公开(公告)号：US12018806B2

公开(公告)日：2024-06-25

申请号：US17768698

申请日：2020-12-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Clemens Hofmann ,  Daniel Richter

IPC: F21S41/148 ,  F21S41/151 ,  F21S41/19 ,  F21S45/47 ,  F21Y107/90

CPC classification number: F21S41/192 ,  F21S41/148 ,  F21S41/151 ,  F21S45/47 ,  F21Y2107/90

Abstract: The disclosure relates to a halogen lamp replacement, in particular for car headlights, having a carrier plate which is covered on both main surfaces by structured electrically conductive layers, to which at least one respective light-emitting component, in particular at least one respective light-emitting-diode chip, is attached, the carrier plate being designed to dissipate heat generated by the light-emitting components to a heat sink formed by a coupling structure.

公开(公告)号：US20190341532A1

公开(公告)日：2019-11-07

申请号：US16398889

申请日：2019-04-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Alexander Baumgartner ,  Ion Stoll

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: The optoelectronic device including a radiation emitting semiconductor chip emitting electromagnetic radiation of a first wavelength range from a radiation exit surface, and a conversion element converting electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range at least partially and emitting electromagnetic radiation from a light coupling-out surface, wherein the light coupling-out surface of the conversion element is smaller than the radiation exit surface of the semiconductor chip.

公开(公告)号：US20170317233A1

公开(公告)日：2017-11-02

申请号：US15649987

申请日：2017-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christian Gatzhammer ,  Martin Brandl ,  Tobias Gebuhr

IPC: H01L33/10 ,  H05K1/11 ,  H01L33/00

CPC classification number: H01L33/105 ,  H01L33/005 ,  H01L33/486 ,  H01L33/62 ,  H05K1/111

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including first and second electrical contacts, a first leadframe section including a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad, and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, the first and second leadframe sections are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible at an underside, and a solder stop element is arranged at the underside of the housing, the solder stop element extending between the first soldering contact pad and the second soldering contact pad.

公开(公告)号：US20150214446A1

公开(公告)日：2015-07-30

申请号：US14410956

申请日：2013-06-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Boss ,  Markus Pindl ,  Tobias Gebuhr ,  Simon Jerebic ,  Martin Brandl

IPC: H01L33/54 ,  H01L33/62 ,  H01L21/56 ,  H01L23/498 ,  H01L21/78 ,  H01L33/58 ,  H01L23/29

CPC classification number: H01L33/54 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/49811 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2924/00014

Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

Abstract translation: 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。

公开(公告)号：US10937933B2

公开(公告)日：2021-03-02

申请号：US16490944

申请日：2018-03-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Markus Pindl

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/58 ,  H01L33/56 ,  H01L33/62

Abstract: A light-emitting component includes a light-emitting element and a housing with a cavity. The housing includes a housing material that absorbs at least 80 percent of light in the visible range. The cavity is formed by a limiting wall, formed by a housing surface, and a plane of the element. The light-emitting element arranged within the cavity of the housing and positioned above the element plane includes an emission side located opposite to the element plane. The cavity is at least partially filled with a transparent material composed of a first material and a second material, wherein the first material at least partially covers the limiting wall, and the second material at least partially covers the emission side. A boundary surface is formed between the first material and the second material. A first refractive index of the first material is smaller than a second refractive index of the second material.

公开(公告)号：US20190027655A1

公开(公告)日：2019-01-24

申请号：US16037388

申请日：2018-07-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Martin Brandl

IPC: H01L33/50

Abstract: A method produces a plurality of conversion elements including: A) providing a first carrier; B) applying a first element to the first carrier using a first application technique, the first element including a conversion material, the first application technique being different from compression molding; C) applying a second element to the first carrier by a second application technique, the second element including quantum dots, the quantum dots being introduced into a matrix material and being different from the conversion material, the second application technique being molding or compression molding; D) hardening of the matrix material; E) optionally, rearranging the arrangement produced according to step D) to a second carrier; and F) separating so that a plurality of conversion elements are generated.

公开(公告)号：US20180166614A1

公开(公告)日：2018-06-14

申请号：US15571084

申请日：2016-05-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Richter ,  Martin Brandl ,  Markus Burger ,  Günter Spath

IPC: H01L33/50 ,  B29D11/00

CPC classification number: H01L33/505 ,  B29D11/00798 ,  B29K2083/00 ,  B29K2105/16 ,  G02B5/0242 ,  H01L33/507 ,  H01L33/56 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091

Abstract: A method of producing a converter component for an optoelectronic lighting apparatus includes forming a layer stack having an injection-molded or extruded conversion layer and an injection-molded or extruded diffuser layer. A converter component for an optoelectronic lighting apparatus includes a layer stack including an injection-molded or extruded conversion layer, and an injection-molded or extruded diffuser layer.

公开(公告)号：US20180005924A1

公开(公告)日：2018-01-04

申请号：US15541765

申请日：2016-01-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Tobias Gebuhr

IPC: H01L23/495 ,  H01L33/62 ,  H01L23/00 ,  H01L33/00 ,  H01L33/48 ,  H01L21/56

CPC classification number: H01L23/49544 ,  H01L21/561 ,  H01L23/49503 ,  H01L23/49562 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame used to produce a chip package includes a first lead frame section and a second lead frame section connected to one another by a bar, wherein the bar includes a first longitudinal section, a second longitudinal section and a third longitudinal section, the first longitudinal section adjoins the first lead frame section and the third longitudinal section adjoins the second lead frame section, the first longitudinal section and the third longitudinal section are oriented parallel to one another, the first longitudinal section and the second longitudinal section form an angle not equal to 180° and not equal to 90°, and the lead frame is planar.

公开(公告)号：US09748450B2

公开(公告)日：2017-08-29

申请号：US14902105

申请日：2014-07-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Markus Burger

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/00 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/505 ,  H01L33/005 ,  H01L33/486 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a mask layer arranged on an upper side of the optoelectronic semiconductor chip; providing a carrier having walls arranged on a surface of the carrier, the walls laterally limiting a receiving region; arranging an optoelectronic semiconductor chip in the receiving region, wherein a bottom side of the optoelectronic semiconductor chip faces the surface of the carrier; filling a region of the receiving region surrounding the optoelectronic semiconductor chip with an optically reflective material up to a height that lies between the upper side of the optoelectronic semiconductor chip and an upper side of the mask layer; removing the mask layer to create a free space in the optically reflective material; and introducing a wavelength-converting material into the free space.

公开(公告)号：US20150255313A1

公开(公告)日：2015-09-10

申请号：US14436578

申请日：2013-10-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Martin Brandl ,  Markus Boss ,  Markus Pindl ,  Simon Jerebic ,  Herbert Brunner ,  Tobias Gebuhr

IPC: H01L21/56 ,  H01L21/78

CPC classification number: H01L21/563 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.

Abstract translation: 公开了用于制造光电半导体器件的光电半导体器件和方法。 在一个实施例中，该方法包括在辅助载体上施加导电的第一和第二接触元件的多个布置，在每个布置的第二接触元件上施加光电子半导体芯片，并将光电子半导体芯片导电连接到第一接触元件 为每个安排。 该方法还包括用封装材料封装第一接触元件和第二接触元件以形成封装主体，并将封装主体分成多个光电子半导体器件，其中封装材料与下侧齐平，面向辅助载体 的每个第一接触元件，并且其中所述封装材料与每个第二接触元件的面向所述辅助载体的底面齐平。