiconductor chip; providing a carrier having walls arranged on a surface of the carrier, the walls laterally limiting a receiving region; arranging an optoelectronic semiconductor chip in the receiving region, wherein a bottom side of the optoelectronic semiconductor chip faces the surface of the carrier; filling a region of the receiving region surrounding the optoelectronic semiconductor chip with an optically reflective material up to a height that lies between the upper side of the optoelectronic semiconductor chip and an upper side of the mask layer; removing the mask layer to create a free space in the optically reflective material; and introducing a wavelength-converting material into the free space.

    Abstract translation: 制造光电子部件的方法包括提供具有布置在所述光电子半导体芯片的上侧的掩模层的光电子半导体芯片; 提供具有布置在所述载体的表面上的壁的载体，所述壁横向限制接收区域; 在接收区域中布置光电子半导体芯片，其中所述光电半导体芯片的底侧面向所述载体的表面; 用光反射材料填充围绕光电子半导体芯片的接收区域的区域，直到光电半导体芯片的上侧和掩模层的上侧之间的高度为止; 去除掩模层以在光学反射材料中产生自由空间; 并将波长转换材料引入自由空间。

    METHOD OF PRODUCING A CONVERSION ELEMENT
    19.
    发明申请
    METHOD OF PRODUCING A CONVERSION ELEMENT 有权
    生产转换元件的方法

    公开(公告)号：US20160133802A1

    公开(公告)日：2016-05-12

    申请号：US14896950

    申请日：2014-06-06

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Markus Richter ,  Markus Burger

    IPC: H01L33/50

    CPC classification number: H01L33/505 ,  B05D1/32 ,  B05D1/322 ,  B05D3/02 ,  H01L33/50 ,  H01L2933/0041

    Abstract: A method of producing a conversion element includes providing a substrate having a surface; forming a first mask structure above the surface, wherein the first mask structure has first webs and first openings arranged between the first webs and the first openings form cavities in which the surface of the substrate is accessible; arranging a second mask structure above the first mask structure, wherein the second mask structure has second webs and second openings arranged between the second webs, the first webs are at least partly covered by the second webs, and the cavities remain at least partly accessible through the second openings; spraying a material into the cavities through the second openings; removing the second mask structure; and removing the first mask structure.

    Abstract translation: 制造转换元件的方法包括提供具有表面的基板; 在所述表面上形成第一掩模结构，其中所述第一掩模结构具有第一腹板，并且布置在所述第一腹板和所述第一开口之间的第一开口形成空腔，所述基底的表面可接近; 在所述第一掩模结构之上布置第二掩模结构，其中所述第二掩模结构具有布置在所述第二网之间的第二腹板和第二开口，所述第一腹板至少部分地被所述第二腹板覆盖，并且所述腔保持至少部分地通过 第二个开口; 通过第二开口将材料喷射到空腔中; 去除第二掩模结构; 并移除第一掩模结构。

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