公开(公告)号：US20150036406A1

公开(公告)日：2015-02-05

申请号：US14519967

申请日：2014-10-21

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/02

CPC classification number: G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

Abstract translation: 设置在矩形半导体板上的微型计算机具有存储器接口电路。 存储器接口电路分别设置在从作为基准位置的一个角部沿着半导体板的两侧的周边延伸的位置。 在这种情况下，与仅在一侧具有存储器接口电路的半导体板相比，可以减小对半导体板的尺寸减小的限制。 每个分离的存储器接口电路上的各个部分电路具有与数据和数据选通信号相关联的相等的数据单元。 因此，微型计算机在主板和模块板上简化了线路设计。

公开(公告)号：US20140160826A1

公开(公告)日：2014-06-12

申请号：US14182821

申请日：2014-02-18

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/02

CPC classification number: G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

Abstract translation: 设置在矩形半导体板上的微型计算机具有存储器接口电路。 存储器接口电路分别设置在从作为基准位置的一个角部沿着半导体板的两侧的周边延伸的位置。 在这种情况下，与仅在一侧具有存储器接口电路的半导体板相比，可以减小对半导体板的尺寸减小的限制。 每个分离的存储器接口电路上的各个部分电路具有与数据和数据选通信号相关联的相等的数据单元。 因此，微型计算机在主板和模块板上简化了线路设计。

公开(公告)号：US20180301172A1

公开(公告)日：2018-10-18

申请号：US16010770

申请日：2018-06-18

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/04 ,  G11C5/02

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

公开(公告)号：US20180261274A1

公开(公告)日：2018-09-13

申请号：US15975886

申请日：2018-05-10

Applicant: Renesas Electronics Corporation

Inventor： Motoo SUWA ,  Takafumi BETSUI

IPC: G11C11/4076 ,  H01L27/108 ,  H01L23/498

CPC classification number: G11C11/4076 ,  G11C5/063 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5386 ,  H01L27/108 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15192 ,  H01L2924/15311

Abstract: To provide an electronic device capable of improving a signal quality, the electronic device includes a semiconductor memory device, a semiconductor device configured to access data stored in the semiconductor memory device, and a wiring substrate on which the semiconductor memory device and the semiconductor device are mounted. The wiring substrate includes first and second data wirings electrically connecting the semiconductor device with each first and second data terminal of the semiconductor memory device through first and second wiring layers. The first wiring layer is a wiring layer arranged closer to the semiconductor device than the second wiring layer, and the first data terminal is located farther from the semiconductor device than the second data terminal.

公开(公告)号：US20180204827A1

公开(公告)日：2018-07-19

申请号：US15514110

申请日：2014-09-26

Applicant: Renesas Electronics Corporation

Inventor： Takafumi BETSUI ,  Motoo SUWA

IPC: H01L25/18 ,  H01L23/538 ,  H01L25/16 ,  H01L25/00 ,  H01L23/00 ,  H01L21/66 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L25/18 ,  G11C5/025 ,  H01L22/14 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/13007 ,  H01L2224/16014 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1713 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19102

Abstract: An electronic device includes a first wiring substrate and a semiconductor device mounted on the first wiring substrate. A plurality of first semiconductor chips and a second semiconductor chip which controls each of the plurality of first semiconductor chips are mounted side by side on a second wiring substrate of the semiconductor device. Further, the plurality of first semiconductor chips are mounted between a first substrate side of the wiring substrate and an extension line of a first chip side of the second semiconductor chip. Furthermore, the first wiring substrate includes a first power line which supplies a first power potential to each of the plurality of first semiconductor chips and a second power line which supplies a second power potential to the second semiconductor chip and has a width larger than that of the first power line. Also, the second power line intersects the first substrate side of the second wiring substrate and extends from a side of the first substrate side of the second wiring substrate toward the second semiconductor chip when seen in a plan view.

公开(公告)号：US20170062020A1

公开(公告)日：2017-03-02

申请号：US15351580

申请日：2016-11-15

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/04 ,  G11C5/06 ,  H01L25/18 ,  H01L23/00 ,  H05K1/18 ,  H01L23/498

CPC classification number: G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

公开(公告)号：US20150237731A1

公开(公告)日：2015-08-20

申请号：US14625440

申请日：2015-02-18

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Masahiro TOYAMA ,  Motoo SUWA

IPC: H05K1/18

CPC classification number: H05K1/0231 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/025 ,  H05K2201/10545 ,  H01L2924/00012

Abstract: To improve electric characteristics of an electronic device. An electronic device includes a semiconductor device and a three-terminal capacitor mounted on the upper surface of a mounting substrate, the semiconductor device includes a power supply pad and a ground pad, the power supply pad and the ground pad are electrically connected with a power supply land and a ground land, respectively, and the power supply land and the ground land are allocated to a land line in an outermost periphery of the semiconductor device, Then, the power supply land and the ground land are electrically connected to the three-terminal capacitor by wirings formed on the upper surface of the mounting substrate.

Abstract translation: 改善电子设备的电气特性。 电子设备包括安装在安装基板的上表面上的半导体器件和三端电容器，该半导体器件包括电源焊盘和接地焊盘，电源焊盘和接地焊盘与电源电连接 分别供给地面和陆地，将电力供给用地和地面用地分配给半导体装置的最外周的陆线，然后，将电源用地和地面电连接到三相电源， 端子电容器通过布线形成在安装基板的上表面上。