公开(公告)号：US20070263409A1

公开(公告)日：2007-11-15

申请号：US11430698

申请日：2006-05-09

申请人： Thye Mok

发明人： Thye Mok

IPC分类号： F21V7/04

CPC分类号： G02B6/0026 ,  G02B6/0068

摘要： A lighting system includes multiple lighting elements, a light guide, and a first selective wavelength reflective element for mixing light outside of the light guide. The lighting elements include a first lighting element having a first wavelength. The light guide receives light from the lighting elements. The first selective wavelength reflective element is positioned between the first lighting element and the light guide to partially transmit light of the first wavelength to the light guide, and to partially reflect light of the first wavelength. Partially reflecting light away from the light guide allows a fraction of the light to be mixed with another color of light prior to entering the light guide. By mixing multiple colors of light outside of the light guide in this manner, discoloration of the LCD panel may be limited or eliminated. Additionally, oversizing the diffusion panel may be limited or eliminated.

摘要翻译： 照明系统包括多个照明元件，光导和用于混合光导外部的光的第一选择性波长反射元件。 照明元件包括具有第一波长的第一照明元件。 光导件接收来自照明元件的光。 第一选择波长反射元件位于第一照明元件和光导之间，以将第一波长的光部分地透射到光导，并且部分地反射第一波长的光。 部分地将光从导光板反射出来允许一部分光在进入光导之前与另一种颜色的光混合。 通过以这种方式混合光导外部的多种颜色的光，可以限制或消除LCD面板的变色。 此外，可以限制或消除扩散面板的尺寸。

公开(公告)号：US20060226435A1

公开(公告)日：2006-10-12

申请号：US11104282

申请日：2005-04-12

申请人： Thye Mok ,  Ju Poh ,  Siew Pang

发明人： Thye Mok ,  Ju Poh ,  Siew Pang

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A light emitting device package and method for making the package utilizes a first leadframe having a first surface and a second leadframe having a second surface that are relatively positioned such that the second surface is at a higher level than the first surface. The light emitting device package includes a light source, e.g., a light emitting diode die, which is mounted on the first surface of the first leadframe and electrically connected to the second surface of the second leadframe.

摘要翻译： 用于制造封装的发光器件封装和方法利用具有第一表面的第一引线框架和具有相对定位的第二表面的第二引线框架，使得第二表面处于比第一表面更高的水平。 发光器件封装包括光源，例如发光二极管管芯，其安装在第一引线框架的第一表面上并电连接到第二引线框架的第二表面。

公开(公告)号：US20070252163A1

公开(公告)日：2007-11-01

申请号：US11413568

申请日：2006-04-28

申请人： Yew Kuan ,  Siew Pang ,  Ng Chuin ,  Tong Chew ,  Thye Mok

发明人： Yew Kuan ,  Siew Pang ,  Ng Chuin ,  Tong Chew ,  Thye Mok

IPC分类号： H01L33/00 ,  H01L29/22

CPC分类号： F21K9/68 ,  F21K9/69 ,  F21V5/008 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L33/58

摘要： A light source that has improved light mixing. The light source uses a nanolens layer in conjunction with an LED light source to enhance the mixing of the colored light emitting from the LED light source.

摘要翻译： 具有改善的光混合的光源。 光源与LED光源一起使用纳米层以增强从LED光源发出的着色光的混合。

公开(公告)号：US20060192125A1

公开(公告)日：2006-08-31

申请号：US11069315

申请日：2005-02-28

申请人： Sundar Yoganandan ,  Fakhrul Mohd. Afif ,  Klan Lee ,  Slew Pang ,  Kheng Tan ,  Yew Kuan ,  Su Oon ,  Wen Ou ,  Norfidathul Abdul Karim ,  Thye Mok

发明人： Sundar Yoganandan ,  Fakhrul Mohd. Afif ,  Klan Lee ,  Slew Pang ,  Kheng Tan ,  Yew Kuan ,  Su Oon ,  Wen Ou ,  Norfidathul Abdul Karim ,  Thye Mok

IPC分类号： G01J1/42

CPC分类号： H05B33/0869 ,  F21K9/00 ,  G01J3/10 ,  G01J2001/4252 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15156 ,  H05B33/0821 ,  H01L2924/00014

摘要： A light source is disclosed. The light source has a light-emitting chip that includes an LED that generates light in an active region thereof. The LED emits a light signal in a forward direction, and infrared radiation generated in the active region is emitted in a side direction in the form of a first infrared signal. The first light signal is determined by a first drive signal coupled to the LED. The light source also includes an infrared detector positioned to collect a portion of the infrared signal. The infrared detector generates a heat signal indicative of the amount of infrared radiation detected. A controller generates the drive signal so as to maintain the heat signal at a first target value. In light sources having LEDs that emit in different spectral ranges, the infrared detectors can all detect heat in the same spectral range.

摘要翻译： 公开了一种光源。 光源具有发光芯片，其包括在其有源区域中产生光的LED。 LED沿正向发射光信号，并且在有源区域中产生的红外辐射以第一红外信号的形式在侧向发射。 第一光信号由耦合到LED的第一驱动信号确定。 光源还包括定位成收集红外信号的一部分的红外检测器。 红外检测器产生指示所检测到的红外辐射量的热信号。 控制器产生驱动信号，以将热信号保持在第一目标值。 在具有在不同光谱范围内发射的LED的光源中，红外检测器都可以在相同光谱范围内检测热量。

公开(公告)号：US20060092644A1

公开(公告)日：2006-05-04

申请号：US10975823

申请日：2004-10-28

申请人： Thye Mok ,  Meng Lee ,  Chien Lye ,  Kheng Tan

发明人： Thye Mok ,  Meng Lee ,  Chien Lye ,  Kheng Tan

IPC分类号： F21V5/00

CPC分类号： H01L33/60 ,  H01L33/50 ,  H01L33/54

摘要： Disclosed are systems and methods which provide an illuminator configuration in which an optical element is provided integral with a reflector component. Embodiments provide an LED encapsulation optical element having a boundary with a surrounding medium, such as air, which avoids or minimizes total internal reflection phenomena. Such an LED encapsulation optical element is formed integral with a reflector component in order to ensure proper relative placement of the LED light source, optical element, and reflector component and/or to facilitate rapid and predictable mechanical assembly of an illuminator. Plated through holes may be disposed in a substrate beneath the LED light source to dissipate heat from the LED light source, prolonging the life of the LED light source and/or the encapsulation material.

摘要翻译： 公开了提供照明器配置的系统和方法，其中光学元件与反射器部件一体地设置。 实施例提供了一种与周围介质（例如空气）具有边界的LED封装光学元件，其避免或最小化全内反射现象。 这种LED封装光学元件与反射器部件形成一体，以便确保LED光源，光学元件和反射器部件的适当的相对放置和/或促进照明器的快速和可预测的机械组装。 电镀通孔可以设置在LED光源下面的衬底中以散发来自LED光源的热量，延长LED光源和/或封装材料的寿命。

公开(公告)号：US20060086946A1

公开(公告)日：2006-04-27

申请号：US10971626

申请日：2004-10-22

申请人： Elizabeth Fung ,  Thye Mok ,  Hong Yeoh ,  Yew Kuan ,  Fakhrul Afif ,  Norfidathul Karim ,  Kian Lee ,  Hui Koay

发明人： Elizabeth Fung ,  Thye Mok ,  Hong Yeoh ,  Yew Kuan ,  Fakhrul Afif ,  Norfidathul Karim ,  Kian Lee ,  Hui Koay

IPC分类号： H01L29/08

CPC分类号： H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In one embodiment, light emitted by a plurality of solid-state light emitters is mixed by mounting the plurality of solid-state light emitters on a transparent to translucent substrate so that they primarily emit light away from the substrate. The light emitters are then covered with a transparent to translucent encapsulant; and the encapsulant is coated with a reflective material that reflects light emitted by the light emitters toward the substrate. Related apparatus is also disclosed.

摘要翻译： 在一个实施例中，通过将多个固态发光体安装在透明至半透明的基板上，使得它们主要从基板发射光，由多个固态发光体发射的光进行混合。 然后用透明至半透明的密封剂覆盖发光体; 并且所述密封剂涂覆有将由所述发光体发射的光朝向所述基板反射的反射材料。 还公开了相关装置。

公开(公告)号：US20070252268A1

公开(公告)日：2007-11-01

申请号：US11395303

申请日：2006-03-31

申请人： Tong Chew ,  Siew Pang ,  Sundar Yoganandan ,  Yew Kuan ,  Thye Mok

发明人： Tong Chew ,  Siew Pang ,  Sundar Yoganandan ,  Yew Kuan ,  Thye Mok

IPC分类号： H01L23/34

CPC分类号： H01L33/648 ,  H01L23/473 ,  H01L23/4985 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00

摘要： A thermally controllable substrate is disclosed. The substrate supports a heat generating source. One of more microchannels are embedded within the substrate and preferably circulate a cooling fluid to dissipate heat being generated by the source. The flow of the cooling fluid serves to remove heat entering the substrate proximate the source providing for the use of enhanced electrical devices which generate more heat in their normal operation.

摘要翻译： 公开了一种热可控衬底。 基板支撑发热源。 更多的微通道中的一个嵌入在基底内，并且优选地循环冷却流体以散发由源产生的热量。 冷却流体的流动用于去除靠近源的进入基板的热量，从而提供在其正常操作中产生更多热量的增强型电气设备的使用。

公开(公告)号：US20070235496A1

公开(公告)日：2007-10-11

申请号：US11399812

申请日：2006-04-07

申请人： Sundar A/L Yoganandan ,  Thye Mok

发明人： Sundar A/L Yoganandan ,  Thye Mok

IPC分类号： B23K5/00 ,  B23K1/00

CPC分类号： H05K13/0482

摘要： The invention relates to a system and method for simultaneously transferring multiple components using multi-orifice collets with a pick-and-place apparatus. Multiple electronic components, such as light emitting diodes can be picked and place simultaneously while maintaining the spacing and orientation of the components found in the original location.

摘要翻译： 本发明涉及一种使用拾取和放置装置的多口筒夹同时传送多个部件的系统和方法。 多个电子部件，例如发光二极管可以被拾取并且同时放置，同时保持原始位置中发现的部件的间隔和取向。

公开(公告)号：US20060268551A1

公开(公告)日：2006-11-30

申请号：US11140865

申请日：2005-05-31

申请人： Thye Mok ,  Sundar Yoganandan ,  Ju Poh ,  Siew Pang

发明人： Thye Mok ,  Sundar Yoganandan ,  Ju Poh ,  Siew Pang

IPC分类号： F21V29/00

CPC分类号： G02B6/0073 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H05K1/0209 ,  H05K1/189 ,  H05K2201/09781 ,  H05K2201/10106

摘要： A light source having light emitting modules coupled to a flexible circuit carrier. The flexible circuit carrier includes a sheet of flexible material having electrically conducting traces connecting a circuit mounting area and a connector region. The light emitting modules are electrically connected to the circuit mounting area. In one embodiment, the light emitting modules are arranged in a linear array. The light source preferably includes a light pipe having a planar layer of transparent material, the light emitting modules being bonded to an edge of the planar layer. The light pipe is preferably attached to a printed circuit board and the connection region of the flexible circuit carrier is attached to the printed circuit board. The flexible circuit carrier can move heat from the light emitting modules to the printed circuit board as well as providing electrical connections.

摘要翻译： 具有耦合到柔性电路载体的发光模块的光源。 柔性电路载体包括具有连接电路安装区域和连接器区域的导电迹线的柔性材料片。 发光模块电连接到电路安装区域。 在一个实施例中，发光模块被布置成线性阵列。 光源优选地包括具有透明材料的平面层的光管，所述发光模块被接合到所述平面层的边缘。 光管优选地附接到印刷电路板，并且柔性电路载体的连接区域附接到印刷电路板。 柔性电路载体可以将热量从发光模块移动到印刷电路板以及提供电连接。

公开(公告)号：US20060202210A1

公开(公告)日：2006-09-14

申请号：US11075094

申请日：2005-03-08

申请人： Thye Mok ,  Siew Tan ,  Shin Ng

发明人： Thye Mok ,  Siew Tan ,  Shin Ng

IPC分类号： H01L21/00 ,  H01L33/00 ,  H01L21/50 ,  H01L29/06

CPC分类号： H01L33/647 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat dissipation pads are used to optimize heat transfer to a metal layer which is then placed in contact with the LCD support structure.

摘要翻译： 公开了通过使用安装在LCD面板支撑结构上的当前PCB封装来增加LED显示器的散热的系统和方法，从而消除了对金属芯PCB的需要。 在一个实施例中，使用具有散热垫的反向安装的LED来优化到金属层的热传递，然后将金属层放置成与LCD支撑结构接触。